Small-signal discretes for automotive

Small-signal discretes
for automotive
Industry-leading quality and innovation
Your global partner for discretes
As automotive manufacturers strive for convenient body applications, new safety systems, infotainment systems, and efficient
powertrain solutions, the semiconductor content of vehicles is rising and electronic systems are becoming more complex.
Consequently, semiconductor suppliers must meet increasingly strict requirements.
NXP is the global leader in automotive for small-signal discretes – with more than 60 years of experience developing and
producing diodes and transistors.
By combining our expertise in automotive and discrete solutions, we offer an extensive portfolio of discrete components
for every automotive applications, from small-signal to power. We help suppliers of automotive systems meet the rigorous
and diverse technical demands of automotive electronics by focusing on four key elements – high automotive-grade quality,
sustainable environment, secure supply, and an innovative product portfolio.
The GA discretes automotive portfolio
Protection and filtering
} ESD protection devices with standard and low
capacitance
} Surge protection (TVS) devices
Small-signal MOSFETs
} Low RDSon Trench MOSFETs
} ESD protected types
} N/P-channel MOSFETs
Medium-power diodes and transistors
} High and medium power bipolar transistors
} High voltage bipolar transistors
} Low VF Schottky and PN rectifier
Small-signal diodes and transistors
} General purpose diodes and transistors
} Zener, Schottky and switching diodes
} Resistor-equipped transistors (RETs)
2
Small-signal discretes for automotive
Airbag control
} Low-VF (MEGA) Schottky rectifier
} Low-VCEsat (BISS) transistors
} General-purpose transistors
} Switching diodes
} High-power transistor (BJT)
} PN rectifier
} Power MOSFETs
Body-control unit
} Low-VF (MEGA) Schottky diodes
} Low-VCEsat (BISS) transistors
} Small-signal MOSFETs
} Power MOSFETs
} TVS and ESD protection diodes
} Shunt regulators
} Multiplexers / Demultiplexers
} Shift registers
} Line drivers
Interior lighting
} Low-VF (MEGA)
Schottky rectifier
Backlight
} Low leakage Schottky
rectifier
} MOSFETs
Infotainment
} IVN ESD/LVDS ESD
} High-power transistor (BJT)
} Small-signal MOSFETs
} PN rectifier
} Multiplexers
} Display drivers
} Level shifter
Fuel injection
} MOSFETs
} TVS
} PN rectifier
ABS module
} Low-VF (MEGA) Schottky
rectifier
} Low-VCEsat (BISS) transistors
} Small-signal MOSFETs
} Power MOSFETs
} ESD protection diodes
} High-power transistors
(BJT)
Frontlight
} Low leakage Schottky rectifier
} MOSFETs
} Low-VCEsat (BISS) transistors
Automotive networking
} ESD protection diodes
e.g. MMBZ and
PESDXCAN series
Daytime running light
} Low-VCEsat (BISS) transistors
} PN rectifier
} High-power bipolar transistors in LFPAK
} Medium-power general-purpose transistors
ABS module
} Low-VF (MEGA) Schottky
rectifier
} Low-VCEsat (BISS) transistors
} Small-signal MOSFETs
} Power MOSFETs
} General-purpose transistors
} ESD protection diodes
} Multiplexers
} Scmitt trigger devices
} Shift registers
Automotive power
} TVS diodes
} Low-VF (MEGA) Schottky diodes
} Low-VCEsat (BISS) transistors
} Wide range of automotive-grade power MOSFETs
- Steering
- Braking / stability
- Body control
- Engine management
- Fan control
- Transmission
- Water pump
Small-signal discretes for automotive
3
Our strength: package innovation and minia turization
Miniaturization without compromising performance
Electronics in cars is increasing and creates a higher demand for smaller packages and further integration. Package miniaturization is
required to further enable performance. Getting smaller while maintaining power has a big advantage: it saves space. The idea is to
do more with less, and it creates a push for smaller parts in each new generation of components and systems.
For small-signal packages, meeting the challenge of miniaturization requires significant innovation in research and development.
The graph below shows NXP’s ongoing ability to support size-constrained applications and assure long-term availability.
