48-FBGA (6 x 10 mm) Stack Die Pb-Free Package

48-FBGA (6 x 10 mm) Stack Die
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
BK
B1 – 136.4298 mg
B2 – 130.6399 mg
Body Size (mil/mm)
Package Weight – Site 2
6 x 10 mm
N/A
SUMMARY
The 48-BGA Stack Die Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 052502 / 092602 / 132705 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report (Note2)
CoA-BK48CASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-91180 Rev. **
Page 1 of 5
48-FBGA (6 x 10 mm) Stack Die
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
USING DIE ATTACH EPOXY
Material
Purpose of
Use
Substance
Composition
SiO2
Acrylic
Epoxy
Substrate
Base Material
Solder Ball
External
Plating
Die Attach 1
Adhesive
Die attach 2
Die Attach 3
Adhesive
Adhesive
Die1
Die2
Die3
Circuit
Spacer
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Fused silica
Epoxy Resin
Acrylic resin
Acrylate
monomer
Bismaleimide
monomer
Proprietary filler
Proprietary
Bismaleimide
Proprietary
Methacrylates
Proprietary
Divinyl Ether
Proprietary
polymer
Fused silica
Epoxy Resin
Acrylic resin
Acrylate
monomer
Bismaleimide
monomer
Si
Si
Si
Au
Ion Impurities
Silica Fused
Epoxy Resin A
Phenol resin
CAS Number
60676-86-0
Trade Secret
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
60676-86-0
Trade Secret
Trade Secret
Trade Secret
Trade Secret
3.3400
3.0364
% weight of
substance per
Homogenous
material
11.0000%
10.0001%
2.4291
4.5545
5.3136
11.0675
0.4555
0.1670
4.7870
0.2005
0.0251
1.4842
0.2295
0.0918
Weight by
mg
0.2295
PPM
% weight of
substance per
package
24,481
22,256
2.4481%
2.2256%
8.0000%
17,805
1.7805%
15.0000%
17.4999%
36.4499%
1.5001%
0.5500%
95.4994%
3.9999%
0.5007%
48.5001%
7.4995%
2.9998%
33,383
38,948
81,122
3,339
1,224
35,088
1,470
184
10,879
1,682
673
3.3383%
3.8948%
8.1122%
0.3339%
0.1224%
3.5088%
0.1470%
0.0184%
1.0879%
0.1682%
0.0673%
1,682
0.1682%
44.9993%
7,514
7,523
0.7514%
0.7523%
7.4995%
33.5011%
9002-84-0
1.0252
1.0263
Trade Secret
0.7983
35.0024%
5,852
0.5852%
Trade Secret
0.3421
14.9998%
2,508
0.2508%
Trade Secret
0.0912
3.9988%
668
0.0668%
Trade Secret
0.0228
0.9997%
167
0.0167%
60676-86-0
Trade Secret
Trade Secret
1.4842
0.2295
0.0918
48.5001%
7.4995%
2.9998%
10,879
1,682
673
1.0879%
0.1682%
0.0673%
1,682
0.1682%
7,514
82,778
49,014
82,778
15,372
1
399,769
24,705
24,705
0.7514%
8.2778%
4.9014%
8.2778%
1.5372%
0.0001%
39.9769%
2.4705%
2.4705%
% Total:
100.0000
Trade Secret
Trade Secret
7440-21-3
7440-21-3
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
0.2295
1.0252
11.2934
6.6869
11.2934
2.0972
0.0002
54.5404
3.3705
3.3705
136.4298
7.4995%
33.5011%
100.0000%
100.0000%
100.0000%
99.9905%
0.0095%
89.0000%
5.5000%
5.5000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-91180 Rev. **
Page 2 of 5
48-FBGA (6 x 10 mm) Stack Die
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
USING DIE ATTACH FILM
Material
Purpose
of Use
3.3400
3.0364
% weight of
substance per
Homogenous
material
11.0000%
10.0001%
25,566
23,242
2.5566%
2.3242%
2.4291
8.0000%
18,594
1.8594%
4.5545
5.3136
11.0675
0.4555
0.1670
4.7870
0.2005
