Document No. 001-85252 Rev. *A ECN #: 4611795 Cypress Semiconductor Package Qualification Report QTP# 023407 VERSION*A January 2015 8/16-Lead SOIC Package (150mil) Ni/Pd/Au, MSL3 235C & 260C Reflow Cypress Philippines (CML-RA) FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No. 001-85252 Rev. *A ECN #: 4611795 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 023407 8/16-lead (150mil) SOIC package using NITTO MP-8500 Molding Compound, Ni/Pd /Au Leadframe, @ 260C Solder Reflow Peak, MSL1, CML-RA (Autoline) Dec 02 023407 Cypress established policy requiring MSL and Reflow Peak Temperature alignment for Cypress and its Assembly Subcontractors. Sep 06 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No. 001-85252 Rev. *A ECN #: 4611795 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: S1615 16- Plastic Small Outline IC Package (SOIC) NITTO MP-8500 V-O per UL94 Oxygen Rating Index: >28% Lead Frame Material: Copper base with Ni/Pd and Gold Flash Plating Lead Finish, Composition / Thickness: Ni/Pd with Gold Flash Die Backside Preparation Method/Metallization: N/A Die Separation Method: Wafer Saw Die Attach Supplier: Dexter Die Attach Material: QMI 509 Die Attach Method: Silver Epoxy Bond Diagram Designation Not Applicable Wire Bond Method: Thermosonic Wire Material/Size: Gold, 1.0mil Thermal Resistance Theta JA °C/W: 86C/W Package Cross Section Yes/No: N/A Assembly Process Flow: Not Applicable Name/Location of Assembly (prime) facility: Cypress Philippines (CML-R) MSL Level 3 Reflow Profile 235C & 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Cypress Philippines (CML-R) Note: Please contact a Cypress Representative for other packages availability Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No. 001-85252 Rev. *A ECN #: 4611795 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Temperature Cycle Test Condition (Temp/Bias) MIL-STD-883C, Method 1010, Condition C, -65C to 150C Precondition:: JESD22 Moisture Sensitivity MSL 1 Result P/F P 168 Hrs., 85C/85%RH+3IR-Reflow, 260C+0, -5C 121C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity MSL 1 Pressure Cooker P 168 Hrs., 85C/85%RH+3IR-Reflow, 260C+0, -5C High Accelerated Saturation Test (HAST) 130C, 5.5V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 1 P 168 Hrs., 85C/85%RH+3IR-Reflow, 260C+0, -5C Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V MIL-STD-883, Method 3015.7 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V JESD22-C101 P Thermal Shock -55C to +125C MIL-STD-883C, Method 1011 P High Temperature Storage 150C 5C no bias P Ball Shear JESD22-B116A Cpk : 1.33, Ppk : 1.66 P Die Shear MIL-STD-883, Method 2019 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P External Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009 P Internal Visual MIL-STD-883-2014 P Physical Dimensions MIL-STD-1835, JESD22-B100 P X-Ray MIL-STD-883C, Method 2012, P Cypress Spec 12-00292 Solderability Acoustic Microscopy J-STD-002, JESD22-B102 95% solder coverage minimum J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (168 Hrs., 85C, 85% RH) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P Document No. 001-85252 Rev. *A ECN #: 4611795 Reliability Test Data QTP #: Device 023407 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY2292*-SC (7C83300D) 2233327 610242798 CML-RA COMP 15 0 CY2292*-SC (7C83300D) 2235486 610242797 CML-RA COMP 15 0 CY2292*-SC (7C83300D) 2235480 610242799 CML-RA COMP 15 0 2233327 610242798 CML-RA COMP 15 0 2233327 610242798 CML-RA COMP 10 0 2233327 610242798 CML-RA COMP 10 0 2233327 610242798 CML-RA COMP 5 0 2233327 610242798 CML-RA COMP 15 0 2233327 610242798 CML-RA COMP 5 0 2233327 610242798 CML-RA COMP 15 0 2233327 610242798 CML-RA COMP 3 0 Failure Mechanism STRESS: ACOUSTIC, MSL1 STRESS: DIE SHEAR CY2292*-SC (7C83300D) STRESS: BALL SHEAR CY2292*-SC (7C83300D) STRESS: BOND PULL CY2292*-SC (7C83300D) STRESS: PHYSICAL DIMENSIONS CY2292*-SC (7C83300D) STRESS: EXTRNAL VISUAL CY2292*-SC (7C83300D) STRESS: INTERNAL VISUAL CY2292*-SC (7C83300D) STRESS: X-RAY CY2292*-SC (7C83300D) STRESS: SOLDERABILITY CY2292*-SC (7C83300D) STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 500 50 0 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 1000 50 0 STRESS: THERMAL SHOCK, +125C/-55C CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 100 50 0 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 200 50 0 CML-RA COMP 9 0 9 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY2292*-SC (7C83300D) 2233327 610242798 STRESS: ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, 2,200V CY2292*-SC (7C83300D) 2233327 610242798 CML-RA COMP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No. 001-85252 Rev. *A ECN #: 4611795 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 023407 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST. 130C, 5.5V, 85%RH, PRE COND 168 HR 85C/85%RH, MSL 1 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 128 48 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 168 50 0 STRESS: TC COND. C -65C TO 150C, PRE COND 168 HRS 85C/85%RH, MSL1 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 300 50 0 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 500 50 0 CY2292*-SC (7C83300D) 2233327 610242798 CML-RA 1000 50 0 CY2292*-SC (7C83300D) 2235486 610242797 CML-RA 300 50 0 CY2292*-SC (7C83300D) 2235486 610242797 CML-RA 500 50 0 CY2292*-SC (7C83300D) 2235486 610242797 CML-RA 1000 50 0 CY2292*-SC (7C83300D) 2235480 610242799 CML-RA 300 50 0 CY2292*-SC (7C83300D) 2235480 610242799 CML-RA 500 50 0 CY2292*-SC (7C83300D) 2235480 610242799 CML-RA 1000 50 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No. 001-85252 Rev. *A ECN #: 4611795 Document History Page Document Title: Document Number: Rev. ECN No. ** 3839084 *A 4611795 QTP 023407 : 8-16 SOIC, MSL3, 235C, 260C, NIPDAU, CML-RA 001-85252 Orig. of Change HLR HSTO Description of Change Initial Spec Release. Align qualification report based on the new template in the front page Update the test conditions and reference standards/criteria for ESDCDM, Thermal Shock, Ball Shear, Bond Pull, External Visual, Internal Visual, Physical Dimensions, X-Ray, and Solderability Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7