Document No. 001-87070 Rev. ** ECN #: 3960510 Cypress Semiconductor Product Qualification Report QTP# I000006 (IMI Acquisition) March 2007 TS60D [0.6um CMOS]– Tower (Fab28) Base Devices RX11, RF06, & KB14 CMOS5SF [Micrus] – IBM/NY (Fab32), Base Devices ZB15 and ZB17 CSM 0.35um Logic Salicide – Charter Semiconductor (Fab11), Base Devices A35C, B35C, D35C, E35C, F35C, and G35C CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Reliability Director (408) 943-2675 Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 PRODUCT QUALIFICATION HISTORY QTP Number I000006 I000006 Description of Qualification Purpose Qualification Summary for Cypress Acquisition of IMI Devices and Packages (Feb. 23, 2001) Added new device data gathered, B35C qualified base die (CY2LL843*, CY2SSTV16859*,CY2AVC16835*) Date Feb 03 May 04 042304 7C827042AR Mask Option of the D35C base die Jul 04 I000006 Added new device data gathered, D35C qualified base die (CY25561, CY25562) Feb 06 I000006 Added device CY2SSTV855 Mar 07 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 DIE QUALIFICATION TEST RESULTS RX11 base die platform (0.6um, CMOS, Tower Semiconductor, Israel) Test Conditions Test Points Test Results Comments Life Test Military or Industry Standard MIL-STD-883 Method 1005 140oC/5.5V Life Test MIL-STD-883 Method 1005 140oC/5.5V Life Test MIL-STD-883 Method 1005 140oC/5.5V Life Test MIL-STD-883 Method 1005 140oC/5.5V Latch-up JESD78 240 480 240 480 240 480 240 480 200 mA 0/116 0/116 0/116 0/116 0/116 0/116 0/116 0/116 0/5 500 cycles 0/45 Lot T2000 (IMIXG571) Lot T2004 (IMISC608) Lot T2131 (IMISG577) Lot T2213 (IMISC608) Lot T2000 (IMIXG571) Lot T2000 (IMIXG571) HTS 150C KB14 base die platform (0.6um, CMOS, Tower Semiconductor, Israel) Test Life Test Military or Industry Standard MIL-STD-883 Method 1005 Latch-up JESD78 ESD MIL-STD-883 Method 3015 HTS Conditions Test Points Test Results Comments 140oC/5.5V 240 480 200 mA 0/116 0/116 0/5 HBM 500V 750V 1000V 500 cycles 0/3 0/3 1/3 0/45 Lot T2014 (IMISM530) Lot T2014 (IMISM530) Lot T2014 (IMISM530) 150C Lot T2014 (IMISM530) RF06 base die platform (1.0 uM, CMOS, 2 layers metal, Tower Semiconductor, Israel) Test Life Test Military or Industry Standard MIL-STD-883 Method 1005 Conditions Life Test MIL-STD-883 Method 1005 125oC/5.5V ESD MIL-STD-883 Method 3015 HBM Latch-up JESD78 125oC/5.5V Test Points Test Results 168 500 1000 168 500 1000 1000V 1500V 2000V 0/77 0/77 0/77 0/116 0/116 0/116 0/3 0/3 3/3 200 mA 0/5 Comments Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 16 Lot T2055 (IMI4347) Lot T3118 (IMIFS741) Lot T2055 (IMI4347) Lot T2055 (IMI4347) Document No. 001-87070 Rev. ** ECN #: 3960510 ZB15/17 base die platform (0.35uM, CMOS, 2 layers metal, IBM-NY) Test Conditions Life Test Military or Industry Standard MIL-STD-883 Method 1005 Life Test MIL-STD-883 Method 1005 125oC/5V Life Test MIL-STD-883 Method 1005 Life Test TestPoints Test Results 140oC/5V 240 480 500 1000 480 0/116 0/116 0/116 0/116 0/77 