56L-TSOP I PB-FREE Package Material Declaration Datasheet.pdf

56L- TSOP I
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
TS
B1: 586.0116 mg
Package Weight – Site 3
Body Size (mil/mm)
Package Weight – Site 2
14 x 18.4 mm
Package Weight – Site 4
SUMMARY
The 56L-TSOP I package is compliant to RoHS. Cypress (Legacy Spansion Part) ordering part numbers
containing an “F” (e.g. S29AL008J70TFI040) meet the Directive of 2002/95/ EC (Rohs) requirement.
ASSEMBLY Site 1: Cypress Bangkok (SB)
Package Qualification Report # 153705 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
Material Analysis
report
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 002-03791 Rev. **
Page 1 of 4
56L- TSOP I
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1. Using Cu wire and Pure Sn Lead Finish
Material
Copper
Iron
Zinc
Phosphorus
Silver
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
133.0359
3.2764
0.1365
0.0683
0.3245
97.2189%
2.3943%
0.0998%
0.0499%
0.2371%
227,019
5,591
233
116
554
% weight
of
substance
per
package
22.7019%
0.5591%
0.0233%
0.0116%
0.0554%
Tin
7440-31-5
5.4800
100.0000%
9,351
0.9351%
Organic filler
Silica
Epoxy Resin A
Epoxy Resin B
Diluent
Phenolic Hardener
Adhesion promoter
Silicon
Copper
Epoxy Resin
Phenol Resin
Carbon Black
Silica (Amorphous)
Phosphoric Catalyst
Trade Secret
Trade Secret
9003-36-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
1333-86-4
Trade Secret
60676-86-0
Trade Secret
Trade Secret
0.9075
0.3630
0.6806
0.6806
1.0890
0.6806
0.1361
91.4000
0.1329
2.0857
27.8096
303.8195
10.4286
3.4762
20.0000%
8.0000%
15.0000%
15.0000%
24.0000%
15.0000%
3.0000%
100.0000%
100.0000%
0.6000%
8.0000%
87.4000%
3.0000%
1.0000%
1,549
619
1,161
1,161
1,858
1,161
232
155,970
227
3,559
47,456
518,453
17,796
5,932
0.1549%
0.0619%
0.1161%
0.1161%
0.1858%
0.1161%
0.0232%
15.5970%
0.0227%
0.3559%
4.7456%
51.8453%
1.7796%
0.5932%
Purpose of
Use
Leadframe
Base Material
Leadfinish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Package Weight (mg):
Weight
by mg
586.0116
% weight of
substance per
Homogenous
material
PPM
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 002-03791 Rev. **
Page 2 of 4
56L- TSOP I
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Dessicant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-TRAY-T
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
<5.0
<5.0
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 002-03791 Rev. **
Page 3 of 4
56L- TSOP I
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
56L-TSOP I PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
002-03791
ECN No. Orig. of Description of Change
Change
4939309 CHAL
New document
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data,
Document No. 002-03791 Rev. **
Page 4 of 4
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