CY7C0831AV CY7C0832AV CY7C0833V FLEx18™ 3.3 V 128 K / 256 K / 512 K × 18 Synchronous Dual-Port RAM FLEx18™ 3.3 V 128 K / 256 K / 512 K × 18 Synchronous Dual-Port RAM Features Functional Description ■ True dual-ported memory cells that allow simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Family of 2-Mbit, 4-Mbit, and 9-Mbit devices ■ Pipelined output mode allows fast operation ■ 0.18 micron CMOS for optimum speed and power ■ High speed clock to data access ■ 3.3 V low power ❐ Active as low as 225 mA (typ) ❐ Standby as low as 55 mA (typ) ■ Mailbox function for message passing ■ Global master reset ■ Separate byte enables on both ports ■ Commercial and Industrial temperature ranges ■ IEEE 1149.1 compatible JTAG boundary scan ■ 144-ball FBGA (13 mm × 13 mm) (1.0 mm pitch) ■ 120-pin TQFP (14 mm × 14 mm × 1.4 mm) ■ Pb-free packages available ■ Counter wrap around control ❐ Internal mask register controls counter wrap around ❐ Counter-interrupt flags to indicate wrap around ❐ Memory block retransmit operation The FLEx18™ family includes 2-Mbit, 4-Mbit, and 9-Mbit pipelined, synchronous, true dual port static RAMs that are high speed, low power 3.3 V CMOS. Two ports are provided, permitting independent, simultaneous access to any location in memory. The result of writing to the same location by more than one port at the same time is undefined. Registers on control, address, and data lines allow for minimal setup and hold time. During a Read operation, data is registered for decreased cycle time. Each port contains a burst counter on the input address register. After externally loading the counter with the initial address, the counter increments the address internally (more details to follow). The internal Write pulse width is independent of the duration of the R/W input signal. The internal Write pulse is self-timed to allow the shortest possible cycle times. A HIGH on CE0 or LOW on CE1 for one clock cycle powers down the internal circuitry to reduce the static power consumption. One cycle with chip enables asserted is required to reactivate the outputs. ■ Counter readback on address lines ■ Mask register readback on address lines ■ Dual chip enables on both ports for easy depth expansion Additional features include: readback of burst-counter internal address value on address lines, counter-mask registers to control the counter wrap around, counter interrupt (CNTINT) flags, readback of mask register value on address lines, retransmit functionality, interrupt flags for message passing, JTAG for boundary scan, and asynchronous Master Reset (MRST). The CY7C0833V device in this family has limited features. See Address Counter and Mask Register Operations on page 8 for details. For a complete list of related documentation, click here. Product Selection Guide Density Part Number 2-Mbit (128 K × 18) 4-Mbit (256 K × 18) 9-Mbit (512 K × 18) CY7C0831AV CY7C0832AV CY7C0833V 133 167 100 Maximum Speed (MHz) Maximum Access Time - Clock to Data (ns) 4.0 4.0 4.7 Typical Operating Current (mA) 225 225 270 120-pin TQFP 120-pin TQFP 144-ball FBGA Package Cypress Semiconductor Corporation Document Number: 38-06059 Rev. *Y • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised November 27, 2014 CY7C0831AV CY7C0832AV CY7C0833V Logic Block Diagram  OEL R/WL OER R/WR B0L B0R B1L B1R CE0L CE1L DQ9L–DQ17L DQ0L–DQ8L CE0R CE1R I/O Control 9 I/O Control 9 9 9 Addr. Read Back DQ9R–DQ17R DQ0R–DQ8R Addr. Read Back True Dual-Ported RAM Array A0L–A18L 19 19 Mask Register CNT/MSKL ADSL Counter/ Address Register CNTENL CNTRSTL CLKL Mask Register Address Address Decode Decode INTL Logic CNTEN CNTRSTR Mirror Reg CNTINTL Interrupt ADS Counter/ Address Register Mirror Reg MRST Reset Logic TMS TDI TCK JTAG TDO Interrupt Logic A0R–A18R CNT/MSKR CLKR CNTINTR INTR Note 1. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. Document Number: 38-06059 Rev. *Y Page 2 of 32 CY7C0831AV CY7C0832AV CY7C0833V Contents Pin Configurations ........................................................... 4 Pin Definitions .................................................................. 6 Byte Select Operation ...................................................... 7 Master Reset ..................................................................... 7 Mailbox Interrupts ........................................................ 7 Address Counter and Mask Register Operations ........ 8 Counter Reset Operation ............................................ 9 Counter Load Operation .............................................. 9 Counter Increment Operation ...................................... 9 Counter Hold Operation ............................................ 10 Counter Interrupt ....................................................... 10 Counter Readback Operation .................................... 10 Retransmit ................................................................. 10 Mask Reset Operation ............................................... 10 Mask Load Operation ................................................ 10 Mask Readback Operation ........................................ 10 Counting by Two ....................................................... 10 IEEE 1149.1 Serial Boundary Scan (JTAG)  ........... 12 Performing a TAP Reset ........................................... 12 Performing a Pause/Restart ...................................... 12 Boundary Scan Hierarchy for 9-Mbit Device ............. 12 Identification Register Definitions ................................ 13 Scan Registers Sizes ..................................................... 13 Instruction Identification Codes .................................... 13 Maximum Ratings ........................................................... 14 Operating Range ............................................................. 14 Document Number: 38-06059 Rev. *Y Electrical Characteristics ............................................... 14 Capacitance .................................................................... 14 AC Test Load and Waveforms ....................................... 15 Switching Characteristics .............................................. 15 JTAG Timing and Switching Waveforms ..................... 17 Switching Waveforms .................................................... 18 Ordering Information ...................................................... 27 512 K × 18 (9 M) 3.3 V Synchronous CY7C0833V Dual-Port SRAM ............................................................... 