MIL-STD-883 Method 1005 140oC/5V 480 ESD MIL-STD-883 Method 3015 HBM Latch-up JESD78 2000V 3000V 4000V 5000V 200 mA 0/116 0/116 0/3 0/3 0/3 3/3 0/5 140oC/5V Comments Lot B5503-ZB17 (IMIZ9102) Lot B6312-ZB17 (IMIZ9546) Lot B5431-ZB15 (IMIZ9714) Lot B6082-ZB15 (IMIZ9102) Lot B6388-ZB17 (IMIZ9102) Lot B6388-ZB17 (IMIZ9102) A35C/G35C base die platform (0.35 uM, 3 layers metal, CMOS, CSM - Singapore) Test Conditions Life Test Military or Industry Standard MIL-STD-883 Method 1005 Life Test MIL-STD-883 Method 1005 125oC/5V Life Test MIL-STD-883 Method 1005 125oC/5V Life Test MIL-STD-883 Method 1005 125oC/5V ESD MIL-STD-883 Method 3015 HBM Latch-up JESD78 ESD MIL-STD-883 Method 3015 Latch-up JESD78 125oC/5V HBM Test Points Test Results Comments 500 1000 500 1000 500 1000 500 1000 1000V 1500V 2000V 200 mA 0/116 0/116 0/116 0/116 0/116 0/116 0/116 0/116 0/3 0/3 0/3 0/5 Lot C1008 /C1000A35C Lot C1016-A35C 2000V 3000V 4000V 200 mA 0/3 0/3 0/3 0/5 Lot C1186-G35C Lot C1138-A35C Lot C1179-A35C Lot C1026-A35C Lot C1009-A35C Lot C1186-G35C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 B35C base die platform (0.35 uM, 3 layers metal, CMOS, CSM-Singapore) Test Conditions Test Points Test Results Comments Life Test Military or Industry Standard MIL-STD-883 Method 1005 125oC/5V MIL-STD-883 Method 1005 125oC/5V ESD MIL-STD-883 Method 3015 HBM Latch-up JESD78 0/116 0/116 0/116 0/116 0/3 0/3 0/3 3/3 0/5 Lot C1035-B35C Life Test 500 1000 500 1000 2000V 3000V 4000V 5000V 200 mA Lot C1035-B35C Lot C1035-B35C Lot C1035-B35C D35C/E35C/F35C base die platform (0.35 uM, 3 layers metal, CMOS, CSM- Singapore) Test Life Test Military or Industry Standard MIL-STD-883 Method 1005 Conditions 150oC/3.3V Life Test MIL-STD-883 Method 1005 150oC/3.3V Life Test MIL-STD-883 Method 1005 ESD MIL-STD-883 Method 3015 150oC/3.3V HBM Latch-up JESD78 ESD MIL-STD-883 Method 3015 Latch-up JESD78 ESD MIL-STD-883 Method 3015 Latch-up JESD78 HBM HBM Test Points 168 332 72 596 168 Test Results 0/116 0/116 0/116 0/116 0/116 Comments 2000V 3000V 4000V 5000V 200 Ma 0/3 0/3 0/3 0/3 0/5 Lot C1214-D35C 2000V 3000V 4000V 200 mA 0/3 0/3 0/2 0/5 Lot C1281-E35C 2000V 3000V 4000V 200 mA 0/3 0/3 0/2 0/5 Lot C1189-F35C Lot C1061-D35C Lot C1024-D35C Lot C1130-D35C Lot C1214-D35C Lot C1281-E35C Lot C1189-F35C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 PACKAGE QUALIFICATION TEST RESULTS SOIC (150Mils) Test Military or Industry Standard MIL-STD-883 Method 1010 Test Points 500 Test Results 0/76 500 cycles, -65/+ 150oC 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Temperature Cycle MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Temperature Cycle MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Physical Dimension Resistance to Solvent Solderability JEDEC Spec. Applicable drawing N/A 0/12 Preconditioned Units, CWT, lot C1179 Preconditioned Units, CWT, lot C1179 Preconditioned Units, SPEL, lot T2959 Preconditioned Units, SPEL, lot T2959 Preconditioned Units, CWT, lot B6399 Preconditioned