44L - QFN 5X5X0.6MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LQ
B1: 43.3168 mg
B2: 44.0660 mg
B3: 45.000 mg
Body Size (mil/mm)
Package Weight – Site 2
QFN 5X5X0.6mm
46.5930 mg
SUMMARY
The QFN 44L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g.
CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 120407, 123902, 140905
I. DECLARATION OF PACKAGED UNITS
100. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ44ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 1 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
B. MATERIAL COMPOSITION (Note 3)
B1. Using Au Wire
Material
Lead frame
Frame Plating
Purpose of
Use
Base Material
Frame Plating
Substance
Composition
CAS
Number
Weight
by mg
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per
package
Copper
7440-50-8
25.4900
96.1900%
588455
58.8455
Nickel
7440-02-0
0.8000
3.0200%
18469
1.8469
Silicon
7440-21-3
0.1700
0.6400%
3925
0.3925
Magnesium
7439-95-4
0.0400
0.1500%
923
0.0923
Ni
7440-02-0
0.4110
96.9300%
9488
0.9488
Pd
7440-05-3
0.0110
2.5900%
254
0.0254
Au
7440-57-5
0.0020
0.4700%
46
0.0046
Phenol Resin
Trade Secret
0.1300
12.1500%
3001
0.3001
Epoxy Resin
Trade Secret
0.1300
12.1500%
3001
0.3001
SiO2 Filler
68611-44-9
0.0600
5.6100%
1385
0.1385
Trade Secret
0.7500
70.0900%
17314
1.7314
Die Attach
Adhesive
(Meta)Acrylic
Copolymer
Die
Circuit
Si
100.0000%
87726
8.7726
Interconnect
Au
7440-21-3
7440-57-5
3.8000
Wire
0.9500
99.9900%
21931
2.1931
Epoxy Resin-A
Trade secret
0.3540
3.3482%
8172
0.8172
Epoxy Resin-B
Trade secret
0.3540
3.3482%
8172
0.8172
Phenol Resin
Trade secret
0.6136
5.8036%
14165
1.4165
Carbon Black
1333-86-4
0.0472
0.4464%
1090
0.1090
Silica fused
60676-86-0
9.2040
87.0536%
Mold Compound Encapsulation
Package Weight (mg):
43.3168
212481
% Total:
21.2481
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 2 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
B. MATERIAL COMPOSITION (Note 3)
B2. CuPd Wire using Sumitomo G631 Mold Compound
Material
Lead frame
Leadfinish
Purpose of
Use
Base Material
External Plating
Substance
Composition
Adhesive
Wire
Mold Compound
Circuit
Interconnect
Encapsulation
% weight of
substance
per
package
PPM
7440-50-8
25.8375
97.5000
586,416
58.6416
Iron
7439-89-6
0.6228
2.3500
14,134
1.4134
0.0180
Phosphorus
7723-14-0
0.0080
0.0300
180
Zinc
7440-66-6
0.0318
0.1200
722
0.0722
Sn
7440-31-5
0.4000
100.0000
Trade Secret
0.1284
12.0000
9,079
2,914
0.9079
0.2914
Trade Secret
0.1284
12.0000
2,914
0.2914
68611-44-9
0.0642
6.0000
1,457
0.1457
17,000
1.7000
Trade Secret
0.7490
Si
Copper
7440-21-3
7440-50-8
3.3200
0.9698
70.0000
100.0000
75,352
22,011
7.5352
2.2011
Palladium
7440-05-3
0.0002
0.0200
4
0.0004
0.8034
Amorphous Silica
Acrylic
Copolymer
Die
Weight
by mg
Copper
Phenol Resin
Novolak Epoxy
Resin
Die Attach
CAS
Number
% weight of
substance
per
Homogenous
material
99.9800
Epoxy Resin-A
Trade secret
0.3540
3.0000
8,034
Epoxy Resin-B
Trade secret
0.3540
3.0000
8,034
0.8034
Phenol Resin
Trade secret
0.6195
5.2000
14,060
1.4060
0.1071
Carbon Black
1333-86-4
0.0472
0.4000
1,071
Silica fused
60676-86-0
9.2040
78.0000
208,897
20.8897
Silica fused
76361-86-9
1.1800
10.0000
26,782
2.6782
0.4000
1,071
0.1071
Silica, crystalline
14808-60-7
Package Weight (mg):
0.0472
44.0660
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 3 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
B. MATERIAL COMPOSITION (Note 3)
B3. CuPd Wire using Sumitomo G700LA Mold Compound
Material
Lead frame
Leadfinish
Die Attach
Die
Wire
Purpose of
Use
Base Material
External
Plating
Adhesive
Circuit
Interconnect
Mold Compound Encapsulation
Substance
Composition
CAS
Number
Weight
by mg
% weight of
substance
per
Homogenous
material
% weight of
substance
per
package
PPM
Nickel
7440-02-0
0.7500
3.0000
16667
1.6667
Silicon
7440-21-3
0.2500
1.0000
5556
0.5556
Magnesium
7439-95-4
0.0375
0.1500
833
0.0833
Silver
7440-22-4
1.4625
5.8500
32500
3.2500
Copper
7440-50-8
22.5000
90.0000
500000