27 256 K × 18 (4 M) 3.3 V Synchronous CY7C0832AV Dual-Port SRAM ............................................................... 27 128 K × 18 (2 M) 3.3 V Synchronous CY7C0831AV Dual-Port SRAM ............................................................... 27 Ordering Code Definitions ......................................... 27 Package Diagrams .......................................................... 28 Acronyms ........................................................................ 29 Document Conventions ................................................. 29 Units of Measure ....................................................... 29 Document History Page ................................................. 30 Sales, Solutions, and Legal Information ...................... 32 Worldwide Sales and Design Support ....................... 32 Products .................................................................... 32 PSoC® Solutions ...................................................... 32 Cypress Developer Community ................................. 32 Technical Support ..................................................... 32 Page 3 of 32 CY7C0831AV CY7C0832AV CY7C0833V Pin Configurations Figure 1. 144-ball BGA (Top View) CY7C0833V 1 2 3 4 5 6 7 8 9 10 11 12 A DQ17L DQ16L DQ14L DQ12L DQ10L DQ9L DQ9R DQ10R DQ12R DQ14R DQ16R DQ17R B A0L A1L DQ15L DQ13L DQ11L MRST NC DQ11R DQ13R DQ15R A1R A0R C A2L A3L CE1L  INTL CNTINTL  ADSL  ADSR  CNTINTR  INTR CE1R  A3R A2R D A4L A5L CE0L  NC VDD VDD VDD VDD NC CE0R  A5R A4R E A6L A7L B1L NC VDD VSS VSS VDD NC B1R A7R A6R F A8L A9L CL NC VSS VSS VSS VSS NC CR A9R A8R G A10L A11L B0L NC VSS VSS VSS VSS NC B0R A11R A10R H A12L A13L OEL NC VDD VSS VSS VDD NC OER A13R A12R J A14L A15 RWL NC VDD VDD VDD VDD NC RWR A15R A14R K A16L A17L CNT/MSKL  TDO CNTRSTL  TCK TMS CNTRSTR  TDI CNT/MSKR  A17R A16R L A18L NC DQ6L DQ4L DQ2L DQ2R DQ4R DQ6R NC A18R M DQ8L DQ7L DQ5L DQ3L DQ1L DQ1R DQ3R DQ5R DQ7R DQ8R CNTENL  CNTENR  DQ0L DQ0R Notes 2. These balls are not applicable for CY7C0833V device. They must be tied to VDD. 3. These balls are not applicable for CY7C0833V device. They must not be connected. 4. These balls are not applicable for CY7C0833V device. They must be tied to VSS. Document Number: 38-06059 Rev. *Y Page 4 of 32 CY7C0831AV CY7C0832AV CY7C0833V Pin Configurations (continued) Figure 2. 120-pin TQFP (Top View) A2L A3L VSS VDD A4L A5L A6L A7L CE1L B0L B1L OEL CE0L VDD VSS R/WL CLKL VSS ADSL CNTENL CNTRSTL CNT/MSKL A8L A9L A10L A11L A12L VSS VDD INTR DQ9R DQ10R DQ11R DQ15L DQ14L DQ13L VDD VSS DQ12L DQ11L DQ10L DQ9L INTL CNTINTL CNTINTR DQ12R VSS VDD DQ13R DQ14R DQ15R DQ16R DQ17R A0R A1R 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 A2R A3R VSS VDD A4R A5R A6R A7R CE1R B0R B1R OER CE0R VDD VSS R/WR CLKR MRST ADSR CNTENR CNTRSTR CNT/MSKR A8R A9R A10R A11R A12R VSS VDD A13R VDD DQ4R DQ5R DQ6R DQ7R DQ8R A17R  A16R A15R A14R DQ1R DQ2R DQ3R VSS DQ8L DQ7L DQ6L DQ5L DQ4L VDD VSS DQ3L DQ2L DQ1L DQ0L DQ0R A14L A15L A16L A17L  31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 A13L 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 A1L A0L DQ17L DQ16L CY7C0831AV / CY7C0832AV Note 5. Leave this pin unconnected for CY7C0831AV. Document Number: 38-06059 Rev. *Y Page 5 of 32 CY7C0831AV CY7C0832AV CY7C0833V Pin Definitions Left Port Right Port Description Address Inputs. ADSL A0R–A18R ADSR CE0L CE0R Active LOW Chip Enable Input.  CE1R Active HIGH Chip Enable Input. A0L–A18L CE1L  CLKL CLKR Address Strobe Input. Used as an address qualifier. This signal should be asserted LOW for the part using the externally supplied address on the address pins and for loading this address into the burst address counter. Clock Signal. Maximum clock input rate is fMAX. CNTENL  CNTENR CNTRSTL CNTRSTR Counter Reset Input. Asserting this signal LOW resets to zero the unmasked portion of the burst address counter of its respective port. CNTRST is not disabled by asserting ADS or CNTEN. CNT/MSKL CNT/MSKR Address Counter Mask Register Enable Input. Asserting this signal LOW enables access to the mask register. When tied HIGH, the mask register is not accessible and the address counter operations are enabled based on the status of the counter control signals. DQ0L–DQ17L DQ0R–DQ17R Data Bus Input/Output. OEL OER Output Enable Input. This asynchronous signal must be asserted LOW to enable the DQ data pins during Read operations. INTL INTR Mailbox Interrupt Flag Output. The mailbox permits communications between ports. The upper two memory locations are used for message passing. INTL is asserted LOW when the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a port is deasserted HIGH when it reads the contents of its mailbox. CNTINTL CNTINTR Counter Interrupt Output. This pin is asserted LOW when the unmasked portion of the counter is incremented to all ‘1s.’ R/WL R/WR Read/Write Enable Input. Assert this pin LOW to write to, or HIGH to Read from the dual port memory array. B0L–B1L B0R–B1R Byte Select Inputs. Asserting these signals enables Read and Write operations to the corresponding bytes of the memory array. Counter Enable Input. Asserting this signal LOW increments the burst address counter of its respective port on each rising edge of CLK. The increment is disabled if ADS or CNTRST are asserted LOW. MRST Master Reset Input. MRST is an asynchronous input signal and affects both ports. Asserting MRST LOW performs all of the reset functions as described in the text. A MRST operation is required at power up. TMS JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State machine transitions occur on the rising edge of TCK. TDI JTAG Test Data Input. Data on the TDI input is shifted serially into selected registers. TCK JTAG Test Clock Input. TDO JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is normally three-stated except when captured data is shifted out of the JTAG TAP. VSS Ground Inputs. VDD Power Inputs. Notes 6. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. 