68L - QFN 8X8X1.0MM (SAW VERSION) PB-FREE Package Material Declaration Datasheet.pdf

68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
LT
182.4898 mg
167.1409 mg
Body Size (mil/mm)
Package Weight – Site 2
Package Weight – Site 4
Package Weight – Site 5
B1: 170.0300 mg
B2: 174.9565 mg
B3: 181.4625 mg
Package Weight – Site 6
8.0X8.0X1.0mm
192.0681 mg
B1: 179.3670 mg
B2: 179.2000 mg
B3. 177.6643 mg
B4. 177.3193 mg
B5. 179.4390 mg
B6: 166.9125 mg
N/A
SUMMARY
The QFN 68L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: PT UNISEM Batam
Package Qualification Report # 072603 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT68-PT
UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 1 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Base Material
72.4900
0.5500
0.1300
3.4000
0.0400
0.0200
0.0200
2.0919
0.4185
0.2093
461-58-5
620-92-8
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0140
0.0561
7.6100
2.3400
87.2347
2.7930
2.7930
0.2793
0.5000%
2.0100%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
Package Weight (mg):
182.4898
Cu
Si
Mg
Ni
Leadframe
External
Plating
Die Attach
7440-50-8
7440-21-3
7439-95-4
7440-50-8
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
3101-60-8
% weight of
substance per
Homogeneous
material
99.0700%
0.7500%
0.1800%
97.7000%
1.1500%
0.5700%
0.5700%
75.0000%
15.0000%
7.5000%
Substance
Composition
Adhesive
Die
Wire
Circuit
Interconnect
Mold Compound
Encapsulation
Pd
Au
Ag
Silver
Epoxy resin
t-Butyl
Phenylglycidyl
ether
Dicyadiamide
Hardener
Si
Au
Silica Fused
Epoxy Resin1
Phenol Resin
Carbon Black
CAS
Number
Weight by
mg
PPM
% weight of
substance
per package
397228
3014
712
18631
219
110
110
11463
2293
1147
39.7228
0.3014
0.0712
1.8631
0.0219
0.0110
0.0110
1.1463
0.2293
0.1147
76
307
41701
12823
478025
15305
15305
1530
0.0076
0.0307
4.1701
1.2823
47.8025
1.5305
1.5305
0.1530
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 2 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Shanghai
Package Qualification Report # 084005 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT68ASE Shanghai
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 3 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Base Material
Leadframe
Cu
Fe
Zn
P
Ni
External Plating
Die Attach
Substance
Composition
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Pd
Au
Ag
Silver
Acrylic resin
Epoxy resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Si
Au
Pd
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
CAS Number
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
72.8715
1.7414
0.1121
0.0224
0.9100
0.0400
0.0200
0.0100
0.7546
0.0784
0.0245
0.0490
% weight of
substance per
Homogeneous
material
97.5000%
2.3300%
0.1500%
0.0300%
92.8600%
4.0800%
2.0400%
1.0200%
77.0000%
8.0000%
2.5000%
5.0000%
0.0098
0.0490
0.0049
0.0098
7.6800
1.0395
0.0105
90.4244
8.3590
7.3248
0.5224
Weight by
mg
379,404
9,067
584
117
4,738
208
104
52
3,929
408
128
255
% weight of
substance
per
package
37.9404
0.9067
0.0584
0.0117
0.4738
0.0208
0.0104
0.0052
0.3929
0.0408
0.0128
0.0255
1.0000%
51
0.0051
5.0000%
0.5000%
1.0000%
100.0000%
99.0000%
1.0000%
84.8100%
7.8400%
6.8700%
0.4900%
255
26
51
39,986
5,412
55
470,793
43,521
38,136
2,720
0.0255
0.0026
0.0051
3.9986
0.5412
0.0055
47.0793
4.3521
3.8136
0.2720
192.0680
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 4 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 3: CARSEM Malaysia