Units, CWT, lot B6399 Preconditioned Units, SIG-K, lot F5216 Preconditioned Units, SIG-K, lot F5216 Performed by CWT Pressure Pot JEDEC Std. 22 Test Method 102 Temperature Cycle N/A 0/12 Performed by CWT N/A 0/5 Performed by CWT N/A N/A 0/20 0/12 Performed by CWT Performed by SPEL N/A 0/12 Performed by SPEL N/A 0/5 Performed by SPEL N/A N/A 0/20 0/12 Performed by SPEL Performed by SIG-K N/A 0/12 Performed by SIG-K Temperature Cycle Coplanarity Physical Dimension Resistance to Solvent Solderability Coplanarity Physical Dimension Resistance to Solvent MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. JEDEC Spec. MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. JEDEC Spec. MIL-STD-883 Method 2015 Conditions 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil Applicable drawing 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil Applicable drawing Comments Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 Solderability Coplanarity MIL-STD-883 Method 2003 JEDEC Spec. 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil N/A 0/5 Performed by SIG-K N/A 0/20 Performed by SIG-K PACKAGE QUALIFICATION TEST RESULTS SSOP (209Mils) Test Military or Industry Standard MIL-STD-883 Method 1010 Test Points 500 Test Results 0/76 500 cycles, -65/+ 150oC 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Physical Dimension Resistance to Solvent Solderability JEDEC Spec. Applicable drawing N/A 0/12 Preconditioned Units, OSE, Lot T2408 Preconditioned Units, OSE, Lot T2408 Preconditioned Units, OSE, Lot T2415 Preconditioned Units, OSE, Lot T2415 Performed by OSE Pressure Pot JEDEC Std. 22 Test Method 102 Temperature Cycle N/A 0/12 Performed by OSE N/A 0/5 Performed by OSE N/A 0/20 Performed by OSE Test Points 500 Test Results 0/45 Comments 168 Hours, 100% RH, 121oC, 2 atm 168 0/45 Preconditioned Units SIG-K, LOT F4461 500 cycles, -65/+ 150oC 500 0/76 Preconditioned Units OSE, LOT C1141 Temperature Cycle Coplanarity MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. Conditions 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil Comments TSSOP(170Mils) Test Temperature Cycle Military or Industry Standard MIL-STD-883 Method 1010 Conditions 500 cycles, -65/+ 150oC Preconditioned Units SIG-K LOT F4461 Pressure Pot JEDEC Std. 22 Test Method 102 Temperature Cycle MIL-STD-883 Method 1010 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Preconditioned Units OSE, LOT C1141` Physical Dimension JEDEC Spec. Applicable drawing N/A 0/12 Performed by SIG-K Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 Resistance to Solvent Solderability Coplanarity MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil N/A 0/12 Performed by SIG-K N/A 0/5 Performed by OSE N/A 0/20 Performed by OSE PACKAGE QUALIFICATION TEST RESULTS TSSOP(240Mils) Test Military or Industry Standard MIL-STD-883 Method 1010 Test Points 500 Test Results 0/76 500 cycles, -65/+ 150oC Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 PreconditionedUnits