49L WLCSP (3.085X3.25X0.55 MM)- PB-FREE Package Material Declaration Datasheet.pdf

49L – WLCSP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FN
10.3529mg
Body Size (mm)
3.085X3.25X0.55 MM
SUMMARY
The 49ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: DecaTechnoligies Inc. Philippines (Decatech)
Package Qualification Report # 140907 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
SUBSTANCES / COMPOUNDS
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
PolybrominatedDiphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-FN49Decatech
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-96110 Rev. *A
Page 1 of 4
49L – WLCSP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose
Substance
Composition
Polybenzoxazole1
Dielectric
Proprietary
Polybenzoxazole2
Dielectric
Proprietary
CAS
Number
Weight
by mg
% weight of
substance
per
Homogenou
s material
PPM
% weight
of
substance
per
package
Seed Layer
Ti
Trade
Secret
Trade
Secret
7440-32-6
Seed Layer
W
7440-33-7
0.0043
35.4000
419
0.0420
Seed Layer
Cu
7440-50-8
0.0074
60.6700
719
0.0720
Interconnect
Cu
7440-50-8
0.1488
100.0000
14378
1.4380
Seed Layer
Ti
7440-32-6
0.0002
0.1400
20
0.0020
Seed Layer
W
7440-33-7
0.0018
1.2500
182
0.0180
Seed Layer
Cu
7440-50-8
0.0032
2.1400
311
0.0310
UBM
Cu
7440-50-8
0.1450
96.4700
14009
1.4010
Interconnect
Sn
7440-31-5
2.8545
95.5000
275700
27.5700
Interconnect
Ag
7440-22-4
0.1195
4.0000
11548
1.1550
Interconnect
Cu
7440-50-8
0.0149
0.5000
1443
0.1440
Die
Circuit
Si
7440-21-3
6.5411
100.0000
631772
63.1770
Top Surface
Laminate
Mark Surface
Proprietary
Trade
Secret
0.3661
100.0000
35365
3.5365
% Total:
100.0000
RDL Seed Layer
Copper
Under Bump
Metallization
Solder Ball
Package Weight (mg):
0.0762
100.0000
7367
0.7367
0.0695
100.0000
6718
0.6718
0.0004
3.9300
47
0.0050
10.3529
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-96110 Rev. *A
Page 2 of 4
49L – WLCSP
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Others
Material
Cover tape
Carrier tape
Plastic Reel
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
Analysis
Report
(Note2)
-
-
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-96110 Rev. *A
Page 3 of 4
49L – WLCSP
Pb-Free Package
Document History Page
Document Title:
49L WLCSP (3.085X3.25X0.55 MM)- PB-FREE PACKAGE MATERIAL
DECLARATION DATASHEET
Document Number:
001-96110
Rev.
ECN No.
**
*A
4631775
5123002
Orig. of
Change
JVP
HLR
Description of Change
New Specification
Changed the substances with “------------- “to “Trade
Secret
Removed Distribution and Posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-96110 Rev. *A
Page 4 of 4
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