56L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

56L – QFN 6x6x0.6mm
(Saw Version)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LQ
B1 : 68.5550 mg
B2 : 68.6290 mg
Body Size (mil/mm)
Package Weight – Site 2
6x6x0.6mm
B1 : 66.4354 mg
B2 : 66.6532mg
SUMMARY
The 56L – QFN Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 123801, 134202 (See Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ56CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 1 of 7
56L – QFN 6x6x0.6 mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using NiPdAu Leadframe and Gold Wire Material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
Copper
Nickel
Silicon
Magnesium
Nickel
Palladium
Gold
Ag
Carbocyclic Acrylate
Bismaleimide Resin
Additive
Acrylate ester
Silicon
Gold
Palladium
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
35.7000
1.4100
0.3050
0.0850
0.7276
0.0068
0.0068
0.3740
0.1020
0.0068
0.0068
0.0068
7.0448
2.5160
0.0272
17.1392
0.5344
0.7422
0.6472
0.0988
1.0676
Package Weight (mg):
68.5550
% Weight of
substance per
Homogeneous
material
95.2000 %
3.7600 %
0.8133 %
0.2267 %
98.165 %
0.9174 %
0.9174 %
75.3425 %
20.5479 %
1.3699 %
1.3699 %
1.3699 %
100.0000 %
98.9305 %
1.0695 %
84.7242 %
2.6417 %
3.6689 %
3.1993 %
0.4884 %
5.2775 %
PPM
520,750
20,567
4,449
1,240
10,613
99
99
5,455
1,488
99
99
99
102,761
36,700
397
250,007
7,795
10,826
9,441
1,441
15,573
% Total:
% weight of
substance per
package
52.0750 %
2.0567 %
0.4449 %
0.1240 %
1.0613 %
0.0099 %
0.0099 %
0.5455 %
0.1488 %
0.0099 %
0.0099 %
0.0099 %
10.2761 %
3.6700 %
0.0397 %
25.0006 %
0.7795 %
1.0826 %
0.9441 %
0.1441 %
1.5573 %
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 2 of 7
56L – QFN 6x6x0.6 mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using NiPdAu Leadframe and Copper-Palladium Wire Material
Material
Lead
Frame
Purpose of
Use
Base material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
Carbocyclic acrylate
Bismaleimide resin
Acrylate
Additive
Silicon
Copper
Palladium
SiO2
Metal Hydroxide
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
Package Weight (mg):
II.
Type
Tray
Others
35.2155
1.1110
0.2400
0.0490
0.7277
0.0072
0.0069
0.3742
0.1022
0.0070
0.0069
0.0068
7.0447
2.6115
0.0002
17.6285
0.6332
0.8435
0.8430
0.1090
1.0610
68.6290
% Weight of
substance per
Homogeneous
material
96.1765%
3.0342%
0.6555%
0.1338%
98.0992%
0.9706%
0.9302%
75.2766%
20.5592%
1.4082%
1.3881%
1.3679%
100.0000%
99.9923%
0.0077%
83.4754%
2.9984%
3.9942%
3.9918%
0.5161%
5.0241%
% weight of
substance per
package
PPM
513,129
16,188
3,497
714
10,603
105
101
5,453
1,489
102
101
99
102,649
38,052
3
256,867
9,226
12,291
12,283
1,588
15,460
% Total:
51.3129%
1.6188%
0.3497%
0.0714%
1.0603%
0.0105%
0.0101%
0.5453%
0.1489%
0.0102%
0.0101%
0.0099%
10.2649%
3.8052%
0.0003%
25.6867%
0.9226%
1.2291%
1.2283%
0.1588%
1.5460%
100.0000
DECLARATION OF PACKAGING / INDIRECT MATERIALS
Material
Tape & Reel
Weight by
mg
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 3 of 7
56L – QFN 6x6x0.6 mm
(Saw Version)
Pb-Free Package
ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #123905, #134201 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ56ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 4 of 7
56L – QFN 6x6x0.6mm
(Saw Version)
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using NiPdAu Leadfinish and Gold Wire Material
Material
Lead frame
Purpose of
Use
Base Material
Frame Plating
Frame Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Copper
Nickel
Silicon
7440-50-8
7440-02-0
7440-21-3
27.1284
0.8460
0.1833
% weight of
substance per
Homogenous
material
96.2000
3.0000
0.6500
Magnesium
7439-95-4
0.0423
0.1500
637
0.0637