Package Qualification Report # 101401 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT68CARSEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 5 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Base Material
Leadframe
Cu
Fe
P
Zn
Ni
External Plating
Die Attach
Substance
Composition
Purpose of Use
Adhesive
Die
Wire
Silicon Chip
Interconnect
Mold
Compound
Encapsulation
Pd
Au
Ag
Silver
Bismaleimide
resin
Carbocycllic
Acrylate
Acrylate
Additive
Si
Au
Silica Fused
Epoxy Resin1
Phenol Resin
Carbon Black
CAS Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-50-8
7440-05-3
7440-57-5
7440-22-4
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
Weight by
mg
% weight of
substance per
Homogeneous
material
62.8280
1.4219
0.0129
0.0579
0.5602
0.0100
0.0200
0.0100
0.3195
0.0135
97.6500%
2.2100%
0.0200%
0.0900%
93.3600%
1.6700%
3.3300%
1.6700%
71.0000%
375898
8507
77
346
3352
60
120
60
1912
81
% weight
of
substance
per
package
37.5898
0.8507
0.0077
0.0346
0.3352
0.0060
0.0120
0.0060
0.1912
0.0081
PPM
0.0900
3.0000%
20.0000%
538
0.0538
0.0135
0.0135
1.3300
2.4600
91.8073
2.9394
2.9394
0.2939
3.0000%
3.0000%
100.0000%
100.0000%
93.7000%
3.0000%
3.0000%
0.3000%
81
81
7957
14718
549281
17586
17586
1759
0.0081
0.0081
0.7957
1.4718
54.9281
1.7586
1.7586
0.1759
100.0000
167.1409
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Material
Tape & Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 6 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 4: Cypress Manufacturing Limited (CML)
Package Qualification Report # 100401, 114407, 120206,133308, 124702, 141201,
(See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT68CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 7 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING GOLD WIRE AND NITTO MOLD COMPOUND
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic Acrylate
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Gold
Palladium
SiO2
Crystalline Silica
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
CAS
Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
14808-60-7
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
74.3345
1.8315
0.0534
0.0916
1.1476
0.0207
0.0207
0.7866
0.2126
% weight of
substance
per
Homogeneo
us material
97.4100%
2.4000%
0.0700%
0.1200%
96.5200%
1.7370%
1.7430%
74.0000%
20.0000%
414,427
10,211
298
511
6,398
115
116
4,386
1,185
41.4427%
1.0211%
0.0298%
0.0511%
0.6398%
0.0115%
0.0116%
0.4386%
0.1185%
0.0213
0.0213
0.0213
14.8850
3.1314
0.0316
69.1013
4.1378
2.4827
3.3102
3.3102
0.4138
2.0000%
2.0000%
2.0000%
100.0000%
99.0000%
1.0000%
83.5000%
5.0000%
3.0000%
4.0000%
4.0000%
0.5000%
119
119
119
82,986
17,458
176
385,251
23,069
13,841
18,455
18,455
2,307
0.0119%
0.0119%
0.0119%
8.2986%
1.7458%
0.0176%
38.5251%
2.3069%
1.3841%
1.8455%
1.8455%
0.2307%
% Total:
100.0000
Weight by
mg
179.3671
PPM
% weight of
substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 8 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING GOLD WIRE AND SUMITOMO MOLD COMPOUND
Material
Lead
Frame
Lead
Finish
Die Attach
Purpose of
Use
Base material
External
Plating
Adhesive
Substance
Composition
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
% weight of
substance per
Homogeneous
material
PPM
% weight of
substance
per package
Copper
7440-50-8
74.3354
97.4100%
414,818
41.4818%
Iron
7439-89-6
1.8315
2.4000%
10,220
1.0220%
Phosphorous
7723-14-0
0.0534
