84 - BGA (6x6x1mm) Pb-free Package Material Declaration Datasheet.pdf

84- BGA (6 x 6 x 1mm)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BZ
56.6699 mg
Body Size (mil/mm)
Package Weight – Site 2
6 x 6 x 1.0mm
N/A
SUMMARY
The 84L-BGA package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 112210 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BZ84CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-75235 Rev. *D
Page 1 of 4
84- BGA (6 x 6 x 1mm)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substrate
Purpose of Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Mold
Compound
Circuit
Interconnect
Encapsulation
Substance
Composition
CAS Number
Cured Resin
Glass Fabrics
Trade Secret
Trade Secret
Copper Foil
7440-50-8
Diethylene Glycol
Monoethyl Ether
Acetate
Acetophenone
Derirative
Silica Crystalline
Solvent naptha
Sn
Ag
Cu
Ag
Bismaleimide
Polymer/Synthetic
Resin
Additive
Si
Au
SiO2
Epoxy Resin (1)
Epoxy Resin (2)
Phenol Resin
Trade Secret
7.8400
% weight of
substance per
Homogenous
material
28.0000
138,345
% weight of
substance
per
package
13.8345%
6.1600
22.0000
108,699
10.8699%
8.4000
30.0000
148,227
14.8227%
1.4000
5.0000
24,704
2.4704%
1.4000
1.4000
1.4000
0.5171
0.0053
0.0026
0.5686
0.0711
5.0000
5.0000
5.0000
98.5000
1.0000
0.5000
80.0000
10.0000
24,704
24,704
24,704
9,125
97
49
10,034
1,254
2.4704%
2.4704%
2.4704%
0.9125%
0.0093%
0.0046%
1.0034%
0.1254%
0.0498
0.0213
8.9385
2.1742
14.3628
0.9793
0.3264
0.6529
7.0000
3.0000
100.0000
100.0000
88.0000
6.0000
2.0000
4.0000
878
376
157,728
38,366
253,446
17,280
5,760
11,520
0.0878%
0.0376%
15.7728%
3.8366%
25.3446%
1.7280%
0.5760%
1.1520%
Weight by
mg
PPM
Trade Secret
14808-60-7
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
93705-66-9
Trade Secret
106466-55-1
Package Weight (mg):
56.6699
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-75235 Rev. *D
Page 2 of 4
84- BGA (6 x 6 x 1mm)
Pb-Free Package
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier
bag
Shielding bag
Protective Band
Shipping and
inner/ pizza box
Desiccant
Bubble Pack
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
PBB
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-DESS-R
CoA-BUBP-R
Lead
PPM
PBDE
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-75235 Rev. *D
Page 3 of 4
84- BGA (6 x 6 x 1mm)
Pb-Free Package
Document History Page
Document Title: 84 - BGA (6X6X1MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Document Number: 001-75235
Rev.
**
*A
*B
ECN No. Orig. of
Change
3471178 HLR
3833306 HLR
4058267 YUM
*C
*D
4617357 HLR
5083865 HLR
MEL
Description of Change
Initial Release
Added CAS Number for Copper
Added assembly site name in the Assembly heading.
Changed Assembly code to assembly site name.
Sunset Due – No Change
Changed the substances with “------------- “to “Trade
Secret.
Removed “Distribution: WEB” and “Posting: NONE” from
the document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-75235 Rev. *D
Page 4 of 4
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