OSE, Lot F6182 Temperature Cycle MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Preconditioned Units SIG-K. Lot F3966 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Preconditioned Units SIG-K, Lot F3966 Physical Dimension Resistance to Solvent Solderability JEDEC Spec. Applicable drawing N/A 0/12 Performed by OSE N/A 0/12 Performed by OSE N/A 0/5 Performed by OSE N/A N/A 0/20 0/12 Performed by OSE Performed by SIG-K N/A 0/12 Performed by SIG-K N/A 0/5 Performed by SIG-K N/A 0/20 Performed by SIG-K Temperature Cycle Coplanarity Physical Dimension Resistance to Solvent Solderability Coplanarity MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. JEDEC Spec. MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. Conditions 260 Deg, 5 sec 95% Min Covrg Max = 4 Mil Applicable drawing 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil Comments Preconditioned Units OSE. Lot F6182 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 PACKAGE QUALIFICATION TEST RESULTS TQFP Test Military or Industry Standard MIL-STD-883 Method 1010 Test Points 500 Test Results 0/76 500 cycles, -65/+ 150oC Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Preconditioned Units MHT, Lot B6747 Temperature Cycle MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/76 Preconditioned Units SIG-K, Lot B6562 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/76 Preconditioned Units SIG-K, Lot B6562 Temperature Cycle MIL-STD-883 Method 1010 500 cycles, -65/+ 150oC 500 0/45 Preconditioned Units MHT, Lot B6262 Pressure Pot JEDEC Std. 22 Test Method 102 168 Hours, 100% RH, 121oC, 2 atm 168 0/45 Preconditioned Units MHT, Lot B6262 Physical Dimension Resistance to Solvent Solderability JEDEC Spec. Applicable drawing N/A 0/12 Performed by MHT N/A 0/12 Performed by MHT N/A 0/5 Performed by MHT N/A N/A 0/20 0/12 Performed by MHT Performed by SIG-K N/A 0/12 Performed by SIG-K N/A 0/5 Performed by SIG-K N/A 0/20 Performed by SIG-K Temperature Cycle Coplanarity Physical Dimension Resistance to Solvent Solderability Coplanarity MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. JEDEC Spec. MIL-STD-883 Method 2015 MIL-STD-883 Method 2003 JEDEC Spec. Conditions 260 Deg, 5 sec 95% Min Covrg Max = 4 Mil Applicable drawing 260 Deg, 5 sec 95% Min Coverage Max = 4 Mil Comments Preconditioned Units MHT, Lot B6747 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 A35C Base – Personalizations MARKETING ROOT # DATE ISSUED PACKAGE 9812I C5003 005 C6001 C6005 C9429 C9530 C9531 C9630 C9631 C9641 C9703 C9706/07 C9713 C9725 C9726 C9727 C9730 C9801 C9806I 9829/9825 C9809 C9810/9815 C9824 C9827 C9827/C9832 C9835 C9836 C9837 C9840 C9842 C9843 C9844 C9846 C9849 C9850 C9851 9853 C9854 C9857 C9860 C9866 11/15/1999 06/26/2000 12/12/2000 01/12/2000 05/19/2000 07/19/2000 11/10/1999 11/10/1999 10/13/1999 04/04/2000 12/06/1999 11/08/1999 12/06/1999 04/12/2000 10/16/2000 06/27/2000 06/27/2000 01/10/2000 01/28/2000 04/04/2000 11/30/1999 02/11/2000 10/25/1999 11/22/1999 