Document No. 001-92842 Rev. *B ECN #: 4624766 Cypress Semiconductor Product Qualification Report QTP# 142304 VERSION *A July 2014 PSoC4 Family S8PF-10R, Fab 3 HHGrace CY8C4013 CY8C4014 Programmable System-on-Chip (PSoC) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Zhaomin Ji Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 PRODUCT QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 090706 Qualification of Capsense (CY8C20X36A, CY8C20X46A, CY8C20X66A, CY8C20X96A) Device in Fab 5 GSMC on S8DIN-5R Process Mar 10 100101 Qualification of Touch Screen PSoC Device in S8TMC-5R Process at GSMC Apr 10 124505 Qualification of 5th Generation Touch Screen (TSG5_M) device using S8P12-10P technology at GSMC-Fab 5 May 13 142304 Qualification of CY8C4013/ CY8C4014 PSoC4 Family, S8PF-10R Technology in HHGrace-Fab3 June 14 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: To Qualify CapSense Controller device family, S8PF-10R Technology in HHGrace Fab3 Marketing Part #: CY8C4013 / CY8C4014 Device Description: 5V, Industrial Programmable System on a Chip Cypress Division: Cypress Semiconductor Corporation – Programmable System Division (PSD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Composition: Metal 1: 150A Ti /250A TiN / 3200Al-0.5%Cu / 90A Ti/500A TiN Metal 2: 150A Ti /250A TiN/ 3200Al-0.5%Cu / 90A Ti/500A TiN Metal 3: 150A Ti /250A TiN 6500Al-0.5%Cu / 90A Ti/500A TiN Metal 4: 150A Ti /250A TiN 6500Al-0.5%Cu / 90A Ti/500A TiN Metal 5: 190A Ti/450A TiN/10000A Al-0.5% Cu/90A Ti/200A TiN NFUSOX / 1K oxide / 6k Nitride Passivation Type and Thickness: Generic Process Technology/Design Rule (-drawn): S8PF-10R Gate Oxide Material/Thickness (MOS): SiO2 / 32A/110A Name/Location of Die Fab (prime) Facility: Fab 3 / HHGrace, Shanghai China Die Fab Line ID/Wafer Process ID: S8PF-10R ALTERNATIVE FAB FACILITY SITE FAB SITE LOCATION QTP NUMBER CMI Fab 4 MINNESOTA, USA 132802 PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE WIRE QTP NUMBER 16-Lead QFN CML-RA CuPd 140804 16-Lead QFN ASE-K CuPd 134505 16/24 -Lead QFN UTL-UT CuPd 141704 8-Lead SOIC UTL-UT CuPd 134513 16-Lead SOIC UTL-UT CuPd 134506 28-Lead SSOP CML-RA CuPd 145006 28-Lead SSOP JCET-JT CuPd 145005 Note: Package Qualification details upon request. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: LQ44A, LQ48A Mold Compound Flammability Rating: 44 & 48 Quad Flat No-Lead (QFN) 7470LA / Nitto UL94 – V0 Oxygen Rating Index: None Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI-519 Die Attach Method: Epoxy Bond Diagram Designation: 001-78882 Wire Bond Method: Thermosonic Wire Material/Size: CuPd 0.8 mil Thermal Resistance Theta JA °C/W: 31.36 C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69810 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, ASE-KH, UTAC-UT Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.1V, 48 Hours Early Failure Rate (EFR) JESD22-A-108 High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.1V/5.5V, 48 Hours Early Failure Rate (EFR) – Regulator On JESD22-A-108 High Temperature Operating Life Dynamic Operating Condition, 150°C, 2.1V, 500 Hours Latent Failure Rate (LFR) JESD22-A-108 High Temperature Steady State life Low Temperature Operating Life Endurance Static Operating Condition, 150°C, 5.75.V, Vcc Max JESD22-A-108 Dynamic Operating Condition, -30°C, 2.1V JESD22-A-108 10K Cycles, Per datasheet, JESD22-A117 Result P/F P P P P P P 150°C, 1000 Hours Data Retention JESD22-A117 and JESD22-A103 MIL-STD-883, Method 1010, Condition C, -65 °C to 150°C Precondition: JESD22 Moisture Sensitivity Level 3 Temperature Cycle P P 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C High Accelerated Saturation Test JEDEC STD 22-A110: 130°C, 85% RH, 5.25V/5.5V Precondition: JESD22 Moisture Sensitivity Level 3 (HAST) P 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 3 Pressure Cooker P 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C 200C, 4hrs Aged Bond Strength P MIL-STD-883, Method 883-2011 Electrostatic Discharge Human Body Model (ESD-HBM) 2200V/ 3300V/ 4000V/5000V/ 6000V, JESD22-A114 Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/750V/ 1000V/ 1250V/ 1500V/1750V, JESD22-C101 Electrostatic Discharge P P 200V, JESD22-A115 P 150C, 9.0 V JESD78 P Machine Model (ESD-MM) Dynamic Latch-Up ± 140mA, 125C/85°C, 8.25V Static Latch-up ± 300mA, 85C, 9.1V Acoustic Microscopy P JESD78 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs, 30C/60%RH+ Reflow, 260°C+0, -5°C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 16 P Document No. 001-92842 Rev. *B ECN #: 4624766 RELIABILITY FAILURE RATE SUMMARY Stress/Test Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 High Temperature Operating Life Early Failure Rate 1,503 0 N/A N/A 0 PPM High Temperature Operating Life Long Term Failure Rate 902,240 DHRs 0 0.7 170 6 FIT 1 2 3 1 2 Assuming an ambient temperature of 55C and a junction temperature rise of 15C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T2 T1 where: EA =The Activation Energy of the defect mechanism. -5 K = Boltzmann’s constant = 8.62x10 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. 1 2 Early Failure Rate was computed from QTPs 142304 Long Term Failure Rate was computed from QTPs 090706, 100101, 124505 & 142304 LFR Data. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 090706 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466A (8C204665A) 4926959 610927071 CML-RA COMP 15 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA COMP 15 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA COMP 15 0 CY8C20466A (8C204665A) 4926959 610927071 CML-RA COMP 3 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA COMP 3 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA COMP 3 0 STRESS: AGE BOND STRENGTH STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466A (8C204665A) 4926959 610927071 CML-RA 500 77 0 CY8C20466A (8C204665A) 4926959 610927071 CML-RA 1000 77 0 CY8C20466A (8C204665A) 4926959 610927071 CML-RA 1446 77 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 500 80 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 1000 80 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 500 80 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 1000 80 0 CY8C20566A (8C205665A) 4926959 610926865 CML-R 168 77 0 CY8C20566A (8C205665A) 4926959 610926865 CML-R 524 77 0 CY8C20566A (8C205665A) 4934292 610931057 CML-R 168 78 0 CY8C20566A (8C205665A) 4938497 610935104 CML-R 168 77 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C20066A (8C200665A) 4926959 610926836 Malaysia-CA COMP 9 0 CY8C20066A (8C200665A) 4934292 610932270 Malaysia-CA COMP 9 0 CY8C20066A (8C200665A) 4938497 610935356 Malaysia-CA COMP 9 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 090706 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8C20066A (8C200665A) 4926959 610926836 Malaysia-CA COMP 8 0 CY8C20066A (8C200665A) 4934292 610932270 Malaysia-CA COMP 8 0 CY8C20066A (8C200665A) 4938497 610935356 Malaysia-CA COMP 8 0 STRESS: STATIC LATCH-UP (125C, 8.25V, 140mA) CY8C20066A (8C200665A) 4926959 610926836 Malaysia-CA COMP 6 0 CY8C20066A (8C200665A) 4934292 610932270 Malaysia-CA COMP 6 0 CY8C20066A (8C200665A) 4938497 610935356 Malaysia-CA COMP 6 0 CML-RA 5 0 STRESS: DYNAMIC LATCH-UP (150C, 9.0V) CY8C20466A (8C204665A) 4926959 610927071 COMP STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C20466A (8C204665A) 4926959 610927071 CML-RA 48 1000 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 48 1000 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 48 1000 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150, 5.5V, Vcc Max) CY8C20466A (8C204665A) 4926959 610927071 CML-RA 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466A (8C204665A) 4926959 610927071 CML-RA 80 400 0 CY8C20466A (8C204665A) 4926959 610927071 CML-RA 500 399 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 500 444 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 80 400 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 500 400 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 