Document No. 001-92809 Rev. ** ECN #: 4400627 Cypress Semiconductor Product Qualification Report QTP# 134904 VERSION ** JUNE 2014 PSoC4A Device Family S8PF-10R, Fab8F UMC CY8C4124 CY8C4125 CY8C4244 CY8C4245 PROGRAMMABLE SYSTEM-ONCHIP (PSOC) PROGRAMMABLE SYSTEM-ONCHIP (PSOC) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 PACKAGE/PRODUCT QUALIFICATION HISTORY QTP Number 114909 124203 134904 Description of Qualification Purpose Qualification of S8P12-10R Technology in UMC Fab Using Gen4 (8C20400DI) Device Qualification of Gen4 device design mask changes using S8P12-10R Technology in UMC Fab Qualification of PSoC4A Device 8C44200, S8PF-10R Technology in UMC (Fab8F) Date May 2013 May 2013 June 2014 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualification of PSoC4A Device 8C44200, S8PF-10R Technology in UMC (Fab8F) Marketing Part #: CY8C4124, CY8C4125, CY8C4244, CY8C4245 Device Description: 1.8V core, Commercial/Industrial Programmable System on a Chip Cypress Division: Cypress Semiconductor Corporation – Programmable Systems Division (PSD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Passivation Type and Thickness: Metal 1: 50A Ti/200A TiN / 3200Al-0.5%Cu/ 50A Ti/300A TiN Metal 2: 50A Ti/200A TiN / 3200Al-0.5%Cu/ 50A Ti/300A TiN Metal 3: 50A Ti/200A TiN / 6500Al-0.5%Cu/ 50A Ti/500A TiN Metal 4: 50A Ti/200A TiN / 6500Al-0.5%Cu/ 50A Ti/500A TiN Metal 5: 50A Ti/200A TiN / 12000Al-0.5%Cu / 50A Ti/500A TiN NFUSOX / Nitride Generic Process Technology/Design Rule (µ-drawn): S8PF-10R Gate Oxide Material/Thickness (MOS): 32A/ 120A Name/Location of Die Fab (prime) Facility: UMC, Fab 8F Die Fab Line ID/Wafer Process ID: UMC/ S8PF-10R ALTERNATIVE FAB FACILITY SITE FAB SITE LOCATION QTP NUMBER CMI Fab 4 MN, USA 123502 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 PACKAGE AVAILABILITY PACKAGE WIRE MATERIAL ASSEMBLY FACILITY SITE QTP NUMBER 44-Lead TQFP Cu ASE-G 123808 44-Lead TQFP CuPd CML-RA 133102 40-Lead QFN Cu ASE-G 130902 40-Lead QFN Cu CML-RA 123807 40-Lead QFN CuPd ASE-G 134515 40-Lead QFN CuPd CML-RA 141702 28-Lead SSOP CuPd JCET-JT 133002 28-Lead SSOP CuPd CML-RA 131804 Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: AZ44A Mold Compound Name/Manufacturer: TQFP 44L (10x10x1.4mm) KE-G3000 / Kyocera Chemicals Mold Compound Flammability Rating: UL-94: V-0 @ 0.8-3.2mm Oxygen Rating Index: 65% Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Thru Die Attach Supplier: Henkel / Hysol Die Attach Material: QMI509 Bond Diagram Designation: 001-87485 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA °C/W: 62.95 °C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001−82703 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: ASE, Taiwan (G), CML-RA, JCET-JT Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F P High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.07V, 48 Hours Early Failure Rate (EFR) JESD22-A-108-B High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.07V, 500 Hours Latent Failure Rate (LFR) JESD22-A-108-B High Temperature Steady State life 150°C, 6.0V, Vcc Max P Low Temperature Operating Life -30°C, 2.07V P Endurance JESD22-A117 P Data Retention JESD22-A117 and JESD22-A103, 150°C, 1000 Hours Temperature Cycle -650C to 1500C, JESD22-A-104, 500 Cycles Precondition: JESD22 Moisture Sensitivity Level 3 P P P 192 Hrs, 30C/60%RH+Reflow, 260°°C+0, -5°C Thermal Shock JEDEC22, Condition B, -55°C to 125°C High Accelerated Saturation Test 130°C, 5.5V, 85%RH, JESD22-A-110-B, 128 Hours Precondition: JESD22 Moisture Sensitivity Level 3 (HAST) P P 192 Hrs, 30C/60%RH+Reflow, 260°°C+0, -5°C Pressure Cooker 121°C/100%RH, JESD22-A102-C, 168 Hours Precondition: JESD22 Moisture Sensitivity Level 3 P 192 Hrs, 30C/60%RH+Reflow, 260°°C+0, -5°C Aged Bond Strength 200C, 4hrs MIL-STD-883, Method 883-2011 P Electrostatic Discharge Human Body Model (ESD-HBM) 2200V/ 3300V, JESD22-A114 P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/ 1000V/ 1250V, JESD22-C101 P Static Latch-up ± 140mA, 125°C/85°C, 2.93V/8.25V, JESD78 P ± 200mA, 85C, 9.1V/3.12V, JESD78 Acoustic (M3) J-STD-020 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 14 P Document No. 001-92809 Rev. ** ECN #: 4400627 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life 1 Early Failure Rate 1, 2 High Temperature Operating Life Long Term Failure Rate* 1 2 3 Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 1,524 Devices 0 N/A N/A 0 PPM 1 276,660 DHRs 0 0.7 170 19 FIT 2 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 1 2 Early Failure Rate was computed from QTPs 134904 Long Term Failure Rate was computed from QTPs 114909, 124203, & 134904 LFR Data. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 114909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA COMP 15 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA COMP 15 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA COMP 15 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA COMP 5 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA COMP 5 0 CML-RA COMP 5 0 STRESS: AGE BOND STRENGTH STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMA443 (8C20401DI) 8229006 611228883 STRESS: DATA RETENTION, PLASTIC, 150C CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 1000 80 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 1500 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 1000 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 1500 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 1000 80 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 168 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 168 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 168 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA COMP 9 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA COMP 9 0 611228883 CML-RA COMP 1 0 STRESS: SEM CROSS SECTION CY8CTMA443 (8C20401DI) 8229006 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 114909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP (85C, 2.93V/8.25V) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA COMP 6 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA COMP 6 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA COMP 8 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA COMP 8 0 CML-RA COMP 3 0 STRESS: DYNAMIC LATCH-UP (125C, 5V-8V) CY8CTMA443 (8C20401DI) 8229006 611228883 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8CTMA443 (8C20401DI) 8240000 611300363 CML-RA 48 1083 0 CY8CTMA443 (8C20401DI) 9303001 611303626N CML-RA 48 999 1 CY8CTMA443 (8C20401DI) 9305012 611304910 CML-RA 48 1000 0 MM4 deformation STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 80 116 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 500 116 0 CY8CTMA443 (8C20401DI) 8234006 611234499 CML-RA 80 129 0 CY8CTMA443 (8C20401DI) 8234006 611234499 CML-RA 500 129 0 CY8CTMA443 (8C20401DI) 8240000 611300363 CML-RA 80 116 0 CY8CTMA443 (8C20401DI) 8240000 611300363 CML-RA 500 116 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 6.0V) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 168 76 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 168 76 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 168 80 0 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.07V CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 500 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 114909 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 128 79 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 256 79 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 128 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 256 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 128 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 256 80 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 168 80 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 288 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 168 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 288 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 168 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 288 80 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8229006 611228883 CML-RA 1000 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8234005 611232480 CML-RA 1000 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 500 80 0 CY8CTMA443 (8C20401DI) 8241011 611239654 CML-RA 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 124203 Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA443 (8C20401DI) 8241011 611239653 CML-RA COMP 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8CTMA443 (8C20401DI) 8241011 611239653 CML-RA COMP 8 0 CML-RA COMP 6 0 STRESS: STATIC LATCH-UP (85C, 2.93V/8.25V) CY8CTMA443 (8C20401DI) 8241011 611239653 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 134904 Device STRESS: Fab Lot # Assy Loc Duration Samp Rej 611409200 CML-RA COMP 15 0 DATA RETENTION, PLASTIC, 150C CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 500 76 0 CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 1000 76 0 CML-RA COMP 9 0 CML-RA COMP 3 0 CML-RA COMP 3 0 8 0 3 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C4245AXI8 (8CP44200CI) 8241011 STRESS: 611409200 ESD-CHARGE DEVICE MODEL, (1000V) CY8C4245AXI8 (8CP44200CI) 8241011 STRESS: Failure Mechanism ACOUSTIC, MSL3 CY8C4245AXI8 (8CP44200CI) 8241011 STRESS: Assy Lot # 611409200 ESD-CHARGE DEVICE MODEL, (1250V) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (3,300V) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.07V, Vcc Max) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 48 1524 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150, 2.07V, Vcc Max) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 80 116 0 CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 500 116 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 168 77 0 CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 288 77 0 CML-RA COMP 6 0 CML-RA COMP 3 0 CML-RA COMP 3 0 STRESS: STATIC LATCH-UP (+/-140mA 85C) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 STRESS: STATIC LATCH-UP (+/-200mA 85C) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 STRESS: STATIC LATCH-UP (+/-140mA 125C) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Reliability Test Data QTP #: 134904 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 500 77 0 CY8C4245AXI8 (8CP44200CI) 8241011 611409200 CML-RA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 14 Document No. 001-92809 Rev. ** ECN #: 4400627 Document History Page Document Title: Document Number: QTP#134904: PSOC4A DEVICE FAMILY S8PF-10R, FAB8F UMC 001-92809 Rev. ECN Orig. of No. Change ** 4400627 HSTO Distribution: WEB Posting: Description of Change Initial Spec Release None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 14