50.0000
Sn
7440-31-5
0.4000
100.0000
8889
0.8889
Acrylic Resin
Polybutadiene
derivative
Butadiene copolymer
Trade Secret
0.0825
7.5000
1833
0.1833
Trade Secret
0.1100
10.0000
2444
0.2444
Trade Secret
0.0055
0.5000
122
0.0122
Acrylate
Trade Secret
0.0825
7.5000
1833
0.1833
Peroxide
Trade Secret
0.0055
0.5000
122
0.0122
Additive
Trade Secret
0.0165
1.5000
367
0.0367
Silver
7440-22-4
0.7975
72.5000
17722
1.7722
Si
7440-21-3
1.8000
100.0000
40000
4.0000
Copper
7440-50-8
0.1965
98.2500
4367
0.4367
Palladium
7440-05-3
0.0035
1.7500
78
0.0078
Epoxy Resin
Trade secret
1.3200
8.0000
29333
2.9333
Phenol Resin
Trade secret
0.6600
4.0000
14667
1.4667
Silica(Amorphous) A
60676-86-0
13.1010
79.4000
291133
29.1133
Silica(Amorphous) B
76361-86-9
1.3200
8.0000
29333
2.9333
Carbon Black
1333-86-4
0.0990
0.6000
Package Weight (mg):
45.0000
2200
% Total:
0.2200
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 4 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
<5.0
<5.0
<0.0005
<5.0
<5.0
<5.0
<5.0
<0.0005
<5.0
<5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 5 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
ASSEMBLY Site 2: Cypress Manufacturing Limited (CML)
Package Qualification Report # 131701 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
100. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ44CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 6 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
B. MATERIAL COMPOSITION (Note 3)
Using Copper-Palladium (Cu-Pd) Wire
Material
Purpose of Use
Lead Frame
Base material
Lead Finish
External Plating
Die Attach
Die
Adhesive
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
I.
Type
Weight
by mg
CAS Number
Cu
Ni
Si
Mg
Nickel
Palladium
Gold
Silver
Carbocyclic acrylate
Bismaleimide resin
Acrylate
Additive
Silicon
Copper
Palladium
SiO2
Metal Hydroxide
Phenol Resin
Epoxy Resin
Carbon Black
Crystalline Silica
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
14808-60-7
Package Weight (mg):
17.9100
0.6600
0.1495
0.0540
0.4865
0.0015
0.0005
0.6220
0.0815
0.0300
0.0270
0.0115
5.7910
2.3868
0.0002
16.3100
0.6800
0.6125
0.5225
0.0633
0.1927
46.5930
% Weight of
substance per
Homogeneous
material
95.4004%
3.5156%
0.7963%
0.2876%
99.5906%
0.3071%
0.1024%
80.5699%
10.5570%
3.8860%
3.4974%
1.4896%
100.0000%
99.9916%
0.0084%
88.7329%
3.6995%
3.3322%
2.8426%
0.3444%
1.0484%
PPM
384,393
14,165
3,209
1,159
10,441
32
11
13,350
1,749
644
579
247
124,289
51,227
4
350,053
14,594
13,146
11,214
1,359
4,136
% Total:
% weight of
substance per
package
38.4393%
1.4165%
0.3209%
0.1159%
1.0441%
0.0032%
0.0011%
1.3350%
0.1749%
0.0644%
0.0579%
0.0247%
12.4289%
5.1227%
0.0004%
35.0053%
1.4594%
1.3146%
1.1214%
0.1359%
0.4136%
100.0000
DECLARATION OF PACKAGING / INDIRECT MATERIALS
Material
Tape & Reel
Tray
Others
Substance
Composition
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 7 of 8
44L – QFN 5X5X0.6 mm
(Saw Version) Pb-Free
Document History Page
Document Title: 44L – QFN 5X5X0.6MM (SAW VERSION) PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
Document Number:
001-75797
Rev.
**
*A
ECN No. Orig. of
Change
3474792 JVP
4064282 YUM
*B
4159219 AWP
*C
4291871 MRB
*D
4360843 HLR
*E
4463063 HLR
Description of Change
Initial spec release.
Added assembly site name in the assembly heading.
Changed Assembly code to assembly site name.
Removed Tube material in the Indirect Materials section.
Added Site 2 – CML – PMDD with reference QTP#
131701 – Autoline Copper-Palladium (Cu-Pd) Wire
Qualification.
Update material composition in site 1 to reflect 4 decimal
values on % weight substance homogenous material
Added B2 Material Composition on Assembly Site 1 for
CuPd wire.
Added B3 Material Composition on Assembly Site 1 for
CuPd wire using Sumitomo G700LA Mold Compound.
Reference QTP No. 140905
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-75797 Rev. *E
Page 8 of 8
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