0.0700%
298
0.0298%
Zinc
7440-66-6
0.0916
0.1200%
511
0.0511%
Nickel
7440-02-0
1.1468
96.5200%
6,400
0.6400%
Palladium
7440-05-3
0.0206
1.7370%
115
0.0115%
Gold
7440-57-5
0.0207
1.7430%
116
0.0116%
Ag
Carbocyclic
Acrylate
Bismaleimide
Resin
Additive
7440-22-4
1.0642
74.0000%
5,939
0.5939%
Trade Secret
0.2876
20.0000%
1,605
0.1605%
Trade Secret
0.0288
2.0000%
161
0.0161%
Trade Secret
0.0288
2.0000%
161
0.0161%
Acrylate ester
Die
CAS Number
Weight by
mg
Trade Secret
0.0288
2.0000%
161
0.0161%
Silicon
7440-21-3
20.1341
100.0000%
112,356
11.2356%
Gold
7440-57-5
3.3260
99.0000%
18,560
1.8560%
Palladium
7440-05-3
0.0336
1.0000%
187
0.0187%
SiO2
60676-86-0
67.3640
87.7500%
375,915
37.5915%
Phenol Resin
Trade Secret
3.8384
5.0000%
21,420
2.1420%
Epoxy Resin
Trade Secret
5.3738
7.0000%
29,988
2.9988%
1333-86-4
0.1919
0.2500%
1,071
0.1071%
% Total:
100.0000%
Carbon Black
Package Weight (mg):
179.2000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 9 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
USING COPPER WIRE AND NITTO MOLD COMPOUND
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Phosphorous
Zinc
Nickel
Palladium
Gold
Ag
Carbocyclic Acrylate
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Copper
SiO2
Crystalline Silica
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
CAS
Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
60676-86-0
14808-60-7
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
74.3345
1.8315
0.0534
0.0916
1.1476
0.0207
0.0207
0.7866
0.2126
% weight of
substance
per
Homogeneo
us material
97.4099%
2.4000%
0.0700%
0.1200%
96.5181%
1.7410%
1.7410%
73.9912%
19.9981%
418,399
10,309
301
516
6,459
117
117
4,427
1,197
41.8399%
1.0309%
0.0301%
0.0516%
0.6459%
0.0117%
0.0117%
0.4427%
0.1197%
0.0213
0.0213
0.0213
14.885
1.4602
69.1013
4.1378
2.4827
3.3102
3.3102
0.4138
2.0036%
2.0036%
2.0036%
100.0000%
100.0000%
83.5000%
5.0000%
3.0000%
4.0000%
4.0000%
0.5000%
120
120
120
83,782
8,219
388,943
23,290
13,974
18,632
18,632
2,329
0.0120%
0.0120%
0.0120%
8.3782%
0.8219%
38.8943%
2.3290%
1.3974%
1.8632%
1.8632%
0.2329%
% Total:
100.0000
Weight by
mg
177.6643
PPM
% weight of
substance
per package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 10 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B4. MATERIAL COMPOSITION (Note 3)
Using Copper Wire and Sumitomo Mold Compound
Material
Lead
Frame
Lead
Finish
Die Attach
Purpose of
Use
Base material
External
Plating
Adhesive
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogeneous
material
PPM
% weight of
substance
per package
Copper
7440-50-8
74.3354
97.4100%
419,048
41.9048%
Iron
7439-89-6
1.8315
2.4000%
10,325
1.0325%
Phosphorous
7723-14-0
0.0534
0.0700%
301
0.0301%
Zinc
7440-66-6
0.0916
0.1200%
516
0.0516%
Nickel
7440-02-0
1.1468
96.5239%
6,465
0.6465%
Palladium
7440-05-3
0.0206
1.7339%
116
0.0116%
Gold
7440-57-5
0.0207
1.7423%
117
0.0117%
Ag
Carbocyclic
Acrylate
Bismaleimide
Resin
Additive
7440-22-4
1.0642
73.9953%
5,999
0.5999%
0.2876
19.9972%
1,621
0.1621%
Acrylate ester
Trade Secret
Trade Secret
0.0288
2.0025%
162
0.0162%
Trade Secret
0.0288
2.0025%
162
0.0162%
Trade Secret
0.0288
2.0025%
162
0.0162%
Die
Circuit
Silicon
7440-21-3
20.1341
100.0000%
113,501
11.3501%
Wire
Interconnect
Copper
7440-50-8
1.5509
100.0000%
8,743
0.8743%
SiO2
Mold
Compound
Encapsulation
60676-86-0
67.3640
87.7500%
379,748
37.9748%
Phenol Resin
Trade Secret
3.8384
5.0000%
21,638