04/05/2000 09/18/2000 02/10/2000 09/11/2000 09/11/2000 12/06/1999 02/28/2000 02/28/2000 09/14/2000 06/02/2000 03/17/2000 11/19/1999 09/30/1999 12/01/1999 10/04/2000 10/11/2000 06/02/2000 09/11/2000 56 SSOP 56 SSOP 48 TSSOP/SSOP 16 TSSOP 8 SOIC 28 SOIC 48 SSOP/TSSOP 28 SSOP/TSSOP 48 SSOP 48 SSOP 48 SSOP/TSSOP 48 SSOP 48 SSOP 48 SSOP 28 TSSOP 48 SSOP 48 SSOP 48 SSOP 56 SSOP 48 SSOP/ TSSOP 56 SSOP 48 SSOP 56 SSOP 56 SSOP 56 SSOP 56 TSSOP 56SSOP 48SSOP/TSSOP 48SSOP/TSSOP 48 SSOP 56 SSOP 48 SSOP 48 SSOP 48 SSOP 56 SSOP 56 SSOP/TSSOP 48 TSSOP 48 SSOP/TSSOP 48 SSOP 48 SSOP 48 SSOP 48SSOP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 C9869 C9870 C9909 C9910 C9911 09/11/2000 11/20/2000 01/24/2000 02/08/2001 03/06/2001 56SSOP 56 TSSOP / SSOP 56 SSOP/48 SSOP 56 SSOP 48 SSOP A35C Base – Personalizations (Continued) MARKETING ROOT # DATE ISSUED C9914 06/02/2000 C9926 C9945 C9946 SM560 SM561 SM562 SM564 SM565 SM566 08/04/2000 10/26/2000 10/26/2000 10/06/2000 10/06/2000 10/16/2000 09/18/2000 09/18/2000 05/16/2000 PACKAGE 28 SSOP/TSSOP` 48 SSOP 56 SSOP 56 SSOP 8 SOIC 8 SOIC 8 SOIC 8 SOIC 16 SOIC 16 SOIC B35C Base – Personalizations Customer Specific Marketing Numbers D35C Base - Personalizations MARKETING ROOT # MANUFACTURING # DATE ISSUED PACKAGE CY24240 7C825822A 07/12/2001 16 SOIC CY24244 7C825822A 01/17/2002 16 SOIC CY25560 (SM560) 7C825822A 06/13/2001 8 SOIC CY22561 7C825822A UNKNOWN 8 SOIC CY22562 7C825822A UNKNOWN 8 SOIC CY25566 7C825822A 08/21/2001 16 SOIC CY25822 7C825822A 05/23/2002 8 SOIC CY25822-1 7C825822B 11/04/2002 8 SOIC CY25822-2 7C858222B 11/06/2002 8 SOIC CY27023 7C825822A 11/29/2001 16 TSSOP CY27024 7C825822A 09/17/2001 16 TSSOP CY27025 7C825822A 01/10/2002 16 TSSOP CY27027 7C825822A 03/11/2002 16 TSSOP CY27028-1/-2/-3/-4 7C825822A 03/11/2002 16 TSSOP CY2DP814 7C825822A 08/29/2001 16 SOIC/TSSOP CY2LL8422/23 7C825822A 04/12/2001 28TSSOP/SSOP Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 E35C Base – Personalizations MARKETING ROOT # MANUF. PART # DATE ISSUED PACKAGE CY22313 7C822313C 04/10/2003 24 TSSOP CY24234 7C824234A 04/05/2001 16 TSSOP CY24260/61 7C824260A 10/25/2001 20 TSSOP/16 TSSOP CY24262 7C824262A 11/07/2001 20 TSSOP CY27022 7C827022A 10/23/2001 8 SOIC 7C827030A 07/15/2002 16 TSSOP 7C827032A 08/13/2002 16 TSSOP CY27030/-1/-2 CY27032 F35C Base – Personalizations MARKETING ROOT # CY25568 - SM568 CY25811 - SM811 CY25812 - SM812 CY25814 - SM814 CY25818/819 CY25901 CY25901-1 CY25902 CY27020 (C6005) CY27029 CY27029-1 CY27031 CY2DL814 CY2DP814 CY2LL842 CY2LL843 - LL843 CY2PC822 MANUF. PART # DATE ISSUED PACKAGE 7C825568B 7C825811B 7C825812B 7C825814B 7C825818A 7C825901A 7C859011A 7C825902A 7C827020A 7C827029A 7C870291A 7C827031A 7C8DL814A 7C8DP814A 7C8LL842CB 7C8LL843C 7C82822A 01/25/2001 02/22/2001 02/22/2001 02/01/2201 09/21/2001 09/19/2002 10/24/2002 09/19/2002 10/01/2001 08/16/2002 10/31/2002 10/31/2002 04/03/2001 07/26/2001 07/16/2001 07/16/2001 05/13/2002 16 SOIC 8 SOIC 8 SOIC 8 SOIC 8 SOIC 8 SOIC 8 SOIC 8 TSSOP 8 