32L QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
LQ
39.9716 mg
43.8983 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 4
Package Weight – Site 5
B1: 45.0101 mg
B2: 44.9921 mg
B3: 44.9921mg
Package Weight – Site 6
5X5X0.6 mm
46.7401 mg
B1: 42.0100 mg
B2: 42.0402 mg
B3: 40.9366 mg
N/A
SUMMARY
The QFN 32L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: PT UNISEM Batam
Package Qualification Report # 070307 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ32-PT
UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 1 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Purpose of Use
Base Material
Frame Plating
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ag
Ni
Pd
Au
Silver
Epoxy resin
t-Butyl
Phenylglycidyl
ether
Dicyadiamide
Phenolic
Hardener
Si
Au
Silica Fused
Epoxy Resin1
Phenol Resin
Carbon Black
7440-50-8
7440-21-3
7439-95-4
7440-22-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
2101-60-8
15.6796
0.1187
0.0285
0.0047
0.7370
0.0080
0.0050
0.9619
0.1953
0.0976
% weight of
substance per
Homogeneous
material
99.0500%
0.7500%
0.1800%
0.0300%
98.2600%
1.0700%
0.6700%
73.9900%
15.0200%
7.5100%
461-58-5
Trade Secret
0.0060
0.0393
0.4600%
3.0200%
150
982
0.0150
0.0982
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
2.2600
0.5600
18.0560
0.5781
0.5781
0.0578
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
56540
14010
451721
14463
14463
1446
5.6540
1.4010
45.1721
1.4463
1.4463
0.1446
CAS Number
Package Weight (mg):
Weight by
mg
39.9716
PPM
% weight of
substance per
package
392269
2970
713
119
18437
201
126
24064
4885
2442
39.2269
0.2970
0.0713
0.0119
1.8437
0.0201
0.0126
2.4064
0.4885
0.2442
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 2 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 3 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P3/P4)
Package Qualification Report # 083909 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A.
BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ32Amkor
Philippines
(P3/P4)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 4 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Ag
Ag
Bismaleimide
Methacrylate
Ester
Polymer
Acrylate
Si
Au
Phenol Resin
Epoxy Resin
Carbon Black
Silica Fused
Crystalline
silica
Metal hydro
oxide
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
Trade Secret
28.5383
0.6878
0.0088
0.0351
0.5660
0.0120
0.0020
%weight of
substance per
Homogeneous
material
97.5000
2.3500
0.0300
0.1200
97.5800
2.0700
0.3500
0.3034
0.0111
0.0111
82.0000
3.0000
3.0000
6,491
237
237
0.6491
0.0237
0.0237
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
1333-86-4
60676-86-0
0.0037
0.0407
1.5300
0.3200
1.3203
1.3203
0.0734
9.5355
1.0000
11.0000
100.0000
100.0000
9.0000
9.0000
0.5000
65.0000
79
871
32,734
6,846
28,248
28,248
1,569
204,012
0.0079
0.0871
3.2734
0.6846
2.8248
2.8248
0.1569
20.4012
14808-60-7
0.2934
2.0000
6,277
0.6277
Trade Secret
2.1272
14.5000
45,510
4.5510
CAS Number
Package Weight (mg):
Weight by
mg
46.7401
610,574
14,716
188
751
12,109
257
43
% weight of
substance
per
package
61.0574
1.4716
0.0188
0.0751
1.2109
0.0257
0.0043
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 5 of 18
100.0000
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 6 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 3: CARSEM Malaysia
Package Qualification Report # 072202 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ32CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 7 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Substance
Composition
Cu
Fe
P
Zn
Ni
Pd
Au
Silver
Carbocycllic
Acrylate
Bismaleimide
resin
Acrylate
Additive
Si
