092002:32-LEAD - SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.6MM) NIPDAU, MSL3, 260C REFLOW CML-RA

Document No.001-61138 Rev. *C
ECN # 4775775
Cypress Semiconductor
Package Qualification Report
QTP# 092002 VERSION*C
May, 2015
32-Lead - Saw QFN (Quad Flat No-Lead)
(5 x 5 x 0.6mm)
NiPdAu, MSL3, 260C Reflow
CML-RA
FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Josephine Pineda (JYF)
Reliability Engineer
Reviewed By:
Rene Rodgers (RT)
Reliability Manager
Approved By:
Don Darling (DCDA)
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-61138 Rev. *C
ECN # 4775775
PACKAGE QUALIFICATION HISTORY
QTP
Number
092002
DESCRIPTION OF QUALIFICATION PURPOSE
Qualify 32-Lead Saw -QFN (5 x 5 x 0.6mm), Preplated NiPdAu, using EMC Hitachi
CEL9220HF13 Mold Compound, QMI509 Epoxy, MSL3, 260C Reflow assembled at
CML-RA
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Date
May 09
Document No.001-61138 Rev. *C
ECN # 4775775
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
Mold Compound Name/Manufacturer:
Mold Compound Flammability Rating:
LQ32
32-Lead Saw Quad Flat No Lead (QFN)
Hitachi CEL 9220HF13
V-O per UL94
Oxygen Rating Index:
None
Lead Frame Material:
C190
NiPdAu
Lead
Finish,
Composition
Thickness:
Die Backside Preparation
Method/Metallization:
/
Grinding
Die Separation Method:
Blade Sawing
Die Attach Supplier:
Dexter
Die Attach Material:
QMI509
Die Attach Method:
Epoxy
Bond Diagram Designation
001-25899
Wire Bond Method:
Thermosonic
Wire Material/Size:
AuPd/0.8mil
Thermal Resistance Theta JA °C/W:
22 C/W
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
11-20029
Name/Location of Assembly (prime)
facility:
CML-RA
MSL Level
3
Reflow Profile
260C
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-RA
Note: Please contact a Cypress Representative for other packages availability.
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-61138 Rev. *C
ECN # 4775775
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Ball Shear
J-STD-020
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
JESD22-B116
Bond Pull
MIL-STD-883 – Method 2011
Acoustics Microscopy
Constructional Analysis
Die Shear
Dye Penetration
Criteria: Meet external and internal characteristics of a
package
MIL-STD-883, Method 2019
Per die size:

<3000 sq. mils = 1.2 kgf

30001-5000 sq. mils = 1.2 kgf

>5001 sq. mils = 1.2 kgf
Test to determine the existence and extent of cracks,
Criteria: No Package Crack
Result
P/F
P
P
P
P
P
P
External Visual
JESD22-B101
P
High Accelerated Saturation Test
(HAST)
JEDEC STD 22-A110: 130°C, 85% RH, 5.25V
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Pressure Cooker Test
Solderability, Steam Aged
Temperature Cycle
Thermal Shock
X-ray
JESD22-A102: 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
J-STD-002, JESD22-B102
95% solder coverage minimum
MIL-STD-883, Method 1010, Condition C, -65°C to 150°C
Precondition: JESD22 Moisture Sensitivity Level
(192 Hrs., 30 C, 60% RH, 260C Reflow)
MIL-STD-883, Method 1011, Condition B, -55C to 125C
and JESD22-A106, Condition C, -55C to 125C
MIL-STD-883 2012
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 7
P
P
P
P
P
Document No.001-61138 Rev. *C
ECN # 4775775
Reliability Test Data
QTP #:
Device
Mechanism
092002
Fab Lot #
Assy Lot #
Assy Loc Duration Samp
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
COMP
15
0
CY8C21434 (8C21434AC)
4846546
610904297TV2 CML-RA
COMP
15
0
CY8C21434 (8C21434AC)
4846546
610904297TV3 CML-RA
COMP
15
0
4846546
610904297TV1 CML-RA
COMP
10
0
4846546
610904297TV1 CML-RA
COMP
10
0
4846546
610904297TV1 CML-RA
COMP
5
0
4846546
610904297TV1 CML-RA
COMP
15
0
Rej Failure
STRESS: ACOUSTIC, MSL3
STRESS: BALL SHEAR
CY8C21434 (8C21434AC)
STRESS: BOND PULL
CY8C21434 (8C21434AC)
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C21434 (8C21434AC)
STRESS: DIE SHEAR
CY8C21434 (8C21434AC)
STRESS: DYE PENETRANT TEST
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
COMP
15
0
CY8C21434 (8C21434AC)
4846546
610904297TV2 CML-RA
COMP
15
0
CY8C21434 (8C21434AC)
4846546
610904297TV3 CML-RA
COMP
15
0
4846546
610904297TV1 CML-RA
COMP
324
0
STRESS: EXTERNAL VISUAL
CY8C21434 (8C21434AC)
STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
128
75
0
610904297TV1 CML-RA
COMP
30
0
STRESS: PHYSICAL DIMENSION
CY8C21434 (8C21434AC)
4846546
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
168
80
0
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
COMP
5
0
CY8C21434 (8C21434AC)
4846546
610904297TV2 CML-RA
COMP
5
0
CY8C21434 (8C21434AC)
4846546
610904297TV3 CML-RA
COMP
3
0
STRESS: SOLDERABILITY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-61138 Rev. *C
ECN # 4775775
Reliability Test Data
QTP #:
Device
Mechanism
Fab Lot #
Assy Lot #
092002
Assy Loc Duration Samp
Rej Failure
STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
500
80
0
CY8C21434 (8C21434AC)
4846546
610904297TV2 CML-RA
500
80
0
CY8C21434 (8C21434AC)
4846546
610904297TV3 CML-RA
500
80
0
STRESS: THERMAL SHOCK COND. B – 55C TO 125C
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
200
80
0
CY8C21434 (8C21434AC)
4846546
610904297TV1 CML-RA
COMP
15
0
CY8C21434 (8C21434AC)
4846546
610904297TV2 CML-RA
COMP
15
0
STRESS: X-RAY
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-61138 Rev. *C
ECN # 4775775
Document History Page
Document Title:
092002: 32-LEAD - SAW QFN (QUAD FLAT NO-LEAD) (5 X 5 X 0.6MM) NIPDAU, MSL3, 260C
REFLOW CML-RA
001-61138
Document Number:
Rev. ECN
No.
**
2920108
*A
4003017
Orig. of
Change
HGA
JYF
*B
4384761 JYF
*C
4775775 JYF
Description of Change
Initial spec release
Deleted Version 1.0 in QTP title page;
Removed referenced Cypress specs and replaced with industry
standards in Reliability Test Performed Table and deleted “3IR” in
reflow steps of PCT, HAST and TCT.
Sunset review:
Updated QTP title page for template alignment.
Sunset review:
Updated reference for Reliability Director in QTP title page;
Updated Reliability Tests Performed table for template alignment
(Acoustic, Ball Shear, Die Shear, HAST, Bond Pull, Solderability,TCT)
and arranged stresses/tests in alphabetical order for easy reference.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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