Document No.001-70191 Rev. *C ECN # 4450627 Cypress Semiconductor Package Qualification Report QTP# 112104 VERSION*C July, 2014 32 QFN (5x5x0.6 mm) / 36 QFN (5x5x0.6 mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-70191 Rev. *C ECN # 4450627 PACKAGE QUALIFICATION HISTORY QTP Number 112104 Description of Qualification Purpose Qualification of 32/36QFN 5x5x0.6mm package dimensions (LQ32A, LQ32 and LQ36) at ASEKH (G) using G631 mold compound and EN-4900 epoxy Date Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-70191 Rev. *C ECN # 4450627 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LQ32A / LQ32 / LQ36 Package Outline, Type, or Name: 32 Quad Flat No-Lead / 36 Quad Flat No-Lead, 5x5x0.6mm Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69163 /001-69185 /001-69147 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 27 °C/W, 19.4 °C/W, 18.69 °C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 7 Document No.001-70191 Rev. *C ECN # 4450627 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Ball Shear JEDEC STD 22-A110, 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 Pressure Cooker Test Temperature Cycle Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf Result P/F P P P P P P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P Document No.001-70191 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112104 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 15 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 15 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN COMP 15 0 5049009 611120222 G-TAIWAN COMP 10 0 5049009 611120222 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C21434B (8C214345A) STRESS: BOND PULL CY8C21434B (8C214345A) STRESS: CONSTRUCTIONAL ANALYIS CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 5 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 5 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 15 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 15 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN COMP 15 0 5049009 611120222 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR CY8C21434B (8C214345A) STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C21434B (8C214345A) 5049009 611120222 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN 128 79 0 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 5 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 5 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-70191 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112104 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN 168 80 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN 168 80 0 5049009 611120222 G-TAIWAN COMP 30 0 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 3 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 3 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN COMP 3 0 STRESS: PHYSICAL DIMENSION CY8C21434B (8C214345A) STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN 500 80 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN 500 80 0 CY8CTMA340 (8C20322D) 4103513 611119447 G-TAIWAN 500 80 0 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN 200 80 0 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN 1000 80 0 CY8C21434B (8C214345A) 5049009 611120222 G-TAIWAN COMP 15 0 CY8C23533 (8C23533A) 5106122 611120646 G-TAIWAN COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-70191 Rev. *C ECN # 4450627 Document History Page Document Title: QTP 112104: 32 QFN (5X5X0.6 MILS) / 36 QFN (5X5X0.6 MILS), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN 001-70191 Document Number: Rev. ECN No. ** 3283659 *A 3657926 Orig. of Change NSR NSR *B 4061827 JYF *C 4450627 JYF Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.0 in the QTP# in title page. Sunset Review: Deleted revisions of ref. Jedec/Military standards in Reliability Tests Performed table. Revision changes from time to time. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7