Au
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
% weight of
substance per
Homogeneous
material
16.9169
0.3954
0.0035
0.0225
0.2000
0.0174
0.0026
0.4686
0.1320
2101-60-8
461-58-5
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
97.5600%
2.2800%
0.0200%
0.1300%
90.9100%
7.9100%
1.1900%
71.0000%
385,366
9,006
79
514
4,556
396
60
10,675
3,007
% weight
of
substance
per
package
38.5366
0.9006
0.0079
0.0514
0.4556
0.0396
0.0060
1.0675
0.3007
PPM
0.0198
20.0000%
3.0000%
451
0.0451
0.0198
0.0198
1.4800
0.6800
22.0382
0.7056
0.7056
0.0706
3.0000%
3.0000%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
451
451
33,714
15,490
502,030
16,074
16,074
1,607
0.0451
0.0451
3.3714
1.5490
50.2030
1.6074
1.6074
0.1607
43.8983
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 8 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 4: Cypress Manufacturing Limited (CML)
Package Qualification Report # 085002, 092002, 120207 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ32CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 9 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using G7470LA Mold Compound
Material
Lead Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Proprietary
Bismaleimide
Proprietary Polymer
Methacrylate
Acylate ester
Organic Peroxide
Silicon
Gold
Palladium
Silica Fused
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
CAS Number
Weight by
mg
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
17.5533
0.4325
0.0126
0.0216
0.3668
0.0066
0.0066
0.2160
0.0243
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
0.0135
0.0054
0.0054
0.0054
3.6700
2.0295
0.0205
15.5937
0.5286
0.7048
0.7048
0.0881
Package Weight (mg):
42.0100
% weight of
substance per
Homogeneous
material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7400%
1.7400%
80.0000%
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
99.0000%
1.0000%
88.5000%
3.0000%
4.0000%
4.0000%
0.5000%
PPM
% weight of
substance
per package
417,836
10,295
300
515
8,731
157
157
5,142
578
41.7836
1.0295
0.0300
0.0515
0.8731
0.0157
0.0157
0.5142
0.0578
321
129
129
129
87,360
48,310
488
371,190
12,583
16,777
16,777
2,097
0.0321
0.0129
0.0129
0.0129
8.7360
4.8310
0.0488
37.1190
1.2583
1.6777
1.6777
0.2097
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 10 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using CEL9220HF13 Mold Compound
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Silicon
Trade Secret
Gold
Palladium
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Others
17.5373
0.5469
0.1185
0.0273
0.3764
0.0068
0.0068
0.2160
% weight of
substance
per
Homogeneo
us material
96.2000
3.0000
0.6500
0.1500
96.5200
1.7400
1.7400
80.0000
417,157
13,009
2,819
650
8,954
161
161
5,138
% weight
of
substanc
e per
package
41.7157
1.3009
0.2819
0.0650
0.8954
0.0161
0.0161
0.5138
0.0243
9.0000
578
0.0578
0.0135
0.0054
0.0054
5.000
2.0000
2.0000
321
128
128
0.0321
0.0128
0.0128
0.0054
3.6700
2.0000
100.0000
128
87,298
0.0128
8.7298
2.0295
0.0205
15.5127
0.5752
0.4358
0.6101
0.0349
0.2615
99.0000
1.0000
89.0000
3.3000
2.5000
3.5000
0.2000
1.5000
48,275
488
368,999
13,682
10,365
14,511
829
6,219
4.8275
0.0488
36.8999
1.3682
1.0365
1.4511
0.0829
0.6219
% Total:
100.0000
Weight by
mg
PPM
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
Package Weight (mg):
42.0402
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 11 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Wire
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Substance
Composition
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
CAS Number
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Silicon