SOIC 14 SOIC 14 SOIC 8 SOIC 16 TSSOP/SSOP 16TSSOP/SSOP 16 TSSOP/SOIC 16 TSSOP/SOIC 8 SOIC Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 Reliability Test Data B35C BASE DIE Device STRESS: Fab Lot # Assy Lot # Assy Loc Duration Samp Rej ESD-CHARGE DEVICE MODEL, 500V CY2SSTV16859 (7C826859A) 9210123 610334679 KOREA-L COMP 2 0 CY2AVC16835 (7C81635ER) 9202732 610303336 TAIWAN-T COMP 2 0 CY2SSTV16859 (7C826859A) 9210123 610249055 KOREA-GQ COMP 3 0 CY2LL843 (7C82LL843CR) 9213233 TAIWAN-CH COMP 3 0 STRESS: 610218031 ESD-CHARGE DEVICE MODEL, 750V CY2SSTV16859 (7C826859A) 9210123 610334679 KOREA-L COMP 1 0 CY2SSTV16859 (7C826859A) 9210123 610249055 KOREA-GQ COMP 3 0 CY2LL843 (7C82LL843CR) 9213233 610218031 TAIWAN-CH COMP 3 0 1 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 1100V CY2SSTV16859 (7C826859A) STRESS: 9210123 610334679 KOREA-L COMP ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2000V CY2AVC16835 (7C81635ER) 9202732 610303336 TAIWAN-T COMP 2 0 CY2LL843 (7C82LL843CR) 9213233 610218031 TAIWAN-CH COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2200V CY2SSTV16859 (7C826859A) 9210123 610334679 KOREA-L COMP 2 0 CY2AVC16835 (7C81635ER) 9202732 610303336 TAIWAN-T COMP 2 0 CY2SSTV16859 (7C826859A) 9210123 610249055 KOREA-GQ COMP 3 0 CY2LL843 (7C82LL843CR) 9213233 610218031 TAIWAN-CH COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2400V CY2AVC16835 (7C81635ER) 9202732 610303336 TAIWAN-T COMP 2 0 CY2SSTV16859 (7C826859A) 9210123 610249055 KOREA-GQ COMP 3 0 CY2LL843 (7C82LL843CR) 9213233 610218031 TAIWAN-CH COMP 3 0 COMP 3 0 COMP 2 0 STRESS: STATIC LATCH-UP TESTING, 125C, 8.0V, ±300mA CY2SSTV16859 (7C826859A) STRESS: Failure Mechanism 9210123 610334679 KOREA-L STATIC LATCH-UP TESTING, 125C, 10V, ±300mA CY2AVC16835 (7C81635ER) 9202732 610303336 TAIWAN-T Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 CY2SSTV16859 (7C826859A) 9210123 610249055 KOREA-GQ COMP 2 0 CY2LL843 (7C82LL843CR) 9213233 610218031 TAIWAN-CH COMP 3 0 Reliability Test Data QTP #: 042304 Device STRESS: Fab Lot # Rej SEOL-L COMP 9 0 9 0 Failure Mechanism 9408719 610433454 9408719 610433454 SEOL-L COMP ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015, 2,200V CY27042LFXC (7C827042A) STRESS: Duration Samp ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-B, 2,200V CY27042LFXC (7C827042A) STRESS: Assy Loc ESD-CHARGE DEVICE MODEL, 500V CY27042LFXC (7C827042A) STRESS: Assy Lot # 9408719 610433454 SEOL-L COMP 3 0 SEOL-L COMP 3 0 STATIC LATCH-UP TESTING, 125C, 8.0V, ±300mA CY27042LFXC (7C827042A) 9408719 610433454 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 16 Document No. 001-87070 Rev. ** ECN #: 3960510 Document History Page Document Title: QTP I000006: IMI ACQUISITION QUALIFICATION SUMMARY (CMOS/5SF) BASE DEVICES A/B/C/D/E/F/G35C 001-87070 Document Number: Rev. ECN Orig. of No. Change ** 3960510 ILZ Distribution: WEB Posting: Description of Change Initial Spec Release None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 16