Medium-power package miniaturization
Small-signal package miniaturization
Automotive Today
Automotive Tomorrow
Automotive Today
15
Automotive Tomorrow
8
LFPAK56
SOT223
CFP15
DFN2020D-3
SOT89
DFN2020MD-6
DFN2020D-6
DFN1010D-3*
5
SOT23
1
SOT323
IA]
3
CFP5
SMA
SMA
1
65
30
20
14
CFP3
12
SOD123F
0.5
DFN1608D-2*
2
6 Area [mm ]
‘Automotive Tomorrow’ medium power packages offer higher current capability per mm². This reduces PCB costs and offers
more design flexibility.
SOD523
SOD323F
DFN1006D-2*
0.1
IA]
SMB
49
20
7.5
4
1
*Solderable side pads
DPak
Area [mm2]
‘Automotive Tomorrow’ packages with tin-plated, solderable side pads enable visual solder inspection, smaller designs, and have
an improved electro-thermal behavior. They deliver high power on a smaller footprint and have 100% automatic optic inspection
(AOI).
Leadless package solutions with solderable side pads
Clip-bond medium-power package solutions for automotive
CFP3
4
CFP5
CFP15
LFPAK56
DFN2020MD-6
DFN2020D-6
DFN2020D-3
DFN1010D-3
DFN1608D-2
DFN1006D-2
SOD123W
SOD128
SOT1289
SOT669
SOT1220
SOT1118D
SOT1061D
SOT1215
SOD1608
SOD882D
2.6 x 1.7 x 1.0
3.8 x 2.6 x 1.0
5.8 x 4.3 x 0.78
5.0 x 6.0 x 1.0
2.0 x 2.0 x 0.62
2.0 x 2.0 x 0.62
2.0 x 2.0 x 0.62
1.1 x 1.0 x 0.37
1.6 x 0.8 x 0.37
1.0 x 0.6 x 0.37
Small-signal discretes for automotive
Small-signal discretes for automotive
5
Headlamps / rear lights
Airbags
Headlamp and rear light performance has steadily improved throughout the automobile age. Today, modern headlamps not
only respond to steering and suspension dynamics, but also to ambient weather, visibility conditions, the speed of the vehicle,
and the curvature and contour of the road. All this is done by electronic sensors, which react to the surrounding conditions, and
by using GPS signals to anticipate road changes ahead.
NXP technology supports all these developments, including daylight running lights. Our products are housed in DFN2020 packages
that deliver a space-efficient form factor with 100% tin-plated sidepads for optical solder inspection. The new CFP15 packages with
clip-bond technology enable miniaturization Because they offer the same or higher performance on a smaller footprint.
As safety devices, airbags cushion occupants during a crash and protect their bodies from possible impact with interior objects
like the steering wheel or window. Many designs are inflated through pyrotechnic means. Newer side-impact airbag modules
consist of compressed air cylinders that are triggered in the event of a side vehicle impact.
With either type of airbag, special high-temperature Schottky rectifiers, such as the PMEG6010ELR, are used to ensure reliable
function.
Highlight products for headlamps / rear lights
PMPB215ENEA
PBSS5260PAPS
PMEG6020ELR
PMEG100V80ELPD
PESD1CAN / PESD1CAN-U
80 V, single N-channel Trench
MOSFET in DFN2020MD-6 for
switching circuits
60 V, 2 A PNP/PNP low VCEsat (BISS)
transistor in DFN2020D-6 for LED
dimming
Low leakage Schottky rectifier with
high temperature cpabilities
Tj = 175° C for DCDC (buck & boost)
converter in CFP3 and CFP15
ESD protection for CAN interface in
SOT23 / SOT323
Average forward current: IF(AV) ≤ 2 A
One small SOT23 package to protect two
CAN bus lines
Key features and benefits
215 mΩ
Tench MOSFET technology
Small and leadless ultra thin SMD plastic
package 2 x 2 x 0.65 mm
Highlight products for airbags
PNS40010ER
PTVS28VP1UP
PMEG6010ELR
PESD1CAN-U
400 V, 1 A,
PN rectifier in CFP3
600 W Transient Voltage
Suppressor in CFP5
60 V, low leakage
Schottky barrier rectifier in CFP3
CAN bus ESD
protection in SOT323
Key features and benefits
Very low collector-emitter saturation
voltage VCEsat
High collector current capability IC and ICM
High collector current gain hFE at high IC
Exposed drain pad for excellent thermal
conduction
Exposed heat sink for excellent thermal and
electrical conductivity
Tin-plated 100% solderable side pads for
optical solder inspection
Suitable for Automatic Optical Inspection
(AOI) of solder joints
AEC-Q101 qualified
Ideal for LED light dimming and power
switches
AEC-Q101 qualified
Reverse voltage: VR ≤ 60 V
Extremely low leakage current
