48-FBGA (6 x 8x 1.2 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BK 102.5997 mg Body Size (mil/mm) Package Weight – Site 2 6 x 8 x 1.2 mm N/A SUMMARY The 48-BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 131806 (Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note2) CoA-BK48MASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-88565 Rev. ** Page 1 of 4 48-FBGA (6 x 8x 1.2 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Using Au wire with SnAgCu-Ni Solder Ball Material Substrate Purpose of Use Base Material Solder Ball External Plating Die Attach Adhesive Die Circuit Wire Interconnect Mold Compound Encapsulation Cured Resin ------------------ 7.2520 % weight of substance per Homogenous material 28.0000% Glass Fabrics ------------------ 5.6980 Copper Foil Diethylene Glycol Monoethyl Ether Acetate Acetophenone Derirative Silica Crystalline Solvent naptha Sn Ag Cu Ni Epoxy Resin Dapsone Treated fumed Silica Substituted Silane Si Au Ion Impurities Silica Fused Epoxy Resin Phenol Resin Carbon Black 7440-50-8 Substance Composition 70,682 % weight of substance per package 7.0682% 22.0000% 55,536 5.5536% 7.7700 30.0000% 75,731 7.5731% ------------------ 1.2950 5.0000% 12,622 1.2622% ------------------ 1.2950 5.0000% 12,622 1.2622% 60676-86-0 -----------------7440-31-5 7440-22-4 7440-50-8 7440-02-0 -----------------80-08-0 1.2950 1.2950 0.2635 0.0032 0.0013 0.0001 1.4169 0.1214 5.0000% 5.0000% 98.2500% 1.2000% 0.5000% 0.0500% 87.5000% 7.5000% 12,622 12,622 2,568 31 13 1 13,810 1,184 1.2622% 1.2622% 0.2568% 0.0031% 0.0013% 0.0001% 1.3810% 0.1184% 67762-90-7 0.0405 2.5000% 395 0.0395% ------------------ 0.0405 2.5000% 395 0.0395% 7440-21-3 7440-57-5 ----------------60676-86-0 -----------------26834-02-6 1333-86-4 28.3382 1.5204 0.0002 39.8962 2.6972 2.2477 0.1124 100.0000% 99.9900% 0.0100% 88.7500% 6.0000% 5.0000% 2.5000% 276,201 14,819 1 388,854 26,289 21,907 1,095 27.6201% 1.4819% 0.0001% 38.8854% 2.6289% 2.1907% 0.1095% % Total: 100.0000 CAS Number Package Weight (mg): Weight by mg 102.5997 PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-88565 Rev. ** Page 2 of 4 48-FBGA (6 x 8x 1.2 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Lead PPM Cadmium PPM Cr VI PPM Mercury PPM Cover tape < 5.0 < 5.0 < 5.0 Carrier tape Plastic Reel Tray Moisture Barrier bag Shielding bag Protective Band Shipping and inner/ pizza box < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 Material PBB PPM PBDE PPM < 5.0 < 5.0 < 5.0 Analysis Report (Note2) CoA-COVT-R < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-MBBG-R CoA-SBAG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-88565 Rev. ** Page 3 of 4 48-FBGA (6 x 8x 1.2 mm) Pb-Free Package Document History Page Document Title: Document Number: Rev. ** 48 - FBGA (6X8X1.2MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-88565 ECN No. Orig. of Change 4076821 YUM Description of Change New document. Distribution: WEB Posting: None Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information. Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-88565 Rev. ** Page 4 of 4