28L - PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET

28L - PDIP
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
PZ
3,960.9510 mg
Body Size (mil/mm)
Package Weight – Site 2
600 mils
4,612.6501 mg
SUMMARY
The28L-600 mils PDIP Pb-Free package is compliant to RoHS. Cypress Ordering Part Number containing
an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the of Directive 2002/95/EC (RoHS)
requirement.
ASSEMBLY Site 1: Millennium Microtech Thailand (MMT)
Package Qualification Report # 092014 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
<5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ28MMT
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-03208 Rev. *G
Page 1 of 5
28L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Leadframe
Purpose of
Use
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Copper
7440-50-8
1,301.9211
% weight
of
substance
per
Homogene
ous
97.0200%
Ferrous
Zinc
7439-89-6
7440-66-6
34.8897
2.6838
2.6000%
0.2000%
8,809
677
0.88%
0.07%
Phosphorus
Lead
Nickel
Gold
Palladium
Epoxy Resin
Silver (Ag)
Aromatic Amine
Si
Au
Impurity (Ag,Ca,
Cu,Fe,Mg)
Silica Fused
Epoxy Resin
Epoxy, Cresol
Phenol resin
Carbon Black
7723-14-0
7439-92-1
7440-02-0
7440-57-5
7440-05-3
Trade Secret
7440-22-4
Trade Secret
7440-21-3
7440-57-5
2.0129
0.4026
24.1486
0.6703
1.0611
0.6300
2.8000
0.0700
9.8000
0.9799
0.0010
0.1500%
0.0300%
93.3100%
2.5900%
4.1000%
18.0000%
80.0000%
2.0000%
100.0000%
99.9900%
0.0100%
508
99
6,097
169
268
159
708
19
2,475
249
0
0.05%
0.01%
0.61%
0.02%
0.03%
0.02%
0.07%
0.00%
0.25%
0.02%
0.00%
2,238.4678
154.7328
51.5776
128.9440
5.1578
86.8000%
6.0000%
2.0000%
5.0000%
0.2000%
565,132
39,064
13,019
32,553
1,304
56.51%
3.91%
1.30%
3.26%
0.13%
Substance
Composition
CAS Number
Trade Secret
60676-86-0
Trade Secret
29690-82-2
Trade Secret
1333-86-4
Package Weight (mg):
Weight by
mg
3,960.9510
328,691
%Weight
of
Substan
ce per
package
%
32.87%
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-03208 Rev. *G
Page 2 of 5
28L - PDIP
Pb-Free Package
ASSEMBLY Site 2: Amkor Technology Philippines (P1/P2)
Package Qualification Report # 122903 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
<5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-PZ28Amkor
Philippines
(P1/P2)
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-03208 Rev. *G
Page 3 of 5
28L - PDIP
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of
Use
Material
Lead frame
Base Material
External
Plating
Lead Finish
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Copper (Cu)
Iron (Fe)
Zinc (Z)
Phosphorus (P)
Silver (Ag)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
7440-22-4
853.0892
21.0099
1.0505
0.2626
1.4886
% weight of
substance per
Homogenous
material
97.2846
2.3959
0.1198
0.0299
0.1698
Tin (Sn)
7440-31-5
32.0750
100.0000
6,954
0.6954
Trade Secret
7440-22-4
0.1410
1.4096
7.0000
70.0000
30
305
0.003
0.0305
Trade Secret
0.0604
3.0000
13
0.0013
Trade Secret
0.1007
5.0000
22
0.0022
Trade Secret
0.1007
5.0000
22
0.0022
Trade Secret
0.2014
10.0000
44
0.0044
7440-21-3
7440-50-8
6.0762
0.2651
100.0000
100.0000
1,317
57.4663
0.1317
0.0057
Trade Secret
277.1489
7.5000
60,085
6.0085
60676-86-0
1333-86-4
3,177.9745
18.4766
86.0000
0.5000
688,969
4,006
68.8969
0.4006
Trade Secret
73.9064
2.0000
16,023
1.6023
Trade Secret
147.8128
4.0000
32,045
3.2045
Package Weight (mg):
4,612.6501
% Total:
100.0000
Substance
Composition
Resin
Silver
Mixed aryl allyl
glycidyl compounds
Amine
Gamma
Butyrolactone
Diglycidylether of
bisphenol-F
Silicon
Copper (Cu)
Multi-aromatic
Resin
SiO2 Filler
Carbon Black
Epoxy Cresol
Novolac
Phenol Resin
CAS Number
Weight by mg
% weight of
substance per
package
PPM
184,945
4,555
228
57
323
18.4945
0.4555
0.0228
0.0057
0.0323
II. DECLARATION OF PACKAGING INDIRECT MATERIALS
Type
Tube
Others
Material
Plastic Tube
End Pin
End Plug
Shielding Bag
Lead
PPM
<2.0
<2.0
<2.0
<2.0
Cadmium
PPM
<2.0
<2.0
<2.0
< 2.0
Cr VI
PPM
<2.0
<2.0
<2.0
< 2.0
Mercury
PPM
<2.0
<2.0
<2.0
< 2.0
PBB
PPM
<0.0005
<0.0005
<0.0005
< 5.0
PBDE
PPM
<0.0005
<0.0005
<0.0005
< 5.0
Analysis Report
(Note2)
CoA-PLTB-R
CoA-ENDP-R
CoA-EPLG-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-03208 Rev. *G
Page 4 of 5
28L - PDIP
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
28L - PDIP PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-03208
**
*A
ECN No. Orig. of
Change
385878
EML
1092426 MRB
*B
2721039 ZJL
*C
*D
Dcon
3278144 HLR
3925886 VFR
*E
4055149 YUM
*F
4420788 HLR
*G
5341217 HLR
DCON
Description of Change
New document
1. Updated Cypress Logo
2. Added on the material composition the percent weight
per homogeneous material and weight of substance
3. Updated and added Lead, Cr+VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials.
Added note 4: the package were based on
Engineering calculation and performed on a package
family basis
1. Included PMDD for MMT location X.
2. Deleted PMDD of Omedata location O.
3. Changed from CML to WEB in distribution.
Sunset Due – No Change.
Added PMDD for Site 2 – Amkor Technology Philippines;
reference QTP # 122903
Added assembly site name in the Assembly heading in
site 1 and 2.
Changed the assembly code to assembly site name in
site 1 and 2.
Update material composition in Assembly Site 1 to reflect
4 decimal on values.
Corrected the total package weight of Assembly Site 1
from 3960.9509mg to 3960.9510mg.
Changed Cypress Logo.
Changed the substances with “------------- “and Proprietary
to “Trade Secret".
Removed Distribution and posting information from
Document history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material
information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-03208 Rev. *G
Page 5 of 5