Peak pulse power, max.: PPP = 200 W at t p =
8/20 µs
Low forward voltage
Low clamping voltage: VCL = 40 V at IPP = 1 A
High power capability due to clip-bonding
technology
Ultra low leakage current, typ.: IRM<1 nA
Small and flat lead SMD plastic package
Diode capacitance matching, typ.: ΔC d/
C d = 0.1 %
High temperature T j ≤ 175 °C
ESD protection up to 23 kV; IEC 61000-4-2,
level 4
AEC-Q101 qualified
IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 µs
Reverse voltage VR ≤ 40 V
Rated peak pulse power: PPPM = 600 W
Extremely low leakage current
Low reverse current
Reverse standoff voltage range: VRWM = 3.3
to 64 V
High-power capability due to clip-bonding
technology
Small and flat lead SMD plastic package
Small plastic package suitable for surfacemounted designs
High temperature Tj ≤ 175 °C
Clip-bond technology
Clip-bond technology
Low inductance
One very small SOT323 package to protect
two CAN bus lines
Typical diode capacitance matching ΔC d/
C d = 0.1 %
AEC-Q101 qualified
ESD protection up to 23 kV; IEC 61000-4-2,
level 4
Low forward voltage
Low clamping voltage VCL = 40 V at IPP = ! A
Clip-bond technology
Reverse standoff voltage VRWM = 24 (DS)
Explore further automotive solutions at www.nxp.com/applications/automotive
AEC-Q101 qualified
Explore further automotive solutions at www.nxp.com/applications/automotive
6
Small-signal discretes for automotive
Small-signal discretes for automotive
7
Braking systems / ABS
Body-control modules
An anti-lock brake system (ABS) is typically used to help the vehicle maintain contact with the road surface and prevent skidding
during poor braking conditions, such as when the road is icy or wet. A pump motor is used to re-pressurize the ABS during
operation. For single-direction ON-OFF control of the pump motor, with pulse-wide modulation for speed control, MOSFETs like
the BUK9759-60E are often used.
To enable a power efficient DC-DC power supply, even under high-temperature conditions, we recommend our newly released
low-leakage Schottky rectifier PMEG6020ELR.
Highlight products for braking systems / ABS
PNS40010ER
PTVS28VP1UP
PMEG6010ELR
PESD2IVN-U
BUK9Y59-60E
400 V, 1 A,
PN rectifier in CFP3
600 W Transient Voltage
Suppressor in CFP5
60 V, low leakage Schottky
barrier rectifier in CFP3
CAN bus ESD protection in
SOD323
N-channel TrenchMOS FET
in LFPAK56
Key features and benefits
Reverse voltage VR ≤ 400 V
Low reverse current
Rated peak pulse power: PPPM =
600 W
Low inductance
Reverse standoff voltage range:
VRWM = 3.3 to 64 V
Small and flat lead SMD plastic
package
Small plastic package suitable for
surface-mounted designs
Clip-bond technology
Clip-bond technology
Extremely low leakage current
High-power capability due to clipbonding technology
High temperature
Tj ≤ 175 °C
AEC-Q101 qualified
Low forward voltage
Explore further automotive solutions at www.nxp.com/applications/automotive
Small-signal discretes for automotive
For applications that use a system-basis chip (SBC) for BCM functions, NXP’s high-power bipolar transistor PHPT60603PY
supports a reliable voltage supply with current requirements up to 250 mA.
Highlight products for body-control modules
PNS40010ER
PHPT60603PY
2N7002BKS
(N-ch ssMOS)
PUMH15
PESD1IVN-U
400 V, 1 A,
PN rectifier in SOT323
60 V, 3 A PNP high
power bipolar transistor
in LFPAK56
60 V, dual N-channel
Trench MOSFET in
SOT363
Dual NPN/NPN resistorequipped transistors in
SOT363
In-vehicle network ESD
protection diode in SOT323
Key features and benefits
Reverse voltage VR ≤ 400 V
Clip-bond technology
8
In automotive electronics, the term “body-control module (BCM)” refers to an electronic control unit responsible for monitoring
and controlling various electronic accessories in the body of the vehicle. The BCM typically controls power mirrors, lights, the
immobilizer system, central locking, and more. The BCM communicates with other on-board computers via the in-vehicle bus,
and its main application is controlling load drivers – that is, actuating low-side switches that in turn perform actions in the
vehicle, such as locking the doors or dimming the overhead lamp.