7. These balls are not applicable for CY7C0833V device. They must be tied to VSS. 8. These balls are not applicable for CY7C0833V device. They must be tied to VDD. 9. These balls are not applicable for CY7C0833V device. They must not be connected. Document Number: 38-06059 Rev. *Y Page 6 of 32 CY7C0831AV CY7C0832AV CY7C0833V Byte Select Operation Control Pin Effect B0 DQ0–8 Byte Control B1 DQ9–17 Byte Control Master Reset set the INTR flag, a Write operation by the left port to address 7FFFF asserts INTR LOW. At least one byte has to be active for a Write to generate an interrupt. A valid Read of the 7FFFF location by the right port resets INTR HIGH. At least one byte must be active for a Read to reset the interrupt. When one port Writes to the other port’s mailbox, the INT of the port that the mailbox belongs to is asserted LOW. The INT is reset when the owner (port) of the mailbox Reads the contents of the mailbox. The interrupt flag is set in a flow-through mode (that is, it follows the clock edge of the writing port). Also, the flag is reset in a flow-through mode (that is, it follows the clock edge of the reading port). The FLEx18 family devices undergo a complete reset by taking its MRST input LOW. The MRST input can switch asynchronously to the clocks. An MRST initializes the internal burst counters to zero, and the counter mask registers to all ones (completely unmasked). MRST also forces the Mailbox Interrupt (INT) flags and the Counter Interrupt (CNTINT) flags HIGH. MRST must be performed on the FLEx18 family devices after power up. Mailbox Interrupts Each port can read the other port’s mailbox without resetting the interrupt. And each port can write to its own mailbox without setting the interrupt. If an application does not require message passing, INT pins should be left open. The upper two memory locations may be used for message passing and permit communications between ports. Table 1 shows the interrupt operation for both ports of CY7C0833V. The highest memory location, 7FFFF is the mailbox for the right port and 7FFFE is the mailbox for the left port. Table 1 shows that to Table 1. Interrupt Operation Example [10, 11, 12, 13, 14, 15] Function Left Port Right Port R/WL CEL A0L–A18L INTL R/WR CER A0R–A18R INTR Set Right INTR Flag L L 3FFFF X X X X L Reset Right INTR Flag X X X X H L 3FFFF H Set Left INTL Flag X X X L L L 3FFFE X Reset Left INTL Flag H L 3FFFE H X X X X Set Right INTR Flag L L 3FFFF X X X X L Notes 10. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. 11. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 12. OE is “Don’t Care” for mailbox operation. 13. At least one of BE0, BE1 must be LOW. 14. A18x is a NC for CY7C0832AV, therefore the Interrupt Addresses are 3FFFF and 3FFFE. A18x and A17x are NC for CY7C0831AV, therefore the Interrupt addresses are 1FFFF and 1FFFE. 15. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 16. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. Document Number: 38-06059 Rev. *Y Page 7 of 32 CY7C0831AV CY7C0832AV CY7C0833V Address Counter and Mask Register Operations  This section describes the features only apply to 2-Mbit and 4-Mbit devices. It does not apply to 9 Mbit device. Each port of these devices has a programmable burst address counter. The burst counter contains three registers: a counter register, a mask register, and a mirror register. The counter register contains the address used to access the RAM array. It is changed only by the Counter Load, Increment, Counter Reset, and by master reset (MRST) operations. The mask register value affects the Increment and Counter Reset operations by preventing the corresponding bits of the counter register from changing. It also affects the counter interrupt output (CNTINT). The mask register is changed only by the Mask Load and Mask Reset operations and by the MRST. The mask register defines the counting range of the counter register. It divides the counter register into two regions: zero or more ‘0s’ in the most significant bits define the masked region, one or more ‘1s’ in the least significant bits define the unmasked region. Bit 0 may also be ‘0,’ masking the least significant counter bit and causing the counter to increment by two instead of one. The mirror register is used to reload the counter register on increment operations (see Retransmit on page 10). It always contains the value last loaded into the counter register, and is changed only by the Counter Load, and by the MRST instructions. Table 2 summarizes the operation of these registers and the required input control signals. The MRST control signal is asynchronous. All the other control signals in Table 2 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the port’s CLK. All these counter and mask operations are independent of the port’s chip enable inputs (CE0 and CE1). Counter enable (CNTEN) inputs are provided to stall the operation of the address input and use the internal address generated by the internal counter for fast, interleaved memory applications. A port’s burst counter is loaded when the port’s address strobe (ADS) and CNTEN signals are LOW. When the port’s CNTEN is asserted and the ADS is deasserted, the address counter increments on each LOW to HIGH transition of that port’s clock signal. This reads and writes one word from and to each successive address location until CNTEN s deasserted. The counter can address the entire memory array, and loops back to the start. Counter reset (CNTRST) is used to reset the unmasked portion of the burst counter to I/0s. A counter-mask register is used to control the counter wrap. Table 2. Address Counter and Counter-Mask Register Control Operation (Any Port) [18, 19] CLK MRST CNT/MSK X CNTRST ADS CNTEN L X X X X Master Reset Operation Reset address counter to all 0s and mask register to all 1s. Description H H L X X Counter Reset Reset counter unmasked portion to all 0s. H H H L L Counter Load Load counter with external address value presented on address lines. H H H L H Counter Readback Read out counter internal value on address lines. H H H H L Counter Increment Internally increment address counter value. H H H H H Counter Hold Constantly hold the address value for multiple clock cycles. H L L X X Mask Reset Reset mask register to all 1s. H L H L L Mask Load Load mask register with value presented on the address lines. H L H L H Mask Readback Read out mask register value on address lines. H L H H X Reserved Operation undefined Notes 17. This section describes the CY7C0832AV and CY7C0831AV having 18 and17 address bits. 18. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 19. Counter operation and mask register operation is independent of chip enables. Document Number: 38-06059 Rev. *Y Page 8 of 32 CY7C0831AV CY7C0832AV CY7C0833V Counter Reset Operation All unmasked bits of the counter are reset to ‘0.’ All masked bits remain unchanged. The mirror register is loaded with the value of the burst counter. A Mask Reset followed by a Counter Reset resets the counter and mirror registers to 00000, as does master reset (MRST). Counter Load Operation The address counter and mirror registers are both loaded with the address value presented at the address lines. Counter Increment Operation When the address counter register is initially loaded with an external address, the counter can internally increment the address value, potentially addressing the entire memory array. Only the unmasked bits of the counter register are incremented. The corresponding bit in the mask register must be a ‘1’ for a counter bit to change. The counter register is incremented by 1 if the least significant bit is unmasked, and by 2 if it is masked. If all unmasked bits are ‘1,’ the next increment wraps the counter back to the initially loaded value. If an Increment results in all the unmasked bits of the counter being ‘1s,’ a counter interrupt flag (CNTINT) is asserted. The next Increment returns the counter register to its initial value, which was stored in the mirror register. The counter address can instead be forced to loop to 00000 by externally connecting CNTINT to CNTRST. An increment that results in one or more of the unmasked bits of the counter being ‘0’ deasserts the counter interrupt flag. The example in Figure 3 shows the counter mask register loaded with a mask value of 0003Fh unmasking the first 6 bits with bit ‘0’ as the LSB and bit ‘16’ as the MSB. The maximum value the mask register can be loaded with is 3FFFFh. Setting the mask register to this value allows the counter to access the entire memory space. The address counter is then loaded with an initial value of 8h. The base address bits (in this case, the 6th address through the 16th address) are loaded with an address value but do not increment after the counter is configured for increment operation. The counter address starts at address 8h. The counter increments its internal address value until it reaches the mask register value of 3Fh. The counter wraps around the memory block to location 8h at the next count. CNTINT is issued when the counter reaches its maximum value. Figure 3. Programmable Counter-Mask Register Operation [21, 22] Example: Load Counter-Mask Register = 3F CNTINT H 0 0 0s 216 215 H X X Xs 216 215 Max Address Register L X X H X X 216 215 1 1 1 1 Unmasked Address X 0 0 1 0 0 Xs X 1 1 1 1 Mask Register bit-0 0 26 25 24 23 22 21 20 216 215 Max + 1 Address Register 1 26 25 24 23 22 21 20 Masked Address Load Address Counter = 8 0 1 1 1 Address Counter bit-0 26 25 24 23 22 21 20 Xs X 0 0 1 0 0 0 26 25 24 23 22 21 20 Notes 20. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together. 21. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. 22. The “X” in this diagram represents the counter upper bits. Document Number: 38-06059 Rev. *Y Page 9 of 32 CY7C0831AV CY7C0832AV CY7C0833V Counter Hold Operation The value of all three registers can be constantly maintained unchanged for an unlimited number of clock cycles. Such operation is useful in applications where wait states are needed, or when address is available a few cycles ahead of data in a shared bus interface. Counter Interrupt The counter interrupt (CNTINT) is asserted LOW when an increment operation results in the unmasked portion of the counter register being all ‘1s.’ It is deasserted HIGH when an Increment operation results in any other value. It is also de-asserted by Counter Reset, Counter Load, Mask Reset and Mask Load operations, and by MRST. Counter Readback Operation The internal value of the counter register can be read out on the address lines. Readback is pipelined; the address is valid tCA2 after the next rising edge of the port’s clock. If address readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) are three-stated. Figure 4 on page 11 shows a block diagram of the operation. Retransmit Retransmit is a feature that allows the Read of a block of memory more than once without the need to reload the initial address. This eliminates the need for external logic to store and route data. It also reduces the complexity of the system design and saves board space. An internal mirror register is used to store the initially loaded address counter value. When the counter unmasked portion reaches its maximum value set by the mask register, it wraps back to the initial value stored in this mirror register. If the counter is continuously configured in increment mode, it increments again to its maximum value and wraps back Document Number: 38-06059 Rev. *Y to the value initially stored into the mirror register. Thus, the repeated access of the same data is allowed without the need for any external logic. Mask Reset Operation The mask register is reset to all ‘1s,’ which unmasks every bit of the counter. Master reset (MRST) also resets the mask register to all ‘1s’. Mask Load Operation The mask register is loaded with the address value presented at the address lines. Not all values permit correct increment operations. Permitted values are of the form 2n – 1 or 2n – 2. From the most significant bit to the least significant bit, permitted values have zero or more ‘0s,’ one or more ‘1s,’ or one ‘0.’ Thus 3FFFF, 003FE, and 00001 are permitted values, but 3F0FF, 003FC, and 00000 are not. Mask Readback Operation The internal value of the mask register can be read out on the address lines. Readback is pipelined; the address is valid tCM2 after the next rising edge of the port’s clock. If mask readback occurs while the port is enabled (CE0 LOW and CE1 HIGH), the data lines (DQs) is three-stated. Figure 4 on page 11 shows a block diagram of the operation. Counting by Two When the least significant bit of the mask register is ‘0,’ the counter increments by two. This may be used to connect the × 18 devices as a 36-bit single port SRAM in which the counter of one port counts even addresses and the counter of the other port counts odd addresses. This even-odd address scheme stores one half of the 36-bit data in even memory locations, and the other half in odd memory locations. Page 10 of 32 CY7C0831AV CY7C0832AV CY7C0833V Figure 4. Counter, Mask, and Mirror Logic Block Diagram  CNT/MSK CNTEN Decode Logic ADS CNTRST MRST Bidirectional Address Lines Mask Register Counter/ Address Register Address RAM Decode Array CLK From Address Lines Load/Increment 17 Mirror 1 From Mask Register From Mask From Counter Increment Logic Wrap 17 17 To Readback and Address Decode 0 0 17 Counter 1 17 17 Bit 0 +1 Wrap Detect 1 +2 Wrap 0 1 0 17 To Counter Note 23. