68L - QFN 8X8X0.9 MM PB-FREE Package Material Declaration Datasheet.pdf

68L – QFN 8x8x0.9 mm
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LY
169.9648 mg
Body Size (mil/mm)
8x8x0.9 mm
SUMMARY
The 68L-QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY8C24094A-24LFXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 062501 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LY68CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-08151 Rev.*I
Page 1 of 4
68L – QFN 8x8x0.9 mm
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Lead Frame
Lead Finish
Die Attach
Die
Bond/Au Wire
Purpose of Use
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
94.8092
0.0681
2.3359
0.1168
0.1834
0.0033
0.0033
7.6200
0.4400
% weight of
substance per
Homogenous
material
97.4100%
0.0700%
2.4000%
0.1200%
96.5200%
1.7370%
1.7430%
80.0000%
10.0000%
Trade Secret
0.0550
Trade Secret
Trade Secret
Organic peroxide
Si
Au
Pd
Epoxy Resin 1
Epoxy Resin 1
Phenol Resin
SiO2
Substance
Composition
Cu
P
Base Material Fe
Zn
Ni
External Plating Pd
Au
Ag
Proprietary
bismaleimide
Adhesive
Proprietary
polymer
Methacrylate
Acrylate ester
Circuit
Interconnect
Mold Compound
CAS Number
Weight by
mg
PPM
% weight of
substance per
package
557,817
401
13,744
687
1,079
19
19
44,833
2,589
55.7817%
0.0401%
1.3744%
0.0687%
0.1079%
0.0019%
0.0019%
4.4833%
0.2589%
5.0000%
324
0.0324%
0.0275
0.0165
3.0000%
1.0000%
162
97
0.0162%
0.0097%
Trade Secret
7440-21-3
7440-57-5
7440-05-3
Trade Secret
Trade Secret
0.0055
0.0001
3.8907
0.0393
1.5088
1.2070
1.0000%
100.0000%
99.0000%
1.0000%
2.5000%
2.0000%
32
1
22,891
231
8,877
7,101
0.0032%
0.0001%
2.2891%
0.0231%
0.8877%
0.7101%
Trade Secret
60676-86-0
1.5088
53.0477
2.5000%
87.9000%
8,877
312,110
0.8877%
31.2110%
1333-86-4
0.0604
0.1000%
355
0.0355%
Metal Hydroxide
Trade Secret
1.8105
3.0000%
10,652
1.0652%
Others
Trade Secret
1.2070
2.0000%
7,101
0.7101%
Encapsulation Carbon Black
Package Weight (mg): 169.9648
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-08151 Rev.*I
Page 2 of 4
68L – QFN 8x8x0.9 mm
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Lead
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
<20.0
<5.0
< 5.0
< 5.0
Shielding bag
<2 .0
Cr VI
PPM
Mercury
PPM
PBB
PPM
PBDE PPM
<20.0
<5.0
< 5.0
< 5.0
<20.0
<5.0
< 5.0
< 5.0
<20.0
<10.0
< 10.0
< 10.0
<20.0
<50.0
<50.0
<50.0
<20.0
<45.0
<45.0
<45.0
<2.0
<2.0
<2.0
<5.0
<5.0
Cadmium
PPM
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-M
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-08151 Rev.*I
Page 3 of 4
68L – QFN 8x8x0.9 mm
Pb-Free Package
Document History Page
Document Title:
Document Number:
68L - QFN 8X8x0.9 MM PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-08151
Rev ECN No.
.
**
478026
*A
596999
Orig. of
Change
IMZ
IMZ/MR
B
*B
3123971
HLR
New Specification
- Changed Cypress Logo
- Update Epoxy QMI-509,Lead finish composition, and
CEL 9220 HF13 composition mold compound
- Completed the 6 RoHS substances on Declaration of
packaging indirect materials
- Updated the declaration of packaging indirect
materials
Added Note 4 on Footer Section.
3261110
DCON
VFR
Changed CML to WEB in distribution list.
Added LT on the Cypress Package Code portion.
*C
*D
3477117
VFR
*E
3599270
JARG
*F
3855220
HLR
*G
4050691
YUM
*H
*I
4644633
5123002
HLR
HLR
SLLO
Description of Change
Added Assembly Site 2 – ASE Taiwan (G). Reference
QTP # 111816.
Added Assembly Site 3 – ASE Taiwan (G) Copper Wire
qualification. Reference QTP # 114906.
Removed Assembly Sites 2 and 3 – ASE Assembled and
transferred to spec 001-17657 in reference to QTPs
111816 and 114906 which reflects 8x8x1.0mm package
dimension
Updated the material composition table to reflect 4
decimal places on values.
Added assembly site name in the Assembly heading.
Changed Assembly code to Assembly site name.
Sunset Due – No ChangeHLR
Changed the substances with “------------- “to “Trade
Secret
Removed Distribution and Posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-08151 Rev.*I
Page 4 of 4
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