Trade Secret
Copper
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Others
7440-50-8
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
17.5300
0.5500
0.1200
0.0300
0.3700
0.0100
0.0100
0.2100
% weight of
substance per
Homogeneous
material
96.1602%
3.0170%
0.6583%
0.1646%
94.8718%
2.5641%
2.5641%
77.7778%
428,223
13,435
2,931
733
9,038
244
244
5,130
42.8223%
1.3435%
0.2931%
0.0733%
0.9038%
0.0244%
0.0244%
0.5130%
0.0200
7.4074%
489
0.0489%
0.0100
0.0100
0.0100
3.7037%
3.7037%
3.7037%
244
244
244
0.0244%
0.0244%
0.0244%
0.0100
3.6700
3.7037%
100.0000%
244
89,651
0.0244%
8.9651%
0.9466
15.5100
0.5800
0.4400
0.6100
0.0300
0.2600
100.0000%
88.9845%
3.3276%
2.5244%
3.4997%
0.1721%
1.4917%
23,124
378,879
14,168
10,748
14,901
733
6,351
2.3124%
37.8879%
1.4168%
1.0748%
1.4901%
0.0733%
0.6351%
Weight by
mg
PPM
% weight of
substance
per package
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
Package Weight (mg):
40.9366
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 12 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 112104, 114401 / 120604 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ32ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 13 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold Wire
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Nickel
Silicon
Magnesium
Copper
Nickel
Palladium
Gold
Silver
Acrylic resin
7440-02-0
7440-21-3
7439-95-4
7440-50-8
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Trade Secret
Gold
Ion Impurities
Epoxy resin A
Epoxy resin B
Phenol resin
Carbon Black
Silica Fused
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
0.6582
0.1426
0.0329
21.1063
0.5334
0.0206
0.0060
0.8400
0.0900
% weight of
substance per
Homogeneous
material
3.0000
0.6500
0.1500
96.2000
95.2500
3.6800
1.0700
70.0000
7.5000
0.1110
Weight by
mg
PPM
% weight of
substance
per package
14,623
3,168
731
468,924
11,851
458
133
18,663
2,000
1.4623
0.3168
0.0731
46.8924
1.1851
0.0458
0.0133
1.8663
0.2000
9.2500
2,466
0.2466
0.0420
0.0900
0.0120
0.0150
1.9000
3.5000
7.5000
1.0000
1.2500
100.0000
933
2,000
267
333
42,213
0.0933
0.2000
0.0267
0.0333
4.2213
0.2000
0.0000
0.8645
0.5763
1.2679
0.0961
16.4053
99.9900
0.0100
4.5000
3.0000
6.6000
0.5000
85.4000
4,443
0
19,206
12,804
28,168
2,134
364,482
0.4443
0.0000
1.9206
1.2804
2.8168
0.2134
36.4482
45.0101
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 14 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper -Palladium Wire
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Nickel
Silicon
Magnesium
Copper
Nickel
Palladium
Gold
Silver
Acrylic resin
7440-02-0
7440-21-3
7439-95-4
7440-50-8
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Trade Secret
Copper
Palladium
Epoxy resin A
Epoxy resin B
Phenol resin
Carbon Black
Silica Fused
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
0.7170
0.1554
0.0359
22.9918
0.5294
0.0205
0.0059
0.2940
0.0315
3.0000
0.6500
0.1500
96.2000
95.2500
3.6800
1.0700
70.0000
7.5000
15,936
3,453
797
511,023
11,766
455
132
6,535
700
% weight
of
substance
per
package
1.5936
0.3453
0.0797
51.1023
1.1766
0.0455
0.0132
0.6535
0.0700
0.0389
9.2500
863
0.0863
0.0147
0.0315
0.0042
0.0053
1.5260
3.5000
7.5000
1.0000
1.2500
100.0000
327
700
93
117
33,917
0.0327
0.0700
0.0093
0.0117
3.3917
0.1362
0.0038
0.8303
0.5535
1.2177
0.0923
15.7563
97.3000
2.7000
4.5000
3.0000
6.6000
0.5000
85.4000
3,028
84
18,453
12,302
27,065
2,050
350,204
0.3028
0.0084
1.8453
1.2302
2.7065
0.2050
35.0204
Weight by
mg
44.9921
% weight of
substance per
Homogeneous
material
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 15 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Wire
