60 BGA (5.5X5.5X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BU
B1 : 29.2610 mg
Body Size (mil/mm)
Package Weight – Site 2
B2 : 29.0831 mg
5.5 x 5.5 x 0.6mm
B1 : 29.5333 mg
B2 : 29.3831 mg
SUMMARY
The 60L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 121302, 123605 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BU60ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 1 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Goldwire Material
Material
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Die
Wire
Mold
Compound
Substance
Composition
Purpose of Use
Adhesive
Circuit
Interconnect
Encapsulation
CAS Number
SiO2
Acrylic
60676-86-0
Trade Secret
Epoxy
Trade Secret
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Au
Ion impurities
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
80-08-0
67762-90-7
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
1333-86-4
Package Weight (mg):
1.0466
11.0000
35,767
% weight
of
substance
per
package
3.5767
0.9514
0.7611
10.0000
32,515
3.2515
1.4272
1.6650
3.4680
0.1427
0.0523
3.5393
0.0359
0.0180
8.0000
15.0000
17.5000
36.4500
1.5000
0.5500
98.5000
1.0000
0.5000
26,012
48,773
56,902
118,519
4,877
1,788
120,958
1,228
614
2.6012
4.8773
5.6902
11.8519
0.4877
0.1788
12.0958
0.1228
0.0614
1.2749
0.2920
0.1460
65.5000
15.0000
7.5000
43,570
9,978
4,989
4.3579
0.9978
0.4989
0.0584
0.0584
3.0000
3.0000
1,996
1,996
0.1996
0.1996
0.0584
0.0584
3.2770
1.3321
0.0001
8.6092
0.5279
0.4319
0.0288
3.0000
3.0000
100.0000
99.9900
0.0100
89.7000
5.5000
4.5000
0.3000
1,996
1,996
111,992
45,524
4.553
294,223
18,040
14,760
984
0.1996
0.1996
11.1992
4.5524
0.0004
29.4223
1.8040
1.4760
0.0984
% Total:
100.0000
Weight by
mg
29.2610
% weight of
substance per
Homogenous
material
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 2 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper/Palladium Wire Material
Material
Purpose of Use
Substrate
Base Material
Solder Ball
External Plating
Die Attach
Die
Wire
Mold
Compound
Adhesive
Circuit
Interconnect
Encapsulation
Substance
Composition
1.0466
% weight of
substance per
Homogenous
material
11.0000
35,986
3.5986
0.9514
0.7611
10.0000
8.0000
32,714
26,172
3.2714
2.6172
1.4272
1.6650
3.4680
0.1427
0.0523
3.5393
0.0359
0.0180
15.0000
17.5000
36.4500
1.5000
0.5500
98.5000
1.0000
0.5000
49,072
57,250
119,244
4,907
1,799
121,698
1,236
618
4.9072
5.7250
11.9244
0.4907
0.1799
12.1698
0.1236
0.0618
1.2749
0.2920
0.1460
65.5000
15.0000
7.5000
43,837
10,039
5,019
4.3837
1.0039
0.5019
0.0584
3.0000
2,008
0.2008
0.0584
3.0000
2,008
0.2008
Trade Secret
7440-21-3
7440-50-8
0.0584
0.0584
3.2770
1.1231
3.0000
3.0000
100.0000
97.3000
0.2008
0.2008
11.2677
3.8616
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0312
8.6092
0.5279
0.4319
0.0288
2.7000
89.7000
5.5000
4.5000
0.3000
2,008
2,008
112,677
38,616
1,071.5
54
296,023
18,151
14,851
990
CAS Number
SiO2
Acrylic
60676-86-0
Trade Secret
Epoxy
29690-82-2
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted
silane
Elastomeric
polymer
Epoxy resin
Si
Copper
Palladium
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
Trade Secret
80-08-0
67762-90-7
Weight by
mg
% weight of
substance per
package
PPM
Trade Secret
Trade Secret
Package Weight (mg):
29.0831
% Total:
0.1072
29.6023
1.8151
1.4851
0.0990
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 3 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier
bag
Shielding bag
Protective Band
Shipping and
inner/ pizza box
Desiccant
Bubble Pack
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-DESS-R
CoA-BUBP-R
Lead
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 4 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Chung-Li
Package Qualification Report # 123401, 123603 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BU60-ASE
Chung-Li
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 5 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Goldwire Material
Material
Substance
Composition
Purpose of Use
Bismaleimide(B)
Triazine / Epoxy
Resin
Continuous
Filament Fiber
Glass
Inorganic Filler
Substrate
Solder Ball
Die Attach
Base Material
External Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
CAS Number
Weight by
mg
% weight of
substance
per
Homogeno
us
material
PPM
% weight
of
substance
per
package
105391-33-1
