60L FN60A WLCSP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

60L – FN60A WLCSP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FN
15.3862 mg
Body Size (mm)
Package Weight – Site 2
3.79x3.88x0.55mm
13.7584 mg
SUMMARY
The 49ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Amkor Technology Hsin-chu Taiwan (T5)
Package Qualification Report # 112212 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
SUBSTANCES / COMPOUNDS
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-FN60Amkor Taiwan
(T5)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 1 of 7
60L – FN60A WLCSP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Polyimide1
Polyimide2
RDL Seed
Layer
Copper
Under
Bump
Metallizatio
n
Solder Ball
Die
Laminate
Tape(22um)
Purpose
Dielectric
Dielectric
Seed Layer
Seed Layer
Seed Layer
Interconnec
t
UBM
UBM
UBM
UBM
UBM
Interconnec
t
Interconnec
t
Interconnec
t
Circuit
Mark
Surface
Substance
Compositio
n
1-Methyl-2Pyrrolidinone
Methanol
Methacrylate
compounds
Polyimide
Resin
1-Methyl-2Pyrrolidinone
Methanol
Methacrylate
compounds
Polyimide
Resin
Ti
W
Cu
CAS Number
Weight
by mg
% weight of
substance
per
Homogenou
s material
PPM
% weight
of
substanc
e per
package
872-50-4
0.0065
3.9301%
425
0.0425%
67-56-1
0.0036
2.1834%
236
0.0236%
Trade Secret
0.0109
6.5502%
708
0.0708%
Trade Secret
0.1455
87.3364%
9,442
0.94412%
872-50-4
0.0062
3.9301%
402
0.0402%
67-56-1
0.0034
2.1834%
223
0.0223%
Trade Secret
0.0103
6.5502%
670
0.0670%
Trade Secret
0.1374
87.3362%
8,933
0.8933%
7440-32-6
7440-33-7
7440-50-8
0.0007
0.0063
0.0060
5.4094%
48.6040%
45.9866%
46
412
390
0.0046%
0.0412%
0.0390%
Cu
7440-50-8
0.2001
100.0000%
13,003
1.3003%
Ti
W
Cu
Ni
Au
7440-32-6
7440-33-7
7440-50-8
7440-02-0
7440-57-5
0.0003
0.0028
0.0027
0.0388
0.0210
0.4816%
4.3275%
4.0945%
59.0903%
32.0061%
0.0021%
0.0185%
0.0175%
0.2522%
0.1366%
Sn
7440-31-5
3.4702
95.5000%
21
185
175
2,522
1,366
225,53
8
Ag
7440-22-4
0.1417
3.9000%
9,210
0.9210%
Cu
7440-50-8
0.0218
0.6000%
1,417
0.1417%
Si
7440-21-3
10.6000
100.0000%
688,93
0
68.8930%
Acrylic
polymer
Trade Secret
0.5500
100.0000%
35,746
3.5746%
% Total:
100.000
0
Package Weight (mg):
15.386
2
22.5538%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 2 of 7
60L – FN60A WLCSP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Others
Material
Cover tape
Carrier tape
Plastic Reel
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 3 of 7
60L – FN60A WLCSP
Pb-Free Package
ASSEMBLY Site 2: Deca Technologies Inc. Philippines (Decatech)
Package Qualification Report # 120808 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
SUBSTANCES / COMPOUNDS
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-FN60Decatech
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 4 of 7
60L – FN60A WLCSP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose
Polyimide1
Polyimide2
Dielectric
Dielectric
Seed Layer
Seed Layer
Seed Layer
Interconnec
t
UBM
UBM
UBM
UBM
Interconnec
t
Interconnec
t
Interconnec
t
RDL Seed
Layer
Copper
Under
Bump
Metallizatio
n
Solder Ball
Die
Laminate
Tape(22um)
Circuit
Mark
Surface
Proprietary
Proprietary
Ti
W
Cu
Trade Secret
Trade Secret
7440-32-6
7440-33-7
7440-50-8
0.1338
0.1339
0.0007
0.0108
0.0103
% weight of
substance
per
Homogenou
s material
100.0000
100.0000
3.0300
49.6700
47.3000
9,726
9,730
48
788
750
% weight
of
substanc
e per
package
0.9726
0.9730
0.0048
0.0788
0.0750
Cu
7440-50-8
0.3441
100.0000
25,009
2.5009
Ti
W
Cu
Cu
7440-32-6
7440-33-7
7440-50-8
7440-02-0
0.0006
0.0105
0.0100
0.1634
0.3500
5.6794
5.4095
88.5611
0.0047
0.0761
0.0725
1.1873
7440-31-5
3.1197
93.9100
47
761
725
11,873
226,74
8
Sn
Ag
7440-22-4
0.1820
5.4800
13,232
1.3232
Cu
7440-50-8
0.0203
0.6100
1,473
0.1473
Si
7440-21-3
8.8746
100.0000
645,03
7
64.5037
Acrylic
polymer
Trade Secret
0.7437
100.0000
54,053
5.4053
% Total:
100.000
0
Substance
Compositio
n
CAS Number
Package Weight (mg):
Weight
by mg
13.758
4
PPM
22.6748
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 5 of 7
60L – FN60A WLCSP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Others
Material
Cover tape
Carrier tape
Plastic Reel
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 6 of 7
60L – FN60A WLCSP
Pb-Free Package
Document History Page
Document Title:
Document Number:
60L - FN60A WLCSP PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-78053
Rev.
ECN No.
**
*A
*B
3563905
3610577
4064282
Orig. of
Change
JSO
JSO
YUM
*C
*D
4743012
5261331
HLR
HLR
MEL
Description of Change
New Specification
Added data for assembly site 2
Added assembly site name in the assembly heading in
site 1 and 2.
Changed Assembly code to assembly site name in site
1 and 2.
Removed Tray and Tube materials in the Indirect
Materials section.
Sunset Due – No Change
Changed the substances with “------------- “ and
Proprietary to “Trade Secret
Removed distribution and posting from the document
history page.
Changed Cypress Logo.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-78053 Rev. *D
Page 7 of 7
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