47ball Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package Material Declaration Datasheet.pdf

47ball - Flip-chip BGA (9.9 X 9.9 X 1.25
mm) Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FR
B1: 108.9912 mg
Body Size (mil/mm)
Package Weight – Site 2
9.9x9.9x1.25 mm
N/A
SUMMARY
The 47ball – Flip-chip BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers
containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS)
requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package
Qualification Report #s 153703 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-FR47ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 002-10433 Rev. **
Page 1 of 5
47ball - Flip-chip BGA (9.9 X 9.9 X 1.25
mm) Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Material
Purpose
of Use
AUS SR1
Substrate
HL832NSF
ABF GX13R
Copper
1518
243
441
% Weight
of
substanc
e per
package
0.1518
0.0243
0.0441
0.0107
8
0.0008
0.00083
0.04519
0.04519
0.04519
0.0107
0.5805
0.5805
0.5805
8
415
415
415
0.0008
0.0415
0.0415
0.0415
0.01244
0.1598
114
0.0114
0.00746
0.0959
68
0.0068
0.01741
0.2237
160
0.0160
Trade Secret
1.96009
25.1810
17984
1.7984
65997-17-3
1.96009
25.1810
17984
1.7984
68-12-2
0.00980
0.1259
90
0.0090
108-94-1
0.04900
0.6295
450
0.0450
25068-38-6
0.08526
1.0954
782
0.0782
7631-86-9
0.39202
5.0362
3597
0.3597
64742-94-5
0.04900
0.6295
450
0.0450
108-88-3
Nonindication
7440-50-8
0.00294
0.0378
27
0.0027
0.39202
5.0362
3597
0.3597
2.46921
31.7215
22655
2.2655
Substance
Composition
CAS
Number
Acrylic Resin
Acrylic Monomer
Epoxy Resin
Phthalocyanine
Blue
Organic Pigment
Barium Sulfate
Silica
Talc
Aromatic
Carbonyl
Compound
Amine
Compound
Debubbling,Lev
elling Agents
Cured
thermosetting
resin
Continuous
Filament Fiber
Glass
N,NDimethylformami
de
Cyclohexanone
Bisphenol A
epoxy resin
Silica
Coal tar Trade
Secretphtha
Toluene
Trade Secret
Trade Secret
Trade Secret
Other
Copper
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
0.16542
0.02653
0.04809
% Weight of
substance
per
homogenous
material
2.1251
0.3409
0.6178
0.00083
Weight by
mg
PPM
Trade Secret
Trade Secret
Trade Secret
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 002-10433 Rev. **
Page 2 of 5
47ball - Flip-chip BGA (9.9 X 9.9 X 1.25
mm) Pb-Free Package
Solder Ball
External
Plating
Die
Circuit
Seed layer
Cu pillar
Cu pillar
Bump
Underfill
Capacitors
Solder
Stress
Relief
ASE-UA26
Dielectric
Other
Inner
electrode
Terminal
Electrode
Sn
Ag
Cu
Ni
Si
Ti
Cu
Cu
Sn
Ag
p-(2,3epoxypropoxy)N,N-bis(2,3epoxypropy)anili
ne
Bisphenol F type
liquid epoxy
resin
Bisphenol A
type liquid epoxy
resin
Amine type
hardener
Carbon black
Silicon dioxide
Additives
Barium titanate
Other
Nickel
7440-31-5
7440-22-4
7440-50-8
7440-02-0
7440-21-3
7440-32-6
7440-50-8
7440-50-8
7440-31-5
7440-22-4
Cu
ElectroPlating
ElectroPlating
8.75801
0.10697
0.04457
0.00446
0.01356
0.00000
0.00000
0.00027
0.00009
0.00000
98.2500
1.2000
0.5000
0.0500
97.6494
0.0024
0.0097
1.9323
0.6162
0.0162
8036
98
41
4
223,828
0
0
0
0
0
8.0355
0.0981
0.0409
0.0041
22.3828
0.0000
0.0000
0.0002
0.0001
0.0000
0.13000
10.0000
1193
0.1193
0.13000
10.0000
1193
0.1193
0.03900
3.0000
358
0.0358
0.09750
7.5000
895
0.895
0.00650
0.85800
0.03900
52.1766
0.5914
12.2822
0.5000
66.000
3.0000
57.3500
0.6500
13.5000
60
7872
358
4787
54
1127
0.0060
0.7872
0.0358
0.4787
0.5426
11.2690
7440-50-8
20.0154
22.0000
1836
18.3643
Sn
7440-31-5
3.6392
4.0000
334
3.3390
Nickel
7440-02-0
2.2745
2.5000
209
2.0868
% Total:
100.0000
5026-74-4
9003-36-5
25068-38-6
Trade secret
1333-86-4
60676-86-0
Trade secret
12047-27-7
Trade Secret
7440-02-0
Package Weight (mg):
108.991
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Material
Cover tape
Carrier tape
Lead
PPM
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 002-10433 Rev. **
Page 3 of 5
Analysis
Report
(Note2)
CoA-COVT-R
CoA-CART-R
47ball - Flip-chip BGA (9.9 X 9.9 X 1.25
mm) Pb-Free Package
Tray
Others
Plastic Reel
Tray
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 4.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 4.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 5.0
<5.0
--------<5.0
<5.0
<5.0
---------
<5.0
--------<5.0
<5.0
<5.0
-----------
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 002-10433 Rev. **
Page 4 of 5
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
47ball - Flip-chip BGA (9.9 X 9.9 X 1.25
mm) Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
**
47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 MM) PB-FREE PACKAGE MATERIAL
DECLARATION DATASHEET
002-10433
ECN No. Orig. of
Change
5053897 JSO
Description of Change
New Release
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100%
material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS,
Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 002-10433 Rev. **
Page 5 of 5
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