Document No.001-76200 Rev. *A ECN # 3547968 Cypress Semiconductor Package Qualification Report QTP# 112302 February 2012 100-Lead TQFP (14x14x1.4 mm) NiPdAu, MSL3, 260C Reflow CML-RA CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-76200 Rev. *A ECN # 3547968 PACKAGE QUALIFICATION HISTORY QUAL REPORT 112302 DESCRIPTION OF QUALIFICATION PURPOSE Package qualification of TQFP 100L 14x14x1.4MM package in CML Autoline using Panther TM device, KEG6000 mold compound, QMI-509 die attach, NiPdAu lead finish and 0.8 mils / Au at MSL3, 260C reflow temperature. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 DATE COMP. Oct 11 Document No.001-76200 Rev. *A ECN # 3547968 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ100S Package Outline, Type, or Name: 100 – Lead Thin Quad Flat Package (TQFP), 14x14x1.4 mm Mold Compound Name/Manufacturer: KE-G6000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: 0.001 cph/m2 Oxygen Rating Index: >28% N/A Lead Frame Designation: Reduced Metal Pad Lead Frame Material: Copper Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Dexter Die Attach Material: QMI 509 Bond Diagram Designation 001-69403 Wire Bond Method: Thermosonic Wire Material/Size: 0.8 mil / Au Thermal Resistance Theta JA C/W: 44.66 C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 8 Document No.001-76200 Rev. *A ECN # 3547968 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) Result P/F P High Temp Storage 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) 150 C, no bias Acoustic Microscopy Cypress Spec. 25-00104 P Ball Shear Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66 P Bond Pull Cypress Spec. 12-00292, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Cypress Spec. 25-20035 P Dye Penetrant Test Cypress Spec. 25-20027-No Crack, P Internal Visual Cypress Spec. 12-00292 P Final Visual Inspection Cypress Spec. 12-00292 P Physical Dimension Cypress Spec. 25-00031, MIL-STD-1835, JESD22-B100 P Pressure Cooker Test Temperature Cycle Solderability, Steam Aged Cypress Spec. 25-00018, J-STD-002, JESD22-B102 P P P P 95% solder coverage minimum X-Ray MIL-STD-883 – 2012 P Thermal Shock Cypress Spec. 25-00014 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 Document No.001-76200 Rev. *A ECN # 3547968 Reliability Test Data QTP #: Device 112302 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 10 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 5 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 5 0 STRESS: DYE PENETRANT TEST CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 15 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-76200 Rev. *A ECN # 3547968 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 112302 Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5568 (8C551001B) 4112653 611126409 CML-RA 128 77 0 STRESS: HIGH TEMP STORAGE, 150C no bias CY8C5568 (8C551001B) 4112653 611126409 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611126409 CML-RA 1000 77 0 4112653 611126409 CML-RA COMP 5 0 611126409 CML-RA COMP 30 0 STRESS: INTERNAL VISUAL CY8C5568 (8C551001B) STRESS: PHYSICAL DIMENSION CY8C5568 (8C551001B) 4112653 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY8C5568 (8C551001B) 4112653 611126409 CML-RA 128 168 0 STRESS: SOLDERABILITY TEST CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 3 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 3 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 3 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 3 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 3 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 3 0 STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY8C5568 (8C551001B) 4112653 611126409 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA 1000 75 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA 500 77 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA 500 76 0 4112653 611126409 CML-RA 200 77 0 STRESS: THERMAL SHOCK CY8C5568 (8C551001B) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-76200 Rev. *A ECN # 3547968 Reliability Test Data QTP #: Device 112302 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 15 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 15 0 Failure Mechanism STRESS: X-RAY STRESS: POST TCT 500 CROSS SECTION CY8C5568 (8C551001B) 4112653 611126409 CML-RA COMP 2 0 CY8C5568 (8C551001B) 4112653 611127489 CML-RA COMP 2 0 CY8C5568 (8C551001B) 4112653 611127485 CML-RA COMP 2 0 CY8C5568 (8C551001B) 4112653 611127486 CML-RA COMP 2 0 CY8C5568 (8C551001B) 4112653 611127487 CML-RA COMP 2 0 CY8C5568 (8C551001B) 4112653 611127488 CML-RA COMP 2 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-76200 Rev. *A ECN # 3547968 Document History Page Document Title: Document Number: Rev. ECN No. ** 3528304 *A 3547968 QTP 112302: 100-LEAD TQFP (14X14X1.4 MM) NIPDAU, MSL3, 260C REFLOW CML-RA 001-76200 Orig. of Change NSR NSR Description of Change Initial spec release Corrected the wire diameter on page 3 from 08 mil to 0.8 mil Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8