48-TFBGA (6 X 10 mm) Non Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BA B1 : 150.0600 mg B2: 116.9000 mg B3: 115.8807 mg 6 x 10 mm N/A Body Size (mil/mm) Package Weight – Site 2 SUMMARY The 48-TFBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances (above allowable levels). ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 044501, 021801, 021113, 094705, 120612 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this product, as it is not considered Pb-Free or RoHS compliant. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM Analysis Report (Note 2) 0 0 2.1200 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 14,100 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 1 of 6 48-TFBGA (6 X 10 mm) Non Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Using Non Halogen-Free Substrate Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation SiO2 60676-86-0 4.0200 % Weight of Substance per Homogeneo us material 11.0107% 26,800 % Weight of Substance per package 2.6789% Acrylic 29690-82-2 3.6500 9.9973% 24,300 2.4324% Substance Composition CAS Number Weight by mg PPM Epoxy 68541-56-0 2.9300 8.0252% 19,500 1.9526% Bisphenol Triazol Cu Ni 13676-54-5 25722-66-1 7440-50-8 7440-02-0 5.4800 6.3900 13.2800 0.5400 15.0096% 17.5021% 36.3736% 1.4790% 36,500 42,600 88,500 3,600 3.6519% 4.2583% 8.8498% 0.3599% Au Br Sn Pb Ag Epoxy Resin Functionalized Ester Diester Si Au Silica Fused Epoxy Resin Phenolic Resin Silica Mixed Siloxanes Brominated Compound Silica Quartz Carbon Black Silica Cristobalite Antimony Trioxide 7440-57-5 7726-95-6 7440-31-5 7439-92-1 7440-22-4 --------------------------------------- 0.2000 0.0200 3.6200 2.1200 18.9500 1.3700 1.3700 0.5478% 0.0548% 63.0662% 36.9338% 76.4730% 5.5287% 5.5287% 1,300 100 24,100 14,100 126,300 9,100 9,100 0.1333% 0.0133% 2.4124% 1.4128% 12.6283% 0.9130% 0.9130% -------------------7440-21-3 7440-57-5 60676-86-0 --------------------------------------7631-86-9 --------------------------------------- 3.0900 21.3800 1.6800 41.9700 7.5000 3.0000 3.0000 1.2000 1.2000 12.4697% 100.0000% 100.0000% 69.9850% 12.5063% 5.0025% 5.0025% 2.0010% 2.0010% 20,600 142,500 11,200 279,800 50,000 20,000 20,000 8,000 8,000 2.0592% 14.2476% 1.1196% 27.9688% 4.9980% 1.9992% 1.9992% 0.7997% 0.7997% 0.6000 0.3000 0.6000 0.6000 1.0005% 0.5003% 1.0005% 1.0005% 4,000 2,000 4,000 4,000 0.3998% 0.1999% 0.3998% 0.3998% % Total: 100.0000 14808-60-7 1333-86-4 14464-46-1 1309-64-4 Package Weight (mg): 150.0600 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 2 of 6 48-TFBGA (6 X 10 mm) Non Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) Using Halogen-free Substrate Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Wire Circuit Interconnect Mold Compound Encapsulation SiO2 60676-86-0 3.1400 % Weight of Substance per Homogeneou s material 10.5017% 26,825 % Weight of Substance per package 2.6861% Acrylic 29690-82-2 2.7500 9.1973% 23,526 2.3524% Substance Composition CAS Number Weight by mg PPM Epoxy 68541-56-0 1.8400 6.1538% 15,701 1.5740% Bisphenol Triazol Cu Ni 13676-54-5 25722-66-1 7440-50-8 7440-02-0 4.4800 5.3700 11.7500 0.4200 14.9833% 17.9599% 39.2977% 1.4047% 38,306 45,978 100,573 3,554 3.8323% 4.5937% 10.0513% 0.3593% Au Sn Pb Ag Epoxy Resin Functionalized Ester Diester Si Au Silica Fused Epoxy Resin 1 Epoxy Resin 2 Phenol Resin 7440-57-5 7440-31-5 7439-92-1 7440-22-4 --------------------------------------- 0.1500 3.1500 1.8500 22.1500 1.5100 1.5100 0.5017% 63.0000% 37.0000% 76.9899% 5.2485% 5.2485% 1,253 26,951 15,828 189,510 12,921 12,921 0.1283% 2.6946% 1.5825% 18.9478% 1.2917% 1.2917% -------------------7440-21-3 7440-57-5 60676-86-0 93705-66-9 -------------------106466-55-1 