One very small SOT323 package
to protect two CAN bus lines
Typical diode capacitance
matching ΔC d/C d = 0.1 %
ESD protection up to 18 kV; IEC
61000-4-2, level 4
Q101 compliant
Repetitive avalanche rated
Suitable for thermally demanding
environments due to 175 °C rating
Low reverse current
Low inductance
Small and flat lead SMD plastic
package
Clip-bond technology
Supports high thermal power
dissipation
Suitable for high-temperature
applications to 175 °C
ESD protection up to 2 kV
Simplifies circuit design
Low clamping voltage: VCL = 38 V at IPP = 1 A
Logic-level compatible
Reduces component count
Typical diode capacitance matching ΔCd/Cd = 0.1 %
Fewer PCB requirements
compared to transistors in
DPAK
Low clamping voltage VCL = 38 V
at IPP = 1A
ESD protection up to 18 kV; IEC 61000-4-2, level 4
IEC 61000-4-5 (surge); IPP = 3 A at tp = 8/20 µs
AEC-Q101 qualified
In-vehicle network ESD protection for CAN, LIN,
FlexRay and Single Edge Nibble Transmission
(SENT) interfaces
Reverse standoff voltage
VRWM = 26.5 (DS)
Explore further automotive solutions at www.nxp.com/applications/automotive
Small-signal discretes for automotive
9
Infotainment / car radios
Our commitment: quality and reliability
} NXP’s automotive small-signal discretes are deployed in critical
applications – such as braking, power steering, and engine management
– where the requirements for quality and reliability go well beyond mere
compliance with AEC-Q101 standards.
} NXP has more than 15 years of experience of qualifying small-signal
discretes for automotive, and we’ve generated an impressive track
record of reliability.
} All our processes and manufacturing plants are subject to regular
international internal and external audits.
Infotainment is a type of media that combines information-based media content or programming with entertainment content
that is popular with consumers. Infotainment systems are typically built into the vehicle or can be added later to enhance the
driver and/or passenger experience.
} Our rigorous attention to detail and commitment to automotive quality
have yielded a sub-ppm combined line, field, and 0 km failure rate at
automotive customers.
Since a car radio is no longer just a radio, but a multimedia entertainment center, NXP’s small-signal Trench MOSFET
PMN42XPEA supports added features, like mobile-phone connectivity and charging.
Highlight products for infotainment / car radios
NUP1301 / NUP1301U
PHPT60603NY
PESD1LIN
PMN42XPEA
Ultra low capacitance ESD
protection in SOT23
60 V, 3 A NPN high power bipolar
transistor in LFPAK56
LIN-bus ESD protection in SOD323
20 V, P-channel Trench MOSFET
in SOT457
ESD protection for one automotive LIN-bus
line
ESD protection for one automotive LIN-bus
line
Asymmetrical diode configuration ensures
optimized protection against EMI of a LIN
(ECU)
Asymmetrical diode configuration ensures
optimized protection against EMI of a LIN
(ECU)
} NXP’s Design for Excellence (DfX) program ensures that each new
development builds on past learning and that best practices are always
employed. The result is continual product improvement.
Key features and benefits
ESD protection for one signal line
Supports high thermal power dissipation
Ultra-low diode capacitance: C d = 0.6 pF
High-temperature applications to 175 °C
ESD protection up to 30 k
Fewer PCB requirements compared to
transistors in DPAK
Explore further automotive solutions at www.nxp.com/applications/automotive
10
Small-signal discretes for automotive
} Our “Zero Defects” culture is supported by a dedicated team of
technical experts, specializing in product quality, failure analysis,
and process engineering, working at all stages of development and
production. Failure analysis is supported by a determination to find root
causes and to eliminate failure modes through widespread adoption of
quality-analysis tools and methodologies.
} Dedicated design and manufacturing facilities, focused on providing
automotive quality, are at the heart of NXP’s manufacturing setup. Every
process step for automotive products is carried out within NXP’s internal
and qualified partner facilities, from silicon and packaging design to
diffusion, assembly, and test.
Small-signal discretes for automotive
11
Visit www.nxp.com/applications/automotive
to learn more about NXP’s automotive
applications
www.nxp.com
© 2015 NXP Semiconductors N.V.
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Date of release: December 2015
Document order number: 9397 750 17703
Printed in the Netherlands