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. Document Number: 38-06059 Rev. *Y Page 11 of 32 CY7C0831AV CY7C0832AV CY7C0833V IEEE 1149.1 Serial Boundary Scan (JTAG)  The FLEx18 family devices incorporate an IEEE 1149.1 serial boundary scan test access port (TAP). The TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 compliant TAPs. The TAP operates using JEDEC-standard 3.3 V I/O logic levels. It is composed of three input connections and one output connection required by the test logic defined by the standard. Performing a TAP Reset A reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This reset does not affect the operation of the devices, and may be performed while the device is operating. An MRST must be performed on the devices after power up. Performing a Pause/Restart When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan chain outputs the next bit in the chain twice. For example, if the value expected from the chain is 1010101, the device outputs a 11010101. This extra bit causes some testers to report an erroneous failure for the devices in a scan test. Therefore the tester should be configured to never enter the PAUSE-DR state. Boundary Scan Hierarchy for 9-Mbit Device Internally, the CY7C0833V have two DIEs. Each DIE contain all the circuitry required to support boundary scan testing. The circuitry includes the TAP, TAP controller, instruction register, and data registers. The circuity and operation of the DIE boundary scan are described in detail below. The scan chain of each DIE are connected serially to form the scan chain of the CY7C0833V as shown in Figure 5 on page 12. TMS and TCK are connected in parallel to each DIE to drive all TAP controllers in unison. In many cases, each DIE is supplied with the same instruction. In other cases, it might be useful to supply different instructions to each DIE. One example would be testing the device ID of one DIE while bypassing the others. Each pin of FLEx18 family is typically connected to multiple DIEs. For connectivity testing with the EXTEST instruction, it is desirable to check the internal connections between DIEs and the external connections to the package. This is accomplished by merging the netlist of the devices with the netlist of the user’s circuit board. To facilitate boundary scan testing of the devices, Cypress provides the BSDL file for each DIE, the internal netlist of the device, and a description of the device scan chain. The user can use these materials to easily integrate the devices into the board’s boundary scan environment. Figure 5. Scan Chain for 9 Mb Device TDO TDO D2 TDI TDO D1 TDI TDI Note 24. Boundary scan is IEEE 1149.1-compatible. See Performing a Pause/Restart on page 12 for deviation from strict 1149.1 compliance. Document Number: 38-06059 Rev. *Y Page 12 of 32 CY7C0831AV CY7C0832AV CY7C0833V Identification Register Definitions Instruction Field Value Description Revision Number (31:28) 0h Reserved for version number. Cypress Device ID (27:12) C090h Defines Cypress part number for CY7C0832AV C091h Defines Cypress part number for CY7C0831AV Cypress JEDEC ID (11:1) 034h Allows unique identification of the DP family device vendor. ID Register Presence (0) 1 Indicates the presence of an ID register. Scan Registers Sizes Register Name Bit Size Instruction 4 Bypass 1 Identification 32 Boundary Scan n  Instruction Identification Codes Instruction Code Description EXTEST 0000 Captures the Input/Output ring contents. Places the BSR between the TDI and TDO. BYPASS 1111 Places the BYR between TDI and TDO. IDCODE 1011 Loads the IDR with the vendor ID code and places the register between TDI and TDO. HIGHZ 0111 Places BYR between TDI and TDO. Forces all device output drivers to a High Z state. CLAMP 0100 Controls boundary to 1/0. Places BYR between TDI and TDO. SAMPLE/PRELOAD 1000 Captures the input/output ring contents. Places BSR between TDI and TDO. NBSRST 1100 Resets the non-boundary scan logic. Places BYR between TDI and TDO. RESERVED All other codes Other combinations are reserved. Do not use other than the above. Note 25. See details in the device BSDL file. Document Number: 38-06059 Rev. *Y Page 13 of 32 CY7C0831AV CY7C0832AV CY7C0833V Maximum Ratings Output Current into Outputs (LOW) ............................ 20 mA Exceeding maximum ratings  may impair the useful life of the device. These user guidelines are not tested. Storage Temperature ............................... –65 °C to +150 °C Ambient Temperature with Power Applied .................................. –55 °C to +125 °C Static Discharge Voltage (JEDEC JESD22-A114-2000B) ................................ > 2000V Latch Up Current ................................................... > 200 mA Operating Range DC Voltage Applied to Outputs in High Z State ...................... –0.5 V to VDD + 0.5 V DC Input Voltage ........................... –0.5 V to VDD + 0.5 V Ambient Temperature VDD 0 °C to +70 °C 3.3 V ± 165 mV –40 °C to +85 °C 3.3 V ± 165 mV Range Supply Voltage to Ground Potential .............–0.5 V to +4.6 V Commercial Industrial Electrical Characteristics Over the Operating Range Parameter VOH VOL VIH VIL IOZ IIX1 IIX2 ICC ISB1 ISB2 ISB3 ISB4 ISB5 Description Output HIGH Voltage (VDD = Min, IOH= –4.0 mA) Output LOW Voltage (VDD = Min, IOL= +4.0 mA) Input HIGH Voltage Input LOW Voltage Output Leakage Current Input Leakage Current Except TDI, TMS, MRST Input Leakage Current TDI, TMS, MRST Operating Current for (VDD = Max, CY7C0831AV IOUT = 0 mA), Outputs Disabled CY7C0832AV CY7C0833V Standby Current (Both Ports TTL Level) CEL and CER VIH, f = fMAX Standby Current (One Port TTL Level) CEL | CER VIH, f = fMAX Standby Current (Both Ports CMOS Level) CEL and CER VDD – 0.2 V, f = 0 Standby Current (One Port CMOS Level) CEL | CER VIH, f = fMAX Operating Current (VDD = Max, CY7C0833V IOUT = 0 mA, f = 0) Outputs Disabled -167 -133 -100 Unit Min Typ Max Min Typ Max Min Typ Max 2.4 – – 2.4 – – 2.4 – – V – – 0.4 – – 0.4 – – 0.4 V 2.0 – – 2.0 – – 2.0 – – V – – 0.8 – – 0.8 – – 0.8 V –10 – 10 –10 – 10 –10 – 10 A –10 – 10 –10 – 10 –10 – 10 A –0.1 – 1.0 –0.1 – 1.0 –0.1 – 1.0 mA – 225 300 – 225 300 – – – mA – – – 90 – 115 – – 270 90 400 115 – – 200 90 310 115 mA mA – 160 210 – 160 210 – 160 210 mA – 55 75 – 55 75 – 55 75 mA – 160 210 – 160 210 – 160 210 mA – – – – 70 100 – 70 100 mA Capacitance Part Number  CY7C0831AV CY7C0832AV CY7C0833V Parameter Description Input Capacitance CIN COUT CIN COUT Test Conditions TA = 25 °C, f = 1 MHz, VDD = 3.3 V Output Capacitance Input Capacitance Output Capacitance Max 13 Unit pF 10 22 20 pF pF pF Notes 26. The voltage on any input or I/O pin can not exceed