47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 FR B1: 108.9912 mg Body Size (mil/mm) Package Weight – Site 2 9.9x9.9x1.25 mm N/A SUMMARY The 47ball – Flip-chip BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 153703 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-FR47ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 002-10433 Rev. ** Page 1 of 5 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) Material Purpose of Use AUS SR1 Substrate HL832NSF ABF GX13R Copper 1518 243 441 % Weight of substanc e per package 0.1518 0.0243 0.0441 0.0107 8 0.0008 0.00083 0.04519 0.04519 0.04519 0.0107 0.5805 0.5805 0.5805 8 415 415 415 0.0008 0.0415 0.0415 0.0415 0.01244 0.1598 114 0.0114 0.00746 0.0959 68 0.0068 0.01741 0.2237 160 0.0160 Trade Secret 1.96009 25.1810 17984 1.7984 65997-17-3 1.96009 25.1810 17984 1.7984 68-12-2 0.00980 0.1259 90 0.0090 108-94-1 0.04900 0.6295 450 0.0450 25068-38-6 0.08526 1.0954 782 0.0782 7631-86-9 0.39202 5.0362 3597 0.3597 64742-94-5 0.04900 0.6295 450 0.0450 108-88-3 Nonindication 7440-50-8 0.00294 0.0378 27 0.0027 0.39202 5.0362 3597 0.3597 2.46921 31.7215 22655 2.2655 Substance Composition CAS Number Acrylic Resin Acrylic Monomer Epoxy Resin Phthalocyanine Blue Organic Pigment Barium Sulfate Silica Talc Aromatic Carbonyl Compound Amine Compound Debubbling,Lev elling Agents Cured thermosetting resin Continuous Filament Fiber Glass N,NDimethylformami de Cyclohexanone Bisphenol A epoxy resin Silica Coal tar Trade Secretphtha Toluene Trade Secret Trade Secret Trade Secret Other Copper Trade Secret Trade Secret Trade Secret Trade Secret Trade Secret 0.16542 0.02653 0.04809 % Weight of substance per homogenous material 2.1251 0.3409 0.6178 0.00083 Weight by mg PPM Trade Secret Trade Secret Trade Secret Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 002-10433 Rev. ** Page 2 of 5 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package Solder Ball External Plating Die Circuit Seed layer Cu pillar Cu pillar Bump Underfill Capacitors Solder Stress Relief ASE-UA26 Dielectric Other Inner electrode Terminal Electrode Sn Ag Cu Ni Si Ti Cu Cu Sn Ag p-(2,3epoxypropoxy)N,N-bis(2,3epoxypropy)anili ne Bisphenol F type liquid epoxy resin Bisphenol A type liquid epoxy resin Amine type hardener Carbon black Silicon dioxide Additives Barium titanate Other Nickel 7440-31-5 7440-22-4 7440-50-8 7440-02-0 7440-21-3 7440-32-6 7440-50-8 7440-50-8 7440-31-5 7440-22-4 Cu ElectroPlating ElectroPlating 8.75801 0.10697 0.04457 0.00446 0.01356 0.00000 0.00000 0.00027 0.00009 0.00000 98.2500 1.2000 0.5000 0.0500 97.6494 0.0024 0.0097 1.9323 0.6162 0.0162 8036 98 41 4 223,828 0 0 0 0 0 8.0355 0.0981 0.0409 0.0041 22.3828 0.0000 0.0000 0.0002 0.0001 0.0000 0.13000 10.0000 1193 0.1193 0.13000 10.0000 1193 0.1193 0.03900 3.0000 358 0.0358 0.09750 7.5000 895 0.895 0.00650 0.85800 0.03900 52.1766 0.5914 12.2822 0.5000 66.000 3.0000 57.3500 0.6500 13.5000 60 7872 358 4787 54 1127 0.0060 0.7872 0.0358 0.4787 0.5426 11.2690 7440-50-8 20.0154 22.0000 1836 18.3643 Sn 7440-31-5 3.6392 4.0000 334 3.3390 Nickel 7440-02-0 2.2745 2.5000 209 2.0868 % Total: 100.0000 5026-74-4 9003-36-5 25068-38-6 Trade secret 1333-86-4 60676-86-0 Trade secret 12047-27-7 Trade Secret 7440-02-0 Package Weight (mg): 108.991 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Material Cover tape Carrier tape Lead PPM < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 PBB PPM <5.0 <5.0 PBDE PPM <5.0 <5.0 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 002-10433 Rev. ** Page 3 of 5 Analysis Report (Note2) CoA-COVT-R CoA-CART-R 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package Tray Others Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 <5.0 --------<5.0 <5.0 <5.0 --------- <5.0 --------<5.0 <5.0 <5.0 ----------- Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 002-10433 Rev. ** Page 4 of 5 CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. ** 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 002-10433 ECN No. Orig. of Change 5053897 JSO Description of Change New Release Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 002-10433 Rev. ** Page 5 of 5