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
14808-60-7
0.6790
0.0175
0.0035
0.1284
0.1284
0.0642
97.0000
2.5000
0.5000
12.0000
12.0000
6.0000
10,223
263
53
1,933
1,933
967
1.0223
0.0263
0.0053
0.1933
0.1933
0.0967
Trade Secret
0.7490
70.0000
11,277
1.1277
7440-21-3
7440-57-5
Trade Secret
Trade secret
Trade secret
Trade secret
1333-86-4
60676-86-0
76361-86-9
3.8000
1.8498
0.0002
0.9240
0.9240
1.6170
0.1232
24.0240
3.0800
100.0000
99.9900
0.0100
2.9985
2.9985
5.2474
0.3998
77.9610
9.9950
57,212
27,850
3
13,911
13,911
24,345
1,855
361,466
46,372
5.7212
2.7850
0.0003
1.3911
1.3911
2.4345
0.1855
36.1466
4.6372
14808-60-7
0.1232
0.3998
1,855
0.1855
Substance
Composition
Nickel
Palladium
Gold
Phenol Resin
Epoxy Resin
SiO2 Filler
(Meta)Acrylic
Copolymer
Silicon
Gold
Ion Impurities
Epoxy Resin-A
Epoxy Resin-B
Phenol Resin
Carbon Black
Silica fused
Silica fused
Silica,
crystalline
CAS Number
Package Weight (mg):
Weight by
mg
66.4354
PPM
% weight of
Substance
per package
408,437
12,737
2,760
40.8437
1.2737
0.2760
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 5 of 7
100.0000
56L – QFN 6x6x0.6mm
(Saw Version)
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Pure Sn Leadfinish and Copper-Palladium Wire Material
Purpose of
Use
Material
Lead frame
Base Material
Frame Plating
Die Attach
Frame Plating
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Copper
Iron
Phosphorus
7440-50-8
7439-89-6
7723-14-0
27.4950
0.6627
0.0085
% weight of
substance per
Homogenous
material
97.5000
2.3500
0.0300
Zinc
7440-66-6
0.0338
0.8000
0.1284
0.1200
100.0000
12.0000
508
12,007
1,927
0.1284
12.0000
1,927
0.0642
6.0000
964
0.7490
70.0000
11,241
3.6700
1.0898
0.0002
2.5400
1.9100
0.1232
27.250
100.0000
99.9800
0.0200
7.0000
5.0000
0.3998
87.6000
55,080
16,356
2
38,181
28,636
1,432
409,014
Substance
Composition
Tin
Phenol Resin
Novolac Epoxy
Resin
Amorphous
Silica
(Meta)Acrylic
Copolymer
Silicon
Copper
Palladium
Epoxy Resin-A
Phenol Resin
Carbon Black
Silica fused
CAS Number
7440-31-5
Trade Secret
Trade Secret
68611-44-9
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade secret
Trade secret
1333-86-4
60676-86-0
Package Weight (mg):
III.
Type
Tray
Others
66.6532
% weight of
Substance
per package
PPM
412,652
9,946
127
41.2652
0.9946
0.0127
0.0508
% Total:
1.2007
0.1927
0.1927
0.0964
1.1241
5.5080
1.6356
0.0002
3.8181
2.8636
0.1432
40.9014
100.0000
DECLARATION OF PACKAGING / INDIRECT MATERIALS
Material
Tape & Reel
Weight by
mg
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 6 of 7
56L – QFN 6x6x0.6mm
(Saw Version)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
56L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL
DECLARATION DATASHEET
001-82395
**
*A
*B
*C
ECN No. Orig. of
Change
3727483 AWP
3326303 JSO
3812343 JSO
4066937 YUM
*D
4159219 AWP
*E
4174512 JVP
*F
4906523 MRB
DCON
Description of Change
New specification.
Added Assembly Site 2 for Au Wire.
Added CuPd wire.
Added assembly site name in the assembly heading in
site 1 and 2.
Changed Assembly code to Assembly site name in site 1
and 2.
Updated the table of Site 1:
- Added B1: on 68.5550 mg
- Added B2 : 68.6920 mg
- Added QTP # 134202
- Added the B2 Table : Copper-Palladium wire
Added Package Weight for Site 2 :
- B2 : 66.6532mg
Updated Site 2 :
- Remove Reference QTP#123802 for Pure Cu wire
- Added Reference QTP# 134201 for CuPd wire
- Remove data from Table B2 from Site 2 with Pure Cu
wire and replace with CuPd wire
Changed from CAS # “-------------“to Trade Secret on
Assembly site 1_B1
Removed Distribution and Posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-82395 Rev. *F
Page 7 of 7
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