3.6000 17.4800 1.9100 30.1200 1.5200 0.6800 1.5200 12.5130% 100.0000% 100.0000% 89.0071% 4.4917% 2.0095% 4.4917% 30,764 149,535 16,343 257,665 13,028 5,790 13,028 3.0796% 14.9530% 1.6339% 25.7656% 1.3003% 0.5817% 1.3003% Package Weight (mg): 116.9000 % Total: 100.0000 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 3 of 6 48-TFBGA (6 X 10 mm) Non Pb-Free Package B3. MATERIAL COMPOSITION (Note 3) Using Copper-Palladium wire material Material Purpose of Use Substrate Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Substance Composition SiO2 Acrylic Epoxy Bisphenol Triazol Cu Ni Au Sn Pb Silica fused Epoxy Resin Acrylate monomer Bismaleimide monomer Acrylic resin Si Copper Palladium Silica Fused Epoxy Resin Carbon Black Phenol Resin CAS Number Weight by mg 60676-86-0 29690-82-2 68541-56-0 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 7440-31-5 7439-92-1 60676-86-0 --------------------------------------- 3.1400 2.7500 1.8400 4.4800 5.3700 11.7500 0.4200 0.1500 3.1500 1.8500 14.3821 2.0854 2.0854 % Weight of Substance per Homogeneou s material 10.5017% 9.1973% 6.1538% 14.9833% 17.9599% 39.2977% 1.4047% 0.5016% 63.0000% 37.0000% 49.9899% 7.2485% 7.2485% -------------------- 8.8602 30.7965% 76,460 7.6460% -------------------7440-21-3 7440-50-8 7440-05-3 60676-86-0 -------------------1333-86-4 -------------------- 1.3570 17.4800 0.8672 0.0235 30.6532 1.5227 0.1413 1.5227 4.7166% 100.0000% 97.3626% 2.6374% 90.5827% 4.4998% 0.4177% 4.4998% 11,710 150,846 7,484 203 264,524 13,140 1,219 13,140 1.1710% 15.0846% 0.7484% 0.0203% 26.4524% 1.3140% 0.1219% 1.3140% % Total: 100.0000 Package Weight (mg): 115.8807 27,097 23,731 15,878 38,661 46,341 101,397 3,624 1,294 27,183 15,965 124,111 17,996 17,996 % Weight of Substance per package 2.7097% 2.3731% 1.5878% 3.8661% 4.6341% 10.1397% 0.3624% 0.1294% 2.7183% 1.5965% 12.4111% 1.7996% 1.7996% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 4 of 6 48-TFBGA (6 X 10 mm) Non Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Desiccant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R CoA-TRAY-R CoA-SBAG –R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 5 of 6 48-TFBGA (6 X 10 mm) Non Pb-Free Package Document History Page Document Title: Document Number: 48-TFBGA (6X10mm) Non Pb-Free PACKAGE MATERIAL DECLARATION DATASHEET 001-05128 Rev. ECN No. Orig. of Change ** 400641 GFJ *A 2579759 MAHA *B DCon 2753787 MAHA *C *D 2828360 VFR 3346070 MAHA *E 3608053 UDR *F 4031149 YUM Description of Change New Specification. 1. Updated Cypress logo. 2. Added percent weight per homogeneous material and weight of substance per package in the material composition table for Assembly site 1. 3. Updated and added Lead, Cr+VI, PBB and PBDE on the Declaration of Packaging/Indirect Materials table for assembly site 1. Replaced CML with WEB in distribution list. Corrected the CAS number of gold on the material composition table of assembly site 1. Added the CAS number of bromine to the material composition table of assembly site 1. Added PMDD for Site 2. Revised the package weights for assembly sites 1 and 2 on page 1. Added the weight of Lead on Table A of assembly sites 1 and 2. Expressed the weight, % Weight of Substance per Homogeneous Material, and % Weight of Substance per Package in four decimal places for Table B of assembly sites 1 and 2. Added B2 on Site 2 to reflect Copper wire qualification with reference QTP # 120612. Added Assembly site name in the Assembly heading in site 1 and 2. Removed entire Tube row in the Indirect Materials section. Consolidate all material composition to Assembly Site 1 (ASET) Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-05128 Rev.*F Page 6 of 6