388-FCBGA NON PB-FREE Package Material Declaration Datasheet.pdf

388 - FCBGA
Non Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FG
13,418.0100 mg
Body Size (mil/mm)
Package Weight – Site 2
35 X 35 mm
N/A
SUMMARY
The 388-FCBGA is a Non Pb-Free package. Standard components (Non Pb-Free) currently in production
are RoHS 5 compliant. Standard components may contain Pb, but do not contain the other 5 substances
(above allowable levels).
ASSEMBLY Site 1: Amkor Technology Gwangiu Korea (K4)
Package Qualification Report # 043404 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS are listed in section 1A. Materials from this list may be contained or intentionally added to this
product, as it is not considered Pb-Free or RoHS compliant.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
296
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
22,060
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05869 Rev. *F
Page 1 of 4
388 - FCBGA
Non Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Submateri
al
Substance
Composition
Laminate
Sb
Laminate
Substrate
Base
Material
Stiffiner
Stiffiner
Adhesive
Solder Ball
External
Plating
Pad
Ball
Underfill
Die Attach
Adhesive
Bump
FC Bump
Pad
Die
Heatspreader
Circuit
Heat
Dissipation
Plating
CAS
Number
Weight by
mg
Trade Secret
2023.4300
% Weight of
Substance per
Homogeneous
Material
32.1600%
150,800
% Weight of
Substance
per
Package
15.0800%
PPM
7440-36-0
0.1300
0.0000%
10
0.0000%
Brominated
Compound
Solder Mask
Cu
Cu
Polymer Resin
Trade Secret
250.5800
3.9800%
18,675
1.8700%
Trade Secret
7440-50-8
7440-50-8
Trade Secret
69.1000
1179.4400
2654.0800
34.6200
1.1000%
18.7500%
42.1900%
0.5500%
5,150
87,900
197,800
2,580
0.5100%
8.7900%
19.7800%
0.2600%
Silane
Silica
Ni
Pd
Au
Sn
Pb
Si
Zn
Al
Bis F Epoxy
Resin
Bis A Epoxy
Resin
Phenolic Resin
Silica
Carbon Black
Additives
Sn
Pb
Sn
Pb
Ni
Pd
Au
Si
Cu
Ni
Trade Secret
Trade Secret
7440-02-0
7440-05-3
7440-57-5
7440-31-5
7439-92-1
7440-21-3
7440-66-6
7429-90-5
Trade Secret
3.4900
76.4800
3.6200
0.5400
0.4000
497.8100
292.5100
6.4400
19.4600
39.0500
18.7900
0.0600%
1.2200%
0.4600%
0.0700%
0.0500%
62.6300%
36.8000%
3.8000%
11.4800%
23.0300%
11.0800%
260
5,700
270
40
30
37,100
21,800
480
1,450
2,910
1,400
0.0300%
0.5700%
0.0300%
0.0000%
0.0000%
3.7100%
2.1800%
0.0500%
0.1500%
0.2900%
0.1400%
Trade Secret
2.4200
1.4300%
180
0.0200%
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-31-5
7439-92-1
7440-31-5
7439-92-1
7440-02-0
7440-05-3
7440-57-5
7440-21-3
7440-50-8
7440-02-0
19.0500
52.3300
0.5400
1.8800
4.4300
2.6800
1.3400
0.8100
0.2700
0.0400
0.0300
589.7200
5463.8100
108.6900
11.2300%
30.8600%
0.3200%
1.1100%
2.6100%
1.5800%
0.7900%
0.4800%
0.1600%
0.0200%
0.0200%
9.5700%
88.6700%
1.7600%
1,420
3,900
40
140
330
200
100
60
20
3
2
43,950
407,200
8,100
0.1400%
0.3900%
0.0000%
0.0100%
0.0300%
0.0200%
0.0100%
0.0100%
0.0000%
0.0000%
0.0000%
4.3900%
40.7200%
0.8100%
Package Weight (mg): 13,418.0100
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05869 Rev. *F
Page 2 of 4
388 - FCBGA
Non Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tube
Others
Material
Cover tape
Carrier tape
Plastic Reel
Plastic Tube
End Plug
Shielding bag
Moisture Barrier bag
Protective Band
Shipping and Inner
Box
Desiccant
Bubble Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 0.5
< 0.5
< 2.0
< 2.0
< 2.0
< 10.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 4.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 1.0
< 1.0
< 2.0
< 2.0
< 2.0
< 5.0
PBB
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
---------
PBDE
PPM
<5.0
<5.0
<5.0
< 5.0
< 5.0
<5.0
<5.0
<5.0
-----------
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-PLTB-R
CoA-EPLG-R
CoA-SBAG –R
CoA-MBBG-R
CoA-PROB-R
CoA-ABOX-R
CoA-DESS-R
CoA-BUBP-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05869 Rev. *F
Page 3 of 4
388 - FCBGA
Non Pb-Free Package
Document History Page
Document Title:
Document Number:
388-FCBGA Non Pb-Free PACKAGE MATERIAL DECLARATION DATASHEET
001-05869
Rev. ECN No. Orig. of
Change
**
410770
GFJ
*A
2589324 MAHA
*B
DCon
2794115 MAHA
*C
*D
3084072 MAHA
3824788 MRB
*E
4031244 YUM
*F
5081480 MRB
DCON
Description of Change
New document
1. Updated Cypress logo.
2. Added % weight of substance per Homogenous Material and %
weight of substance per package on the Material Composition
for Assembly Site 1.
3. Completed the RoHS Substances namely; Lead Cadmium,
Mercury, Chromium VI, PBB and PBDE on Declaration of
Packaging Indirect Materials table for Assembly Site 1.
Replaced CML with WEB in distribution list.
Corrected CAS number of Au for assembly site 1. Added CAS
number of Pb for the solder ball on assembly site 1.
Added the weight of Lead on Table A.
Updated the Package Weight from 13,418 to 13,418.0100 mg
Updated the material composition table to reflect 4 decimal places
on values.
Added Assembly site name in the Assembly heading.
Removed Tray and End Pin in the Indirect Materials section.
Changed CAS # from “-------------“ to Trade Secret
Removed Distribution: WEB and Posting: None in the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-05869 Rev. *F
Page 4 of 4