48 - FBGA (6X8MM) STACK DIE PB-FREE PACKAGE Package Material Declaration Datasheet.pdf

48-FBGA (6 x 8 mm) Stack Die
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BK
99.1681 mg
Body Size (mil/mm)
Package Weight – Site 2
6 x 8 mm
N/A
SUMMARY
The 48-BGA Stack Die Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 052502 / 092602 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report (Note2)
CoA-BK48KASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-84077 Rev. *B
Page 1 of 4
48-FBGA (6 x 8 mm) Stack Die
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
SiO2
60676-86-0
2.5478
% weight of
substance per
Homogenous
material
10.4900%
25,692
2.5692%
Acrylic
2.2345
9.2000%
22,532
2.2532%
1.4913
6.1400%
15,038
1.5038%
Bisphenol
Triazol
Cu
Trade Secret
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
3.6383
4.3670
9.5525
14.9800%
17.9800%
39.3300%
36,689
44,036
96,326
3.6689%
4.4036%
9.6326%
Ni
7440-02-0
0.3376
1.3900%
3,404
0.3404%
Au
Sn
Ag
Cu
Epoxy Resin
Diester
Functionalized
esters
Polymeric resin
Fused silica
Poly(tetrafluoro
ethylene)
Bismaleimide
Resin
Synthetic resin
Additive
Substituded
silane
Initiator 1
Initiator 2
Si
Au
Ion Impurities
Silica Fused
Epoxy Resin (1)
Epoxy Resin (2)
Phenol resin
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Trade Secret
Trade Secret
0.1190
5.4531
0.2284
0.0286
0.6886
2.7051
0.4900%
95.5000%
4.0000%
0.5000%
7.0000%
27.5000%
1,200
54,988
2,303
288
6,944
27,278
0.1200%
5.4988%
0.2303%
0.0288%
0.6944%
2.7278%
Trade Secret
0.9837
10.0000%
9,919
0.9919%
Trade Secret
60676-86-0
0.2951
5.1643
3.0000%
52.5000%
2,976
52,077
0.2976%
5.2077%
9002-84-0
0.6925
40.0000%
6,983
0.6983%
Trade Secret
0.6925
40.0000%
6,983
0.6983%
Trade Secret
Trade Secret
0.1731
0.0866
10.0000%
5.0000%
1,746
873
0.1746%
0.0873%
Trade Secret
0.0173
1.0000%
175
0.0175%
Trade Secret
Trade Secret
7440-21-3
7440-57-5
Trade Secret
60676-86-0
93705-66-9
Trade Secret
106466-55-1
0.0346
0.0346
7.6780
2.0998
0.0002
42.5633
2.1521
0.9565
2.1521
2.0000%
2.0000%
100.0000%
99.9900%
0.0100%
89.0000%
4.5000%
2.0000%
4.5000%
349
349
77,424
21,174
2
429,205
21,701
9,645
21,701
0.0349%
0.0349%
7.7424%
2.1174%
0.0002%
42.9205%
2.1701%
0.9645%
2.1701%
% Total:
100.0000
Substance
Composition
Epoxy
Substrate
Base Material
Solder Ball
External
Plating
Die Attach 1
Adhesive
Die attach 2
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
CAS Number
Package Weight (mg):
Weight by
mg
99.1681
PPM
% weight of
substance per
package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-84077 Rev. *B
Page 2 of 4
48-FBGA (6 x 8 mm) Stack Die
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-84077 Rev. *B
Page 3 of 4
48-FBGA (6 x 8 mm) Stack Die
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
48 - FBGA (6X8MM) STACK DIE PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-84077
**
*A
ECN No. Orig. of
Change
3782969 JARG
4066975 YUM
*B
4995803 MRB
Description of Change
New document
Added assembly site name in the assembly heading.
Changed Assembly code to assembly site name.
No Change
Removed “Distribution: WEB” and “Posting: NONE” from the
document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-84077 Rev. *B
Page 4 of 4
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