the power pin during power up. 27. Pulse width < 20 ns. 28. ISB1, ISB2, ISB3 and ISB4 are not applicable for CY7C0833V because it can not be powered down by using chip enable pins. 29. COUT also references CI/O. Document Number: 38-06059 Rev. *Y Page 14 of 32 CY7C0831AV CY7C0832AV CY7C0833V AC Test Load and Waveforms Figure 6. AC Test Load and Waveforms 3.3 V Z0 = 50 R = 50 R1 = 590 OUTPUT OUTPUT C = 10 pF C = 5 pF VTH = 1.5 V (a) Normal Load (Load 1) (b) Three-state Delay (Load 2) 3.0 V ALL INPUT PULSES R2 = 435 90% 10% Vss < 2 ns 90% 10% < 2 ns Switching Characteristics Over the Operating Range -167 Parameter fMAX2 tCYC2 tCH2 tCL2 tR tF tSA tHA tSB tHB tSC tHC tSW tHW tSD tHD tSAD tHAD tSCN tHCN tSRST Description Maximum Operating Frequency Clock Cycle Time Clock HIGH Time Clock LOW Time Clock Rise Time Clock Fall Time Address Setup Time Address Hold Time Byte Select Setup Time Byte Select Hold Time Chip Enable Setup Time Chip Enable Hold Time R/W Setup Time R/W Hold Time Input Data Setup Time Input Data Hold Time ADS Setup Time ADS Hold Time CNTEN Setup Time CNTEN Hold Time CNTRST Setup Time CY7C0832AV Min – 6.0 2.7 2.7 – – 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 0.6 2.3 Max 167 – – – 2.0 2.0 – – – – – – – – – – – – – – – -133 CY7C0831AV CY7C0832AV Min Max – 133 7.5 – 3.0 – 3.0 – – 2.0 – 2.0 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – 0.6 – 2.5 – -100 CY7C0833V Min – 10 4.0 4.0 – – 3.0 0.6 3.0 0.6 NA NA 3.0 0.6 3.0 0.6 NA NA NA NA NA Unit Max 100 – – – 3.0 3.0 – – – – – – – – – – – – – – – MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 30. Except JTAG signals (tr and tf < 10 ns [max.]). Document Number: 38-06059 Rev. *Y Page 15 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Characteristics (continued) Over the Operating Range Parameter tHRST tSCM tHCM tOE tOLZ[31, 32] tOHZ[31, 32] tCD2 tCA2 tCM2 tDC Description CNTRST Hold Time CNT/MSK Setup Time CNT/MSK Hold Time Output Enable to Data Valid OE to Low Z OE to High Z Clock to Data Valid Clock to Counter Address Valid Clock to Mask Register Readback Valid Data Output Hold After Clock HIGH tCKHZ[31, 32] Clock HIGH to Output High Z tCKLZ[31, 32] Clock HIGH to Output Low Z tSINT Clock to INT Set Time tRINT Clock to INT Reset Time tSCINT Clock to CNTINT Set Time tRCINT Clock to CNTINT Reset time Port to Port Delays tCCS Clock to Clock Skew Master Reset Timing tRS Master Reset Pulse Width tRS Master Reset Setup Time tRSR Master Reset Recovery Time tRSF Master Reset to Outputs Inactive tRSCNTINT Master Reset to Counter Interrupt Flag Reset Time -167 -133 -100 CY7C0832AV CY7C0831AV CY7C0832AV Min Max 0.6 – 2.5 – 0.6 – – 4.4 0 – 0 4.4 – 4.4 CY7C0833V Min 0.6 2.3 0.6 – 0 0 – Max – – – 4.0 – 4.0 4.0 – – 4.0 4.0 – – 1.0 – 0 1.0 0.5 0.5 0.5 0.5 Unit Min NA NA NA – – – – Max – – – 5.0 – 5.0 5.0 ns ns ns ns ns ns ns 4.4 4.4 – – NA NA ns ns 1.0 – 1.0 – ns 4.0 4.0 6.7 6.7 5.0 5.0 0 1.0 0.5 0.5 0.5 0.5 4.4 4.4 7.5 7.5 5.7 5.7 – 1.0 0.5 0.5 NA NA 5.0 5.0 10 10 NA NA ns ns ns ns ns ns 5.2 – 6.0 – 8.0 – ns 7.0 6.0 6.0 – – – – – 10.0 10.0 7.5 6.0 7.5 – – – – – 10.0 10.0 10 8.5 10 – – – – – 10.0 NA ns ns ns ns ns Notes 31. This parameter is guaranteed by design, but is not production tested. 32. Test conditions used are Load 2. Document Number: 38-06059 Rev. *Y Page 16 of 32 CY7C0831AV CY7C0832AV CY7C0833V JTAG Timing and Switching Waveforms Parameter CY7C0831AV/CY7C0832AV /CY7C0833V Unit Min Max Description fJTAG Maximum JTAG TAP Controller Frequency – 10 MHz tTCYC TCK Clock Cycle Time 100 – ns tTH TCK Clock HIGH Time 40 – ns tTL TCK Clock LOW Time 40 – ns tTMSS TMS Setup to TCK Clock Rise 10 – ns tTMSH TMS Hold After TCK Clock Rise 10 – ns tTDIS TDI Setup to TCK Clock Rise 10 – ns tTDIH TDI Hold After TCK Clock Rise 10 – ns tTDOV TCK Clock LOW to TDO Valid – 30 ns tTDOX TCK Clock LOW to TDO Invalid 0 – ns Figure 7. JTAG Switching Waveform tTH Test Clock TCK tTMSS tTL tTCYC tTMSH Test Mode Select TMS tTDIS tTDIH Test Data-In TDI Test Data-Out TDO tTDOX tTDOV Document Number: 38-06059 Rev. *Y Page 17 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms Figure 8. Master Reset tRS MRST ALL ADDRESS/ DATA LINES tRSF tRSS ALL OTHER INPUTS tRSR INACTIVE ACTIVE TMS CNTINT INT TDO Figure 9. Read Cycle[33, 34, 35, 36, 37] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSB tHB tSW tSA tHW tHA tSC tHC BE0–BE1 R/W ADDRESS DATAOUT An An+1 1 Latency An+2 tDC tCD2 Qn tCKLZ An+3 Qn+1 tOHZ Qn+2 tOLZ OE tOE Notes 33. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge. 34. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge. 35. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH. 36. The output is disabled (high-impedance state) by CE = VIH following the next rising edge of the clock. 37. Addresses need not be accessed sequentially because ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. Document Number: 38-06059 Rev. *Y Page 18 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 10. Bank Select Read [38, 39] tCH2 tCYC2 tCL2 CLK tHA tSA ADDRESS(B1) A0 A1 A3 A2 A4 A5 tHC tSC CE(B1) tCD2 tHC tSC tCD2 tHA tSA tDC A0 ADDRESS(B2) A1 tCKHZ Q3 Q1 Q0 DATAOUT(B1) tCD2 tCKHZ tDC tCKLZ A3 A2 A4 A5 tHC tSC CE(B2) tSC tCD2 tHC DATAOUT(B2) tCKHZ tCD2 Q4 Q2 tCKLZ Figure 11. Read-to-Write-to-Read (OE = LOW) [40, 41, 42, 43, 44] tCH2 tCYC2 tCKLZ tCL2 CLK CE tSC tHC tSW tHW R/W tSW tHW An ADDRESS tSA An+1 An+2 tHA DATAIN An+2 An+3 An+4 tSD tHD tCD2 tCKHZ Dn+2 tCD2 Qn DATAOUT Qn+3 tCKLZ READ NO OPERATION WRITE READ Notes 38. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx18 device from this data sheet. ADDRESS(B1) = ADDRESS(B2). 39. ADS = CNTEN= BE0 – BE1 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH. 40. Addresses need not be accessed sequentially because ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 41. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 42. During “No Operation,” data in memory at the selected address may be corrupted and should be rewritten to ensure data integrity. 43. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 44. CE0 = BE0 – BE1 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, because OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK. Document Number: 38-06059 Rev. *Y Page 19 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 12. Read-to-Write-to-Read (OE Controlled) [45, 46, 47, 48] tCH2 tCYC2 tCL2 CLK CE tSC tHC tSW tHW R/W ADDRESS tSW tHW An tSA An+1 An+2 tHA An+3 An+4 An+5 tSD tHD Dn+2 DATAIN Dn+3 tCD2 DATAOUT tCD2 Qn Qn+4 tOHZ OE READ WRITE READ Figure 13. Read with Address Counter Advance  tCH2 tCYC2 tCL2 CLK tSA ADDRESS tHA An tSAD tHAD ADS tSAD tHAD tSCN tHCN CNTEN tSCN DATAOUT tHCN Qx–1 READ EXTERNAL ADDRESS tCD2 Qx tDC Qn READ WITH COUNTER Qn+1 COUNTER HOLD Qn+2 Qn+3 READ WITH COUNTER Notes 45. Addresses need not be accessed sequentially because ADS = CNTEN = VIL with CNT/MSK = VIH constantly loads the address on the rising edge of the CLK. Numbers are for reference only. 46. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals. 47. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 48. CE0 = BE0 – BE1 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, because OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK. Document Number: 38-06059 Rev. *Y Page 20 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 14. Write with Address Counter Advance  tCH2 tCYC2 tCL2 CLK tSA tHA An ADDRESS INTERNAL ADDRESS An tSAD tHAD tSCN tHCN An+1 An+2 An+3 An+4 ADS CNTEN Dn DATAIN tSD Dn+1 tHD WRITE EXTERNAL ADDRESS Dn+1 WRITE WITH COUNTER Dn+2 Dn+3 WRITE COUNTER HOLD Dn+4 WRITE WITH COUNTER Figure 15. Counter Reset [50, 51] tCYC2 tCH2 tCL2 CLK tSA INTERNAL ADDRESS Ax tHW tSD tHD An 1 0 tSW Ap Am An ADDRESS tHA Ap Am R/W ADS CNTEN tSRST tHRST CNTRST DATAIN D0 tCD2 tCD2 DATAOUT  Q0 COUNTER RESET WRITE ADDRESS 0 tCKLZ READ ADDRESS 0 READ ADDRESS 1 Q1 READ ADDRESS An Qn READ ADDRESS Am Notes 49. CE0 = BE0 – BE1 = R/W = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, because OE = LOW, the Write operation cannot be completed (labelled as no operation). One clock cycle is required to three-state the I/O for the Write operation on the next rising edge of CLK. 50. CE0 = BE0 – BE1 = LOW; CE1 = MRST = CNT/MSK = HIGH. 51. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset. 52. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. Document Number: 38-06059 Rev. *Y Page 21 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 16. Readback State of Address Counter or Mask Register [53, 54, 55, 56] tCYC2 tCH2 tCL2 CLK tCA2 or tCM2 tSA tHA EXTERNAL ADDRESS A0–A16 An* An INTERNAL ADDRESS An+1 An An+2 An+4 An+3 tSAD tHAD ADS tSCN tHCN CNTEN tCD2 DATAOUT Qx-2 LOAD EXTERNAL ADDRESS tCKHZ Qx-1 Qn READBACK COUNTER INTERNAL ADDRESS INCREMENT tCKLZ Qn+1 Qn+2 Qn+3 Notes 53. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 54. Address in output mode. Host must not be driving address bus after tCKLZ in next clock cycle. 55. Address in input mode. Host can drive address bus after tCKHZ. 56. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines. Document Number: 38-06059 Rev. *Y Page 22 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 17. Left_Port (L_Port) Write to Right_Port (R_Port) Read [57, 58, 59] tCH2 tCYC2 tCL2 CLKL tHA tSA L_PORT ADDRESS An tSW tHW R/WL tCKHZ tSD L_PORT DATAIN CLKR tHD tCKLZ Dn tCYC2 tCL2 tCCS tCH2 R_PORT ADDRESS tSA tHA An R/WR tCD2 R_PORT Qn DATAOUT tDC Notes 57. CE0 = OE = ADS = CNTEN = BE0 – BE1 = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 58. This timing is valid when one port is writing, and other port is reading the same location at the same time. If tCCS is violated, indeterminate data is Read out. 59. If tCCS < minimum specified value, then R_Port is Read the most recent data (written by L_Port) only (2 * tCYC2 + tCD2) after the rising edge of R_Port's clock. If tCCS > minimum specified value, then R_Port is Read the most recent data (written by L_Port) (tCYC2 + tCD2) after the rising edge of R_Port's clock. Document Number: 38-06059 Rev. *Y Page 23 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 18. Counter Interrupt and Retransmit [60, 61, 62, 63, 64, 65] tCH2 tCYC2 tCL2 CLK tSCM tHCM CNT/MSK ADS CNTEN COUNTER INTERNAL ADDRESS 3FFFC 3FFFD 3FFFE tSCINT 3FFFF Last_Loaded Last_Loaded +1 tRCINT CNTINT Notes 60. A18x is a NC for CY7C0832AV, therefore the Interrupt Addresses are 3FFFF and 3FFFE. A18x and A17x are NC for CY7C0831AV, therefore the Interrupt addresses are 1FFFF and 1FFFE. 61. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value. 62. CE0 = OE = BE0 – BE1 = LOW; CE1 = R/W = CNTRST = MRST = HIGH. 63. CNTINT is always driven. 64. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value. 65. The mask register assumed to have the value of 3FFFFh. Document Number: 38-06059 Rev. *Y Page 24 of 32 CY7C0831AV CY7C0832AV CY7C0833V Switching Waveforms (continued) Figure 19. MailBox Interrupt Timing [66, 67, 68, 69, 70] tCH2 tCYC2 tCL2 CLKL tSA L_PORT ADDRESS tHA 7FFFF An+1 An An+2 An+3 tSINT tRINT INTR tCH2 tCYC2 tCL2 CLKR tSA R_PORT ADDRESS Am tHA Am+1 7FFFF Am+3 Am+4 Notes 66. CE0 = OE = ADS = CNTEN = LOW; CE1 = CNTRST = MRST = CNT/MSK = HIGH. 67. Address “7FFFF” is the mailbox location for R_Port of the 9Mb device. 68. L_Port is configured for Write operation, and R_Port is configured for Read operation. 69. At least one byte enable (BE0 – BE1) is required to be active during interrupt operations. 70. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock. Document Number: 38-06059 Rev. *Y Page 25 of 32 CY7C0831AV CY7C0832AV CY7C0833V Table 3. Read/Write and Enable Operation (Any Port) [71, 72, 73, 74, 75] Inputs OE Operation CE0 CE1 R/W DQ0–DQ17 X H X X High Z Deselected X X L X High Z Deselected X L H L DIN Write L L H H DOUT Read L H X High Z Outputs Disabled H CLK Outputs X Notes 71. CY7C0831AV has 17 address bits, CY7C0832AV has 18 address bits and CY7C0833V has 19 address bits. 72. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW. 73. OE is an asynchronous input signal. 74. When CE changes state, deselection and Read happen after one cycle of latency. 75. CE0 = OE = LOW; CE1 = R/W = HIGH. Document Number: 38-06059 Rev. *Y Page 26 of 32 CY7C0831AV CY7C0832AV CY7C0833V Ordering Information Cypress offers other versions of this type of product in many different configurations and features. The following table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress website at http://www.cypress.com and refer to the product summary page at http://www.cypress.com/products or contact your local sales representative. Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives and distributors. To find the office closest to you, visit us at http://www.cypress.com/go/datasheet/offices. 