5.75V) CY8C20466A (8C204665A) 4926959 610927071 CML-RA 80 77 0 CY8C20466A (8C204665A) 4926959 610927071 CML-RA 168 77 0 500 83 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566A (8C205665A) 4926959 610926865 CML-R Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 090706 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466A (8C204665A) 4948407GSMC610946935 CML-RA 128 80 0 CY8C20466A (8C204665A) 4948407ª2 610947114 CML-RA 128 80 0 CY8C20466A (8C204665A) 4948407ª3 611002233 CML-RA 128 80 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466A (8C204665A) 4948407GSMC610946935 CML-RA 168 80 0 CY8C20466A (8C204665A) 4948407ª2 610947114 CML-RA 168 80 0 CY8C20466A (8C204665A) 4948407ª3 611002233 CML-RA 168 80 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466A (8C204665A) 4926959 610927071 CML-RA 500 76 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 500 80 0 CY8C20466A (8C204665A) 4934292 610931047 CML-RA 1000 80 0 CY8C20466A (8C204665A) 4938497 610935369 CML-RA 500 80 0 610931047 CML-RA COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066A (8C20066AC) 4934292 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #:100101 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8CTMA300EES 4016083 611028818 MB-PHIL COMP 15 0 CY8CTMA300EES 4016083 611028819 MB-PHIL COMP 15 0 CY8CTMA300EES 4021994 611028331 MB-PHIL COMP 15 0 STRESS: DATA RETENTION, PLASTIC, 150C CY8CTMA300EES 4016083 611021260 MB-PHIL 500 77 0 CY8CTMA300EES 4016083 611021260 MB-PHIL 1000 77 0 CY8CTMA300EES 4016083 611021260 MB-PHIL 1500 77 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA300EES 4016083 611021260 MB-PHIL 48 500 0 CY8CTMA300EES 4016083 611028818 MB-PHIL 48 1540 0 CY8CTMA300EES 4021994 611028331 MB-PHIL 48 1528 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150C, 2.07V, Vcc Max) CY8CTMA300EES 4021994 611028331 MB-PHIL 48 50 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.07V, Vcc Max) CY8CTMA300EES 4016083 611028818 MB-PHIL 80 118 0 CY8CTMA300EES 4016083 611028818 MB-PHIL 500 116 0 CY8CTMA300EES 4021994 611028331 MB-PHIL 80 116 0 CY8CTMA300EES 4021994 611028331 MB-PHIL 500 115 0 CY8CTMA300EES 4016083 611021260 MB-PHIL 168 80 0 CY8CTMA300EES 4016083 611021260 MB-PHIL 500 80 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA300EES 4016083 611021260 MB-PHIL COMP 9 0 CY8CTMA300EES 4021994 611028331 MB-PHIL COMP 9 0 8 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, (2,200V) CY8CTMA300EES 4021994 611028331 MB-PHIL COMP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #:100101 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.5V), PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA300EES 4021994 611028331 MB-PHIL 128 8 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA300EES 4016083 611021260 MB-PHIL 168 80 0 CY8CTMA300EES 4021994 611028331 MB-PHIL 168 80 0 MB-PHIL COMP 6 0 STRESS: STATIC LATCH-UP (85C, 8.25V, 90mA) CY8CTMA300EES 4021994 611028331 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8CTMA300EES 4016083 611028818 MB-PHIL 500 80 0 CY8CTMA300EES 4016083 611028819 MB-PHIL 500 80 0 CY8CTMA300EES 4021994 611028331 MB-PHIL 500 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #:124505 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 500 80 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 1000 79 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 168 80 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 500 80 0 CML-RA COMP 9 0 CML-RA COMP 15 0 COMP 8 0 COMP 6 0 STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CTMA440 (8CC205001B) 4301809 STRESS: 611300880 ESD-CHARGE DEVICE MODEL, (750V) CY8CTMA440 (8CC205002B) 4301809 6113011261 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, (2,200V) CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA STRESS: STATIC LATCH-UP (85C, 2.93V/8.25V, +/-140mA) CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 48 498 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 48 990 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 