Document No.001-75819 Rev. *A ECN # 4662501 Cypress Semiconductor Package Qualification Report QTP# 114407 VERSION*A February, 2015 68-Lead Saw QFN (Quad Flat No-Lead) (8 x 8 x 1.0mm) NiPdAu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-75819 Rev. *A ECN # 4662501 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 114407 Larger Die Qualification of 68-Lead Saw QFN (8 x 8 x 1.0 mm), NiPdAu, using Sumitomo G700 Mold Compound, QMI519 Epoxy, MSL3, 260C Reflow assembled at CML-RA January 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-75819 Rev. *A ECN # 4662501 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT68A Package Outline, Type, or Name: 68-Lead Saw Quad Flat No Lead (QFN), 8 x 8x 1 mm Mold Compound Name/Manufacturer: G700 / Sumitomo Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: 54% Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Die Separation Method: Backgrind Wafer Saw Die Attach Supplier: Dexter Die Attach Material: QMI519 Die Attach Method: Epoxy Bond Diagram Designation 001-68784 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 14.17C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-75819 Rev. *A ECN # 4662501 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level Temperature Cycle Result P/F P (192 Hrs., 30C, 60% RH, 260C Reflow) Pressure Cooker Test JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30C, 60% RH, 260C Reflow) High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130 C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30C, 60% RH, 260C Reflow) High Temp Storage JESD22-A103:150°C No bias P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30C, 60% RH, 260C Reflow) Ball Shear Bond Pull Constructional Analysis Die Shear JESD22-B116 Cpk : 1.33, Ppk : 1.66 MIL-STD-883 – Method 2011 Cpk : 1.33, Ppk : 1.66 Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf P P P P >5001 sq. mils = 1.2 kgf Test to determine the existence and extent of cracks, Dye Penetrant Test X-ray Criteria: No Package Crack MIL-STD-883 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P P Document No.001-75819 Rev. *A ECN # 4662501 Reliability Test Data QTP #: Device 114407 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 15 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 15 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 15 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 30 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 30 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 30 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 30 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 30 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 30 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND PULL STRESS: BALL SHEAR STRESS: CONSTRUCTIONAL ANALYSIS CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 5 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 5 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 10 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 10 0 STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY8C5588LTI (8C55881A) 4052988 611120221 CML-RA COMP 15 0 CY8C5588LTI (8C55881A) 4052988 611120220 CML-RA COMP 15 0 CY8C5588LTI (8C55881A) 4052988 611120219 CML-RA COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5588LTI (8C55881A) 4052988 611120221 CML-RA 128 77 0 STRESS: HIGH TEMP STORAGE CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA 500 80 0 CY8C5568LTI (8C550681B) 4130915 611148398 CML-RA 1000 80 0 4135316 611153052 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL CY8C5568LTI (8C550681B) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-75819 Rev. *A ECN # 4662501 Reliability Test Data QTP #: Device Fab Lot # 114407 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 168 80 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 288 80 0 STRESS: POST TCT CROSS SECTION CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 500 5 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 1000 5 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA 500 5 0 STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA 500 77 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 500 80 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA 1000 74 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA 500 84 0 CY8C5568LTI (8C550681B) 4135316 611153052 CML-RA COMP 288 0 CY8C5568LTI (8C550681B) 4130915 611148399 CML-RA COMP 288 0 CY8C5568LTI (8C550681B) 4137655 611154512 CML-RA COMP 288 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-75819 Rev. *A ECN # 4662501 Document History Page Document Title: QTP 114407: 68-LEAD SAW QFN (QUAD FLAT NO-LEAD), (8 X 8 X 1.0MM), NIPDAU, MSL3, 260C REFLOW CML-RA 001-75819 Document Number: Rev. ECN Orig. of No. Change ** 3509299 NSR Description of Change *A Sunset review: Updated QTP title page and Reliability Tests Performed table (HAST,PCT,HTS,Acoustic,Ball Shear,Bond Pull,CA,Die Shear, DPT) for template alignment. 4662501 JYF Initial spec release Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7