1.8752
25.5000
63,495
6.3495%
65997-17-3
1.1472
15.6000
38,844
3.8844%
21645-51-2
0.8310
11.3000
28,137
2.8137%
Barium Sulfate
7727-43-7
0.6618
9.0000
22,410
2.2410%
Monomethlyl ether
34590-94-8
0.1838
2.5000
6,225
0.6225%
Talc
14807-96-6
0.0368
0.5000
1,245
0.1245%
Silica, amorphous
7631-86-9
0.0368
0.5000
1,245
0.1245%
Epoxy Resin
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Au
Pd
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
Proprietary
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
0.0735
2.3532
0.1103
0.0441
3.5598
0.0545
0.0182
1.0000
32.0000
1.5000
0.6000
98.5000
1.0000
0.5000
2,490
79,680
3,735
1,494
120,536
1,845
615
0.2490%
7.9680%
0.3735%
0.1494%
12.0536%
0.1845%
0.0615%
0.2713
65.0000
9,185
0.9185%
Trade Secret
80-08-0
0.0835
0.0292
20.0000
7.0000
2,826
989
0.2826%
0.0989%
67762-90-7
0.0083
2.0000
283
0.0283%
Trade Secret
Trade Secret
0.0083
2.0000
283
0.0283%
0.0083
2.0000
283
0.0283%
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0083
2.7244
0.2776
0.0028
13.1890
1.0588
0.8319
0.0454
2.0000
100.0000
99.0000
1.0000
87.2000
7.0000
5.5000
0.3000
283
92,247
9,399
95
446,580
35,849
28,167
1,536
0.0283%
9.2247%
0.9399%
0.0095%
44.6580%
3.5849%
2.8167%
0.1536%
% Total:
100.0000
Package Weight (mg):
29.5333
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 6 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper/Palladium Wire Material
Material
Substrate
105391-33-1
1.8752
65997-17-3
1.1472
21645-51-2
Barium Sulfate
7727-43-7
Monomethlyl ether
Talc
Substance
Composition
Purpose of Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Bismaleimide(B)
Triazine / Epoxy
Resin
Continuous
Filament Fiber
Glass
Inorganic Filler
% weight of
substance
per
Homogeno
us
material
25.5000
Circuit
Interconnect
Mold
Compound
Encapsulation
CAS Number
Weight by mg
PPM
% weight of
substance
per
package
63,819
6.3819%
15.6000
39,042
3.9042%
0.8310
11.3000
28,281
2.8281%
0.6618
9.0000
22,525
2.2525%
34590-94-8
0.1838
2.5000
6,257
0.6257%
14807-96-6
0.0368
0.5000
1,251
0.1251%
Silica, amorphous
7631-86-9
0.0368
0.5000
1,251
0.1251%
Epoxy Resin
Cu
Ni
Au
Sn
Ag
Cu
Modified epoxy
resin
Epoxy resin
Daspone
Treated fumed
silica
Substituted silane
Elastomeric
polymer
Epoxy resin
Si
Cu
Pd
SiO2
Epoxy Resin
Phenol Resin
Crabon Black
Trade Secret
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
0.0735
2.3532
0.1103
0.0441
3.5598
0.0545
0.0182
0.2713
1.0000
32.0000
1.5000
0.6000
98.5000
1.0000
0.5000
65.0000
2,503
80,087
3,754
1,502
121,152
1,854
618
9,232
0.2503%
8.0087%
0.3754%
0.1502%
12.1152%
0.1854%
0.0618%
0.9232%
Trade Secret
80-08-0
67762-90-7
0.0835
0.0292
0.0083
20.0000
7.0000
2.0000
2,841
994
284
0.2841%
0.0994%
0.0284%
Trade Secret
Trade Secret
0.0083
0.0083
2.0000
2.0000
284
284
0.0284%
0.0284%
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
0.0083
2.7244
0.1277
0.0025
13.1890
1.0588
0.8319
0.0454
2.0000
100.0000
98.0000
2.0000
87.2000
7.0000
5.5000
0.3000
284
92,719
4,347
84
448,863
36,033
28,311
1,544
0.0284%
9.2719%
0.4347%
0.0084%
44.8863%
3.6033%
2.8311%
0.1544%
Package Weight (mg):
29.3831
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 7 of 9
100.0000
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier
bag
Shielding bag
Protective Band
Shipping and
inner/ pizza box
Desiccant
Bubble Pack
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-DESS-R
CoA-BUBP-R
Lead
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 8 of 9
60- BGA (5.5 x 5.5 x 0.6 mm)
Pb-Free Package
Document History Page
Document Title: 60 - BGA (5.5X5.5X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
Document Number: 001-78057
Rev.
**
*A
ECN No. Orig. of
Change
3564923 JSO
3739860 JSO
*B
*C
3787622 JSO
4064282 YUM
*D
*E
4771626 HLR
5285407 HLR
MEL
Description of Change
Initial Release
Added assembly site 1.B2 Material Composition table for
ASEK’s CuPd wire.
Added assembly site 2 for ASE Chung-li.
Added reference QTP# for CuPd wire
Added assembly site name in the assembly heading in site
1 and 2.
Changed assembly code to assembly site name in site 1
and 2.
Sunset Due – No Change.
Changed Cypress Logo.
Changed the substances with “------------- “and Proprietary
to “Trade Secret".
Removed distribution and posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-78057 Rev. *E
Page 9 of 9