0.0251
15.0000%
17.4999%
36.4499%
1.5001%
0.5500%
95.4994%
3.9999%
0.5007%
34,863
40,674
84,718
3,487
1,278
36,643
1,535
192
3.4863%
4.0674%
8.4718%
0.3487%
0.1278%
3.6643%
0.1535%
0.0192%
37382-79-9
0.4123
42.4657%
3,156
Trade Secret
Trade Secret
0.2668
0.0728
27.4797%
7.4982%
2,042
557
67762-90-7
0.0730
7.5188%
559
2530-83-8
29348
0.0730
0.0730
7.5188%
7.5188%
559
559
37382-79-9
0.2848
42.5455%
2,180
Trade Secret
Trade Secret
0.1843
0.0503
27.5321%
7.5142%
1,410
385
67762-90-7
0.0500
7.4694%
383
2530-83-8
29348
0.0500
0.0500
7.4694%
7.4694%
383
383
37382-79-9
0.4123
42.4657%
3,156
Trade Secret
Trade Secret
0.2668
0.0728
27.4797%
7.4982%
2,042
557
67762-90-7
0.0730
7.5188%
559
2530-83-8
29348
7440-21-3
7440-21-3
7440-21-3
7440-57-5
Trade Secret
60676-86-0
Trade Secret
Trade Secret
0.0730
0.0730
11.2934
6.6869
11.2934
2.0972
0.0002
54.5404
3.3705
3.3705
7.5188%
7.5188%
100.0000%
100.0000%
100.0000%
99.9905%
0.0095%
89.0000%
5.5000%
5.5000%
559
559
86,447
51,186
86,447
16,053
1
417,486
25,800
25,800
0.0559%
0.0559%
0.0559%
8.6447%
5.1186%
8.6447%
1.6053%
0.0001%
41.7486%
2.5800%
2.5800%
Package Weight (mg):
130.6399
% Total:
100.0000
Substance Composition
SiO2
Acrylic
Epoxy
Substrate
Base
Material
Solder Ball
External
Plating
Die Attach1
Die Attach2
Die Attach3
Die1
Die2
Die3
Wire
Mold
Compound
Film
Film
Film
Circuit
Spacer
Circuit
Interconne
ct
Encapsula
tion
Bisphenol
Triazol
Cu
Ni
Au
Sn
Ag
Cu
Cresol-epichlorohydrinformaldehyde polymer
Rubber modified epoxy
Aromatic amine
Silica, hydriogibuc anirohiysfumed
Silicon-based glycidyl ether
lsopropylidenediphenol
Cresol-epichlorohydrinformaldehyde polymer
Rubber modified epoxy
Aromatic amine
Silica, hydriogibuc anirohiysfumed
Silicon-based glycidyl ether
lsopropylidenediphenol
Cresol-epichlorohydrinformaldehyde polymer
Rubber modified epoxy
Aromatic amine
Silica, hydriogibuc anirohiysfumed
Silicon-based glycidyl ether
lsopropylidenediphenol
Si
Si
Si
Au
Ion Impurities
Silica Fused
Epoxy Resin A
Phenol resin
CAS
Number
60676-86-0
Trade Secret
29690-82-2,
68541-56-0,
25068-38-6
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7440-31-5
7440-22-4
7440-50-8
Weight by
mg
PPM
% weight of
substance per
package
0.3156%
0.2042%
0.0557%
0.0559%
0.0559%
0.0559%
0.2180%
0.1410%
0.0385%
0.0383%
0.0383%
0.0383%
0.3156%
0.2042%
0.0557%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-91180 Rev. **
Page 3 of 5
48-FBGA (6 x 10 mm) Stack Die
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/
pizza box
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
PBDE
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-91180 Rev. **
Page 4 of 5
48-FBGA (6 x 10 mm) Stack Die
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
48FBGA (6X10MM) STACK DIE PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-91180
ECN No. Orig. of
Change
4281045 ZJL
Description of Change
New document
Distribution: WEB
Posting:
None
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity.
In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-91180 Rev. **
Page 5 of 5
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