512 K × 18 (9 M) 3.3 V Synchronous CY7C0833V Dual-Port SRAM Speed (MHz) 100 Ordering Code CY7C0833V-100BBI Package Diagram Package Type 51-85141 144-ball Ball Grid Array (13 × 13 × 1.6 mm) with 1 mm pitch Operating Range Industrial 256 K × 18 (4 M) 3.3 V Synchronous CY7C0832AV Dual-Port SRAM Speed (MHz) Ordering Code Package Diagram Package Type Operating Range 167 CY7C0832AV-167AXC 51-85100 120-pin Thin Quad Flat Pack (14 × 14 × 1.4 mm) (Pb-free) Commercial 133 CY7C0832AV-133AXI 51-85100 120-pin Thin Quad Flat Pack (14 × 14 × 1.4 mm) (Pb-free) Industrial 128 K × 18 (2 M) 3.3 V Synchronous CY7C0831AV Dual-Port SRAM Speed (MHz) 133 Ordering Code CY7C0831AV-133AXI Package Diagram Package Type 51-85100 120-pin Thin Quad Flat Pack (14 × 14 × 1.4 mm) (Pb-free) Operating Range Industrial Ordering Code Definitions CY 7 C 083X XX - XXX XX X X Temperature Range: X = C or I C = Commercial; I = Industrial X = Pb-free (RoHS Compliant) Package Type: XX = BB or A BB = 144-ball BGA A = 120-pin TQFP Speed Grade: XXX = 100 MHz or 167 MHz or 133 MHz XX = V/AV = 3.3 V 083X = 0833 or 0832 or 0831 0833 = 512 K × 18 (9 M) 0832 = 256 K × 18 (4 M) 0831 = 128 K × 18 (2 M) Technology Code: C = CMOS Marketing Code: 7 = Dual Port SRAM Company ID: CY = Cypress Document Number: 38-06059 Rev. *Y Page 27 of 32 CY7C0831AV CY7C0832AV CY7C0833V Package Diagrams Figure 20. 144-ball FBGA (13 × 13 × 1.6 mm) BB144 Package Outline, 51-85141 51-85141 *E Figure 21. 120-pin TQFP (14 × 14 × 1.4 mm) A120S Package Outline, 51-85100 51-85100 *C Document Number: 38-06059 Rev. *Y Page 28 of 32 CY7C0831AV CY7C0832AV CY7C0833V Acronyms Acronym Document Conventions Description Units of Measure BGA Ball Grid Array CE Chip Enable °C degree Celsius CMOS Complementary Metal Oxide Semiconductor MHz megahertz FBGA Fine-Pitch Ball Grid Array µA microamperes I/O Input/Output mA milliamperes JEDEC Joint Electron Devices Engineering Council mm millimeter JTAG Joint Test Action Group mV millivolts OE Output Enable SRAM Static Random Access Memory TAP Test Access Port TCK Test Clock TDI Test Data-In TDO Test Data-Out TMS Test Mode Select TQFP Thin Quad Flat Pack TTL Transistor-Transistor Logic Document Number: 38-06059 Rev. *Y Symbol Unit of Measure ns nanoseconds ohms % percent pF picofarad V volts Page 29 of 32 CY7C0831AV CY7C0832AV CY7C0833V Document History Page Document Title: CY7C0831AV/CY7C0832AV/CY7C0833V, FLEx18™ 3.3 V 128 K / 256 K / 512 K × 18 Synchronous Dual-Port RAM Document Number: 38-06059 Rev. ECN No. Orig. of Change Submission Date Description of Change ** 111473 DSG 11/27/01 Change from Spec number: 38-01056 to 38-06059 *A 111942 JFU 12/21/01 Updated capacitance values Updated switching parameters and ISB3 Updated “Read-to-Write-to-Read (OE Controlled)” waveform Revised static discharge voltage Revised footnote regarding ISB3 *B 113741 KRE 04/02/02 Updated ISH values Updated ESD voltage Corrected 0853 pins L3 and L12 *C 114704 KRE 04/24/02 Added discussion of Pause/Restart for JTAG boundary scan *D 115336 KRE 07/01/02 Revised speed offerings for all densities *E 122307 RBI 12/27/02 Power up requirements added to Maximum Ratings Information *F 123636 KRE 1/27/03 Revise tCD2, tOE, tOHZ, tCKHZ, tCKLZ for the CY7C0853V to 4.7 ns *G 126053 SPN 08/11/03 Separated out 4M and 9M data sheets Updated ISB and ICC values *H 129443 RAZ 11/03/03 Updated ISB and ICC values *I 231993 YDT See ECN Removed “A particular port can write to a certain location while another port is reading that location.” from Functional Description. *J 231813 WWZ See ECN Removed × 36 devices (CY7C0852/CY7C0851) from this datasheet. Added 0.5 M, 1 M and 9 M × 18 devices to it. Changed title to FLEx18 3.3 V 32 K/64 K/128 K/256 K/512 K × 18 Synchronous Dual-Port RAM. Changed datasheet to accommodate the removals and additions. Removed general JTAG description. Updated JTAG ID codes for all devices. Added 144-ball FBGA package for all devices. Updated selection guide table and moved to the front page. Updated block diagram to reflect × 18 configuration. Added preliminary status back due to the addition of the new devices. *K 311054 RYQ See ECN Minor Change: Correct the revision indicated on the footer. *L 329111 SPN See ECN Updated Marketing part numbers Updated tRSF *M 330561 RUY See ECN Added Byte Select Operation Table *N 375198 YDT See ECN Removed Preliminary status Added ISB5 Changed tRSCNTINT to 10ns *O 391525 SPN See ECN Updated Counter reset section to reflect what is loaded into the mirror register *P 414109 LIJ See ECN Corrected Ordering Codes for 0831 devices in the 133 MHz speed bin. Added CY7C0833AV-133BBI. *Q 461113 YDT SEE ECN Changed VDDIO to VDD (typo) Added lead(Pb)-free parts Corrected typo in DC table *R 2544945 VKN/AESA 07/29/08 Updated Template. Updated ordering information *S 2668478 VKN/PYRS 02/04/09 Added CY7C0832BV part Added footnote #1 Updated Ordering information table Document Number: 38-06059 Rev. *Y Page 30 of 32 CY7C0831AV CY7C0832AV CY7C0833V Document History Page (continued) Document Title: CY7C0831AV/CY7C0832AV/CY7C0833V, FLEx18™ 3.3 V 128 K / 256 K / 512 K × 18 Synchronous Dual-Port RAM Document Number: 38-06059 Rev. ECN No. Orig. of Change Submission Date *T 2897087 RAME 03/22/10 *U 3051710 ADMU 10/07/2010 Updated Ordering Information: Removed inactive part CY7C0831AV-133BBXI. Removed mention of previously removed parts. Added Ordering Code Definitions. Added TOC *V 3351984 ADMU 08/23/2011 Updated Features. Updated Product Selection Guide. Updated Pin Configurations. Updated Boundary Scan Hierarchy for 9-Mbit Device. Updated Switching Characteristics. Added Acronyms and Units of Measure. Updated in new template. *W 3403638 ADMU 10/13/2011 Updated Ordering Information (Removed pruned part CY7C0832AV-133AXC). Updated Package Diagrams. *X 4496013 ADMU 09/08/2014 Removed CY7C0832BV related information in all instances across the document. Updated Ordering Information (Updated part numbers). Updated Package Diagrams: spec 51-85141 – Changed revision from *D to *E. Updated in new template. Y 4581625 ADMU 11/27/2014 Added related documentation hyperlink in page 1. Updated Figure 21 in Package Diagrams (spec 51-85100 *B to *C). Document Number: 38-06059 Rev. *Y Description of Change Updated Ordering Information (Removed obsolete parts). Updated Package Diagrams. Page 31 of 32 CY7C0831AV CY7C0832AV CY7C0833V Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/plc Memory cypress.com/go/memory PSoC cypress.com/go/psoc Touch Sensing PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training Technical Support cypress.com/go/support cypress.com/go/touch USB Controllers Wireless/RF psoc.cypress.com/solutions cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2001-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 38-06059 Rev. *Y Revised November 27, 2014 Page 32 of 32 FLEx18 is a trademark of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders.