DFN2020D-6: plastic, thermally enhanced ultra thin and small outline package ...

SOT1118D
DFN2020D-6: plastic, thermally enhanced ultra thin and small
outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm
8 February 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
HUSON6
Package type industry code
DFN2020D-6
Package style descriptive code
HUSON (thermal enhanced ultra thin small
outline; no leads)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
IEC package outline code
---
JEDEC package outline code
---
JEITA package outline code
---
Mounting method type
S (surface mount)
Issue date
16-7-2014
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
1.9
-
2
2.1
mm
E
package width
1.9
-
2
2.1
mm
A
seated height
[tbd]
-
[tbd]
0.65
mm
e
nominal pitch
-
-
0.65
-
mm
n2
actual quantity of termination
-
-
6
-
SOT1118D
NXP Semiconductors
DFN2020D-6: plastic, thermally enhanced ultra
thin and small outline package; no leads; 6
terminals; body 2 x 2 x 0.65 mm
2. Package outline
DFN2020D-6: plastic, thermally enhanced ultra thin and small outline package; no leads;
6 terminals; body 2 x 2 x 0.65 mm
bp
(6x)
v
SOT1118D
A B
D
A
B
A
E
A1
pin 1
index area
detail X
solderable lead end
protrusion maximum 0.035 mm (6x)
D1
(2x)
pin 1
index area
1
C
e1
e1
y1 C
3
Lp
(6x)
cut-off end of
non-fuctional
bonding wire
(8x)
E1
(2x)
6
e
4
e
X
0
1
mm
A
A1
bp
max 0.65 0.04 0.35
nom 0.62
0.30
min 0.59
0.25
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
y
D
D1
E
E1
2.1
2.0
1.9
0.77
0.67
0.57
2.1
2.0
1.9
1.0
0.9
0.8
e
e1
Lp
0.54 0.30
0.65 0.49 0.25
0.44 0.20
v
0.1
y
y1
0.05 0.05
Note
1. Dimension A is including plating thickness.
Outline
version
SOT1118D
sot1118d_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
14-07-16
14-10-16
---
Fig. 1. Package outline DFN2020D-6 (SOT1118D)
SOT1118D
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1118D
NXP Semiconductors
DFN2020D-6: plastic, thermally enhanced ultra
thin and small outline package; no leads; 6
terminals; body 2 x 2 x 0.65 mm
3. Soldering
SOT1118D
2.2
1.65
0.2
0.3
0.45
0.35
0.25
0.65
0.53 0.43 0.33
solder lands
0.12 0.22
2.5 2.3
0.9
1
solder paste
1.1
solder resist
0.935
occupied area
Dimensions in mm
0.49
0.31
0.21
0.57
0.67
0.77
1.65
sot1118d_fr
Fig. 2. Reflow soldering footprint for DFN2020D-6 (SOT1118D)
SOT1118D
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1118D
NXP Semiconductors
DFN2020D-6: plastic, thermally enhanced ultra
thin and small outline package; no leads; 6
terminals; body 2 x 2 x 0.65 mm
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1118D
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1118D
NXP Semiconductors
DFN2020D-6: plastic, thermally enhanced ultra
thin and small outline package; no leads; 6
terminals; body 2 x 2 x 0.65 mm
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 February 2016
SOT1118D
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5