48 827 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 48 721 0 CY8CTMA440 (8CC205001B) 4301809 611300880 CML-RA 48 594 0 CY8CTMA445 (8CC205001B) 4301809 611304958 CML-RA 48 1205 CY8CTMA445 (8CC205001B) 4301809 611304958 CML-RA 48 345 0 CY8CTMA445 (8C205001B) 4301809 611306104 CML-RA 48 1382 0 CY8CTMA445 (8C205001B) 4301809 611306104 CML-RA 48 168 0 CY8CTMA445 (8C205001B) 4301809 611306104 CML-RA 48 756 0 1 – Scan Failure Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #:124505 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8CTMA440 (8CC205001B)4301809 611300880 CML-RA 80 126 0 CY8CTMA440 (8CC205001B)4301809 611300880 CML-RA 500 126 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8CTMA440 (8CC205001B)4301809 611300880 CML-RA 500 80 0 CY8CTMA440 (8CC205001B)4301809 611300880 CML-RA 1000 80 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8CTMA440 (8CC205001B)4301809 611300880 CML-RA 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 142304 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: DATA RETENTION, 150C CY8C4014 (8CP44304B) 5412006 611415880 CML-RA 500 80 0 CML-RA 168 77 0 CML-RA COMP 9 0 CML-RA COMP 3 0 CML-RA COMP 3 0 CML-RA COMP 3 0 CML-RA COMP 3 0 CML-RA COMP 3 0 8 0 3 0 3 0 3 0 STRESS: ENDURANCE, CYLCLING + DATA BAKE (150C) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (500V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (750V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (1000V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (1250V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (1500V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-CHARGE DEVICE MODEL (1750V) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B (2,200V) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B (3,300V) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B (4,000V) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B (5,000V) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B (6,000V) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP 3 0 CML-RA COMP 5 0 STRESS: ESD-MACHINE MODEL, (200V) CY8C4014 (8CP44304B) 5412006 611415880 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Reliability Test Data QTP #: 142304 Device Fab Lot # Assy Lot # Assy Lot Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP (85C, +/-140mA) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA COMP 6 0 CML-RA COMP 3 0 CML-RA COMP 3 0 CML-RA COMP 3 0 STRESS: STATIC LATCH-UP (85C, +/-200mA) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: STATIC LATCH-UP (125C, +/-140mA) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: STATIC LATCH-UP (85C, +/-300mA) CY8C4014 (8CP44304B) 5412006 611415880 STRESS: HIGH TEMPERATURE DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150, 2.1V, Vcc Max) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA 48 1503 0 STRESS: HIGH TEMPERATURE DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150, 2.1V, Vcc Max) CY8C4014 (8CP44304B) 5412006 611415880 CML-RA 80 118 0 611415880 CML-RA 168 80 0 80 0 STRESS: PRESSURE COOKER TEST CY8C4014 (8CP44304B) 5412006 STRESS: TC COND. C -65 TO 150C, PRE COND 192 HRS 30C/60% RH (MSL3) CY8C4014 (8CP44304B) B5412006 611415880 CML-RA 500 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 16 Document No. 001-92842 Rev. *B ECN #: 4624766 Document History Page Document Title: QTP#142304: QUALIFICATION OF CY8C4013 / CY8C4014 PSOC4 DEVICE FAMILY, S8PF10R TECHNOLOGY, FAB3 HHGRACE 001-92842 Document Number: Rev. ECN Orig. of No. Change ** 4404221 HSTO *A 4411698 HSTO *B 4624766 HSTO Description of Change Initial Spec Release Updated technology from S8P12-10R to S8PF-10R in title page and page 2. Updated Technology/Fab Process Description at page 3. Update Package Availability table at page 3. - Removed Au wire option - Add 8L/16L SOIC package option - Update assembly site name from ASE-G to ASE-K Update Package Availability table - Add 28-Lead SSOP package Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 16