Material
Purpose of Use
Leadframe
Base Material
Lead Finish
External Plating
Substance
Composition
0.7170
0.1554
0.0359
22.9918
0.5294
0.0205
0.0059
0.2940
0.0315
3.0000
0.6500
0.1500
96.2000
95.2500
3.6800
1.0700
70.0000
7.5000
15,936
3,453
797
511,023
11,766
455
132
6,535
700
% weight
of
substance
per
package
1.5936
0.3453
0.0797
51.1023
1.1766
0.0455
0.0132
0.6535
0.0700
0.0389
9.2500
863
0.0863
Trade Secret
Trade Secret
Trade Secret
7440-21-3
0.0147
0.0315
0.0042
0.0053
1.5260
3.5000
7.5000
1.0000
1.2500
100.0000
327
700
93
117
33,917
0.0327
0.0700
0.0093
0.0117
3.3917
0.1400
100.0000
3,112
0.3112
0.8303
0.5535
1.2177
0.0923
15.7563
4.5000
3.0000
6.6000
0.5000
85.4000
18,453
12,302
27,065
2,050
350,204
1.8453
1.2302
2.7065
0.2050
35.0204
CAS Number
Nickel
Silicon
Magnesium
Copper
Nickel
Palladium
Gold
Silver
Acrylic resin
7440-02-0
7440-21-3
7439-95-4
7440-50-8
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Die
Circuit
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Wire
Interconnect
Copper
7440-50-8
Encapsulation
Epoxy resin A
Epoxy resin B
Phenol resin
Carbon Black
Silica Fused
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Die Attach
Mold
Compound
Adhesive
Trade Secret
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
material
44.9921
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 16 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-16544
**
*A
ECN No. Orig. of
Change
1191046 EBZ
2611863 DPT
*B
2668368 EBZ
*C
*D
2703184 HLR
2704171 HLR
*E
2862441 MAHA
*F
3264886 VFR
*G
3453554 VFR
*H
3533023 COPI
*I
3602037 VFR
*J
3999400 HLR
Description of Change
Initial spec release.
Add Amkor Phil (P3) for 32QFN (LQ32). Change distribution from
CML to WEB. Add Carsem Malaysia (CA) as additional site for
32QFN (LQ32) package
Changed the reference package qualification report number for
assembly site 3 from 082109 to 072202.
Added Assembly site 4. QTP No. 085002.
Added Assembly Site 5. QTP No. 092002 – CEL9220HF13 Mold
Compound.
Corrected the following for the lead frame of assembly site 5:
1. Material composition and CAS numbers
2. Weight by mg
3. % weight of substance per Homogeneous material
4. PPM
5. % weight of substance per package
Corrected the following for the lead finish of assembly site 5:
1. Weight by mg
2. PPM
3. % weight of substance per package
Added PMDD for Assembly Site 6, ASE-G. Reference QTP #
112104.
Added PMDD for Assembly Site 7. Reference QTP # 114401 –
ASEK Copper wire qualification.
Added PMDD for Assembly Site 8. Reference QTP # 120207 –
Autoline RA Copper wire qualification.
Added Table B2 for Site 7 PMDD with reference QTP # 120604 –
ASEK Pure Cu Wire qualification.
Updated material composition table of Assembly Sites 1 to 6 to
reflect 4 decimal places on values
Removed Tube material on Indirect Materials table.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 17 of 18
32L – QFN 5X5X0.6 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
32L - QFN 5X5X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-16544
*K
ECN No. Orig. of
Change
4052508 YUM
*L
5320102 HLR
MQJ
Description of Change
Added assembly site name in the assembly heading in site 1, 2, 3,
4 and 5.
Changed assembly code to assembly site name in site site 1, 2, 3,
4 and 5.
Consolidate material composition in one assembly site.
1. CML
2.ASET
Changed Cypress Logo.
Changed the substances with “------------- “and Proprietary to
“Trade Secret".
Removed Distribution: WEB and Posting: None in the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-16544 Rev. *L
Page 18 of 18
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