This document is a declaration of the substances within the manufacturer listed item. Note: if the item is an assembly with lower level parts, the declaration encompasses all lower level materials for which the manufacturer has © Copyright 2005. IPC, Bannockburn, Illinois. All rights reserved under engineering responsibility. both international and Pan-American copyright conventions. Adobe Reader version 7.0.5 is required to complete this declaration. Material Composition Declaration 1752-2 IPC Web Site for Information on IPC-1752 Standard http://www.ipc.org/IPC-175x 1.1 Form Type * Distribute Declaration Class * Class 6 - RoHS Yes/No, Homogeneous Materials and Mfg Informat Supplier Information Company Name * Company Unique ID Unique ID Authority Response Date * Cypress Semiconductor CorpCYPRESS Contact Name * Title - Contact Phone - Contact * 2009-09-16 Email - Contact * Richard Oshiro QA Engrg Director Authorized Representative * Title - Representative 408/943-2102 Phone - Representative * [email protected] Email - Representative * Supplier Comments or URL for Additional Information Glorioso Lutrinia http://app.cypress.com/portal/server.pt?space=Community Requester Item Number EH & S Manager Sr. 632 8128161 [email protected] Mfr Item Number Mfr Item Name Effective Date 52 - BGA (4.5 x 7 mm) 52 - BGA (4.5 x 7 mm) 2009-09-16 Alternate Recommendation Version Response Document ID Duplicate Manufacturing Site Contact -> Authorized Representative Weight * UOM ASE Taiwan 56 mg Package QTP No. 33105 Alternate Item Comments Unit Type Each Manufacturing Process Information Terminal Plating / Grid Array Material Tin/Silver/Copper (Sn/Ag/Cu) Terminal Base Alloy CU Alloy J-STD-020 MSL Rating 3 Peak Process Body Temperature Max Time at Peak Temperature Number of Reflow Cycles 260 C 20 seconds 3 Comments Compliant to RoHS Requirements * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe Save the fields in this form to a file Export Data Import fields from a file into this form Import Data Clear all of the fields on this form Reset Form Lock the fields on this form to prevent changes RoHS Material Composition Declaration Declaration Type * Lock Supplier Fields Detailed RoHS Directive RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) in homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), 2002/95/EC Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material for Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2002/95/EC and implemented by the laws of the European Union member states) of the part identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a “RoHS restricted substance”) in excess of the applicable quantity limit identified above. If a homogeneous material within the part contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part, and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part,the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Supplier's Standard Terms and Conditions of Sale applicable to such part shall apply. Supplier Acceptance * Accepted RoHS Declaration * 1 - Item(s) does not contain RoHS restricted substances per the definition above Exemptions: If the declared item does not contain RoHS restricted substances per the definition above except for defined RoHS exemptions, then select the corresponding response in the RoHS Declaration above and choose all applicable exemptions. Declaration Signature Instructions: Complete all of the required fields on all pages of this form. Select the "Accepted" on the Supplier Acceptance drop-down. This will display the signature area. Digitally sign the declaration (if required by the Requester) and click on Submit Form to have the form returned to the Requester. Supplier Digital Signature Glorioso Lutrinia * Required Field Digitally signed by Glorioso Lutrinia DN: cn=Glorioso Lutrinia, o=Cypress Semiconductor Corporation, ou, [email protected], c=PH Date: 2009.09.24 11:44:37 +08'00' CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe Homogeneous Material Composition Declaration for Electronic Products SubItem Instructions: The presence of any JIG Level A or B substances must be declared. [1] indicate the subpart in which the substance is located, [2] provide a description of the homogeneous material [3], enter the weight of the homogeneous material. Substance Instructions: [A] select the Level (JIG A, JIG B, Requester or Supplier) [B] select the substance category (JIG or Requester) or enter a value (Supplier). [C] select the substance (JIG) or enter the substance and CAS (Other). [D] select a RoHS exemption, if applicable [E] enter the weight of the substance or the PPM concentration [F] Optionally enter the positive (+) and negative (-) tolerance in percent (Note: percent tolerance values are expected to cover a 3 sigma range of distribution unless otherwise noted). Line Functions: +I Inserts a New Item /SubItem +M Inserts a new Material Item/SubItem Name Homogeneous Material +I -I Substrate +M -M Base Material +I -I Leadfinish Weight Unit of Measure 15.05 mg +M -M External Plating 5.45 +I -I Die Attach +M -M Adhesive 4.33 mg mg Level +C Inserts a new Substance Category Substance Category +S Inserts a new Substance Substance CAS - Deletes the element line Exempt Weight Unit of Tolerance PPM Measure + +C -C Supplier Silica +S -S Silica 60676-86-0 1.66 mg 29,600 +C -C Supplier Acrylic +S -S Acrylic 29690-82-2 1.51 mg 26,900 +C -C Supplier Epoxy +S -S Epoxy 68541-56-0, 1.2 mg 21,500 +C -C Supplier Bisphenol +S -S Bisphenol 13676-54-5 2.26 mg 40,300 +C -C Supplier Triazol +S -S Triazol 25722-66-1 2.63 mg 47,000 +C -C Supplier Cu +S -S Cu 7440-50-8 5.48 mg 97,800 +C -C Supplier Ni +S -S Ni *7440-02-0 0.22 mg 4,000 +C -C Supplier Au +S -S Au 7440-57-5 0.08 mg 1,500 +C -C Supplier Br +S -S Br 7726-95-6 0.01 mg 100 +C -C Supplier Sn +S -S Sn 7440-31-5 5.2 mg 92,800 +C -C Supplier Ag +S -S Ag 7440-22-4 0.22 mg 4,000 +C -C Supplier Cu +S -S Cu 7440-50-8 0.03 mg 500 +C -C Supplier Silica Fused +S -S Silica Fused 60676-86-0 2.34 mg 41,700 +C -C Supplier Diester +S -S Diester ---------------- 1.19 mg 21,200 +C -C Supplier Epoxy Resin +S -S Epoxy Resin ---------------- 0.24 mg 4,200 +C -C Supplier Functionalized Esters +S -S Functionalized Esters ---------------- 0.43 mg 7,700 +C -C Supplier Polymeric Resin +S -S Polymeric Resin ---------------- 0.13 mg 2,300 +I -I Die +M -M Silicon Die 2.77 mg +C -C Supplier Si +S -S Si 7440-21-3 2.77 mg 49,500 +I -I Goldwire +M -M Interconnect 1.79 mg +C -C Supplier Au +S -S Au 7440-57-5 1.79 mg 32,000 +I -I Mold Compound +M -M Encapsulation 26.62 mg +C -C Supplier Silica Fused +S -S Silica Fused 60676-86-0 23.7 mg 423,20 +C -C Supplier Epoxy Resin +S -S Epoxy Resin ---------------- 1.46 mg 26,100 +C -C Supplier Phenolic Resin +S -S Phenolic Resin ---------------- 1.46 mg 26,100 * Required Field CAS Registry Number(R) is a Registered Trademark of the American Chemical Society Form enabled by Adobe