2.1638%
Epoxy Resin
Trade Secret
5.3738
7.0000%
30,293
3.0293%
Carbon Black
1333-86-4
0.1919
0.2500%
1,082
0.1082%
% Total:
100.0000%
Package Weight (mg):
177.3913
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 11 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B5. MATERIAL COMPOSITION (Note 3)
Using Copper Palladium Wire and Sumitomo Mold Compound
Material
Leadframe
Lead Finish
Purpose of
Use
Base Material
External Plating
Die Attach
Die
Adhesive
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
% weight of
substance per
Homogeneous
7440-50-8
55.0560
97.4100%
306,822
0.3068
Fe
7439-89-6
1.3560
2.4000%
7,560
0.0075
P
7723-14-0
0.0400
0.0700%
220
0.0002
Zn
7440-66-6
0.0680
0.1200%
378
0.0003
Ni
7440-02-0
0.8490
96.5200%
4,734
0.0047
Pd
7440-05-3
0.0150
1.7370%
85
0.0001
Au
7440-57-5
0.0150
1.7430%
85
0.0001
Ag
Carbocyclic
Acrylate
Bismaleimide
Resin
Additive
Acrylate ester
Si
Cu
Pd
SiO2
Phenol Resin
Epoxy Resin
Carbon Black
7440-22-4
1.0970
74.0000%
6,113
0.0061
0.2960
20.0000%
1,652
0.0016
0.0300
0.0300
0.0300
20.7520
2.9010
0.0290
85.0080
4.8440
6.7810
0.2420
2.0000%
2.0000%
2.0000%
100.0000%
99.0000%
1.0000%
87.7500%
5.0000%
7.0000%
0.2500%
165
165
165
115,650
16,169
163
473,738
26,994
37,791
1,350
0.0001
0.0001
0.0001
0.1156
0.0161
0.0001
0.4737
0.0270
0.0377
0.0013
CAS Number
Cu
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Package Weight (mg): 179.4390
PPM
% Total: 100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
%Weight of
Substance
per
package
Weight by
mg
Substance
Composition
Page 12 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B6 MATERIAL COMPOSITION (Note 3)
Using Copper Palladium Wire and Nitto Mold Compound
Material
Leadframe
Lead Finish
Purpose of
Use
Substance
Composition
Base Material
External Plating
Die Attach
Die
Adhesive
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
CAS Number
Weight by
mg
% weight of
substance
per
Homogeneo
us
%Weight of
Substance
per package
PPM
Cu
7440-50-8
53.9175
97.4102%
323,029
32.3029%
Fe
7439-89-6
1.3120
2.3703%
7,860
0.7860%
P
7723-14-0
0.0743
0.1342%
445
0.0445%
Zn
7440-66-6
0.0472
0.0853%
283
0.0283%
Nickel
7440-02-0
0.2584
99.8840%
1,548
0.1548%
Palladium
7440-05-3
0.0002
0.0773%
1
0.0001%
Gold
7440-57-5
0.0001
0.0387%
1
0.0001%
Silver
Carbocyclic
acrylate
Bismaleimide
resin
Acrylate
Additive
Silicon
Copper
Palladium
SiO2
Metal Hydroxide
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline
7440-22-4
0.6420
73.7931%
3,846
0.3846%
Trade Secret
0.1815
20.8621%
1,087
0.1087%
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
0.0180
0.0170
0.0115
16.6843
3.0524
0.0001
81.0200
4.1084
2.6998
2.5452
0.1054
0.2172
2.0690%
1.9540%
1.3218%
100.0000%
99.9967%
0.0033%
89.3314%
4.5299%
2.9768%
2.8063%
0.1162%
0.2395%
108
102
69
99,958
18,287
1
485,404
24,614
16,175
15,249
631
1,301
0.0108%
0.0102%
0.0069%
9.9958%
1.8287%
0.0001%
48.5404%
2.4614%
1.6175%
1.5249%
0.0631%
0.1301%
Package Weight (mg): 166.9125
% Total: 100.0000%
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Material
Tape & Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 13 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 5: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 111816, 114906, 133309, 124301 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LT68ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 14 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING GOLD WIRE
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
Die Attach
External
Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Zinc
Phosphorus
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Gold
Ion Impurities
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
Package Weight (mg):
76.8582
1.8938
0.1184
0.0395
1.0194
0.0476
0.0130
1.4070
0.1508
% weight of
substance per
Homogeneous
material
97.4000%
2.4000%
0.1500%
0.0500%
94.3900%
4.4100%
1.2000%
70.0000%
7.5000%
0.1859
0.0704
0.1508
0.0201
0.0251
7.3000
0.9999
0.0001
3.6000
2.4000
5.2800
0.4000
68.3200
Weight by
(mg)
170.3000
451310
11121
695
232
5986
280
76
8262
885
% weight of
substance
per
package
45.1311%
1.1121%
0.0695%
0.0232%
0.5986%
0.0280%
0.0076%
0.8262%
0.0885%
9.2500%
1092
0.1092%
3.5000%
7.5000%
1.0000%
1.2500%
100.0000%
99.9900%
0.0100%
4.5000%
3.0000%
6.6000%
0.5000%
85.4000%
413
885
118
148
42866
5871
1
21139
14093
31004
2349
401174
0.0413%
0.0885%
0.0118%
0.0148%
4.2866%
0.5871%
0.0001%
2.1139%
1.4093%
3.1004%
0.2349%
40.1174%
PPM
% Total: 100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 15 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper Wire
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
Die Attach
External
Plating
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Copper
Iron
Zinc
Phosphorus
Nickel
Palladium
Gold
Silver
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Peroxide
Additive
Silicon
Copper
Epoxy Resin A
Epoxy Resin B
Phenol Resin
Carbon Black
Silica Fused
CAS Number
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
91.5593
2.3055
0.1506
0.0847
1.2157
0.0568
0.0155
1.1410
0.1223
0.1508
% weight of
substance per
Homogeneous
material
97.3000%
2.4500%
0.1600%
0.0900%
94.3880%
4.4120%
1.2000%
70.0000%
7.5000%
9.2500%
523,322
13,177
861
484
6,949
325
88
6,522
699
862
% weight of
substance
per
package
52.3322
1.3177
0.0861
0.0484
0.6949
0.0325
0.0088
0.6522
0.0699
0.0862
0.0571
3.5000%
326
0.0326
0.1223
0.0163
0.0204
13.9000
0.4200
2.8629
1.9068
4.1989
0.3181
54.3315
7.5000%
1.0000%
1.2500%
100.0000%
100.0000%
4.5000%
3.0000%
6.6000%
0.5000%
85.4000%
699
93
116
79,447
2,400
16,363
10,909
24,000
1,818
310,540
0.0699
0.0093
0.0116
7.9447
0.2400
1.6363
1.0909
2.4000
0.1818
31.0540
% Total:
100.0000
Weight by
(mg)
Package Weight (mg): 174.9565
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 16 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
B3. MATERIAL COMPOSITION (Note 3)
Using Copper Palladium Wire
Material
Leadframe
Lead
Finish
Purpose of
Use
Base Material
External
Plating
Die Attach
Die
Adhesive
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Copper
7440-50-8
84.0450
% weight of
substance per
Homogeneous
material
97.5000
463,154
46.3154
Iron
7439-89-6
2.0257
2.3500
11,163
1.1163
Phosphorus
7723-14-0
0.0259
0.0300
143
0.0143
Zinc
7440-66-6
0.1034
0.1200
570
0.0570
Tin
7440-31-5
2.8000
100.0000
15,430
1.5430
Silver
7440-22-4
0.9800
75.0000
5,401
0.5401
Acrylic Resin
Polybutadiene
derivative
Butadiene
copolymer
Acrylate
Trade Secret
0.1050
5.5050
579
0.0579
Trade Secret
0.1295
10.0000
714
0.0714
Trade Secret
0.0490
3.0000
270
0.0270
Trade Secret
0.1050
5.5050
579
0.0579
Peroxide
Substance
Composition
CAS Number
Weight by
(mg)
% weight of
substance
per package
PPM
Trade Secret
0.0140
0.9900
77
0.0077
Silicon
7440-21-3
8.5800
100.0000
47,282
4.7282
Copper
7440-50-8
1.1998
99.9800
6,612
0.6612
Palladium
7440-05-3
0.0002
0.0200
1
0.0001
Epoxy Resin
Trade Secret
6.5040
7.0000
35,842
3.5842
Phenol Resin
Trade Secret
4.8780
5.0000
26,882
2.6882
Carbon Black
1333-86-4
0.2439
0.3000
1,344
0.1344
Silica Fused
60676-86-0
69.6741
87.7000
383,959
38.3959
% Total
100.0000
Package Weight (mg): 181.4625
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 17 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Cover tape
Carrier tape
Plastic Reel
Tray
Lead
PPM
<20.0
<5.0
< 5.0
< 5.0
Cadmium
PPM
<20.0
<5.0
< 5.0
< 5.0
Cr VI
PPM
<20.0
<5.0
< 5.0
< 5.0
Mercury
PPM
<20.0
<10.0
< 10.0
< 10.0
PBB
PPM
<20.0
<50.0
<50.0
<50.0
Shielding bag
<2 .0
<2.0
<2.0
<2.0
<5.0
Material
PBDE PPM
<20.0
<45.0
<45.0
<45.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 18 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
68L - QFN 8X8X1.0MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-17657
**
*A
ECN No. Orig. of
Change
1362383 EBZ
2600097 DPT
*B
*C
*D
DCON
3040449 HLR
3113486 MLA
3247365 JARG
*E
3414374 HLR
*F
3485534 CMG
*G
3533023 COPI
*H
3599270 JARG
*I
4052508 YUM
*J
4101977 JVP
*K
*L
4375459 MLA
4370018 AWP
Description of Change
Initial spec release.
Added Assembly site 2 and change package thickness from 0.9 to
1.0mm per POD#001-09618. Update spec title to 68L – QFN
8X8X1.0 mm (Saw Version) PB- Free Package PMDD
Changed CML to WEB in distribution list.
Removed tube type on Indirect Material table.
Add assembly site 3.
Added Assembly Site 4 – CML RA
Change category from Quality Standard to PMDD Category
Updated the material composition table to reflect 4 decimal places
on values.
Added Package Weight Site 4 – B2
Added QTP# 114407 on Assembly Site 4
Added B2 material composition on Assembly Site 4
Added Assembly Site 5 – Autoline RA Copper wire qualification.
Reference QTP # 120206.
Added Assembly Site 6 - ASE Assembled (Assembly Sites 2 and
3) from Spec 001-08151 in reference to QTPs 111816 and 114906
which reflects 8x8x1.0mm package dimension
Updated the material composition table for Assembly Site 6 – B1
to reflect four decimal places on values.
Added assembly site name in the Assembly heading in site 1, 2, 3,
4 and 5.
Changed assembly code to assembly site name in site 1, 2, 3, 4
and 5.
Consolidate material composition in one assembly site.
1. CML
2. ASET
Added Package weight in Assembly Site 4 (B5) and Assembly Site
5 (B3).
Added Section B5 for Copper Palladium and Sumitomo Mold
Compound for Assy Site 4, CML, QTP# 133308.
Added Section B3 for Copper Palladium for Assy Site 5 , ASET)
QTP# 133309
Added QTP 124301 reference to site #5.
Added QTP 124702 & QTP 141201 reference to site #4 for copper
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 19 of 20
68L – QFN 8X8X1.0 mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
68L - QFN 8X8X1.0MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-17657
ECN No. Orig. of
Change
*M
4563328 HLR
*N
5007155 HLR
DCON
Description of Change
palladium wire & Nitto epoxy molding compound materials.
Changed total weight of assembly site 2 from 192.0681 to
192.0680 mg.
Changed total weight of Assembly Site 5.B1 Material Composition
from 170.0300 to 170.3000 mg.
Changed the substances with “------------- and Proprietary “to
“Trade Secret”.
Removed distribution and posting from the document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-17657 Rev. *N
Page 20 of 20
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