40L QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
LQ
B1. 67.7583 mg
B2. 65.7172mg
Body Size (mil/mm)
Package Weight – Site 2
6X6X0.6 mm
B1.60.1039 mg
B2. 60.9100 mg
SUMMARY
The QFN 40L Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY8C21434-24LQXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 123807, 141702 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ40CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 1 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
B1. MATERIAL COMPOSITION (Note 3)
Copper Wire
Material
Purpose of
Use
Substance
Composition
CAS
Number
Weight by
mg
% weight of
substance per
Homogeneous
material
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
34.6900
1.0200
0.2450
0.0500
0.7076
0.0098
0.0098
0.3540
96.3478%
2.8329%
0.6805%
0.1389%
97.3047%
1.3476%
1.3476%
73.5508%
511,967
15,053
3,616
738
10,443
145
145
5,224
51.1967%
1.5053%
0.3616%
0.0738%
1.0443%
0.0145%
0.0145%
0.5224%
Trade Secret
0.0998
20.7355%
1,473
0.1473%
Trade Secret
0.0090
1.8699%
133
0.0133%
Trade Secret
Trade Secret
7440-21-3
0.0100
0.0085
7.0448
2.0777%
1.7661%
100.0000%
148
125
103,969
0.0148%
0.0125%
10.3969%
2.5400
100.0000%
37,486
3.7486%
85.1146%
3.5782%
4.2462%
4.0553%
0.4294%
2.5763%
263,289
11,069
13,135
12,545
1,328
7,969
26.3289%
1.1069%
1.3135%
1.2545%
0.1328%
0.7969%
% Total:
100.0000
Die
Circuit
Copper
Nickel
Silicon
Magnesium
Nickel
Palladium
Gold
Silver
Carbocyclic
Acrylate
Bismaleimaide
Resin
Additive
Acrylate ester
Silicon
Wire
Interconnect
Copper
7440-50-8
Encapsulation
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Others
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
17.8400
0.7500
0.8900
0.8500
0.0900
0.5400
Package Weight (mg):
67.7583
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Mold
Compound
Adhesive
PPM
% weight of
substance per
package
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 2 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
B2 MATERIAL COMPOSITION (Note 3)
Copper-Palladium Wire
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
33.9561
0.8765
0.1234
0.0523
0.7465
0.0026
0.0013
0.3477
% weight of
substance per
Homogeneous
material
96.9944%
2.5037%
0.3525%
0.1494%
99.4803%
0.3465%
0.1732%
73.4940%
516,700
13,337
1,878
796
11,359
40
20
5,291
51.6700%
1.3337%
0.1878%
0.0796%
1.1359%
0.0040%
0.0020%
0.5291%
Trade Secret
0.0968
20.4608%
1,473
0.1473%
Trade Secret
0.0098
2.0714%
149
0.0149%
Trade Secret
Trade Secret
7440-21-3
7440-50-8
0.0095
0.0093
6.8155
2.5819
2.0080%
1.9658%
100.0000%
145
142
103,710
39,288
0.0145%
0.0142%
10.3710%
3.9288%
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
Trade Secret
0.0002
16.6212
0.6327
0.8439
0.8454
0.1297
1.0149
3
252,920
9,628
12,841
12,864
1,974
15,443
0.0003%
25.2920%
0.9628%
1.2841%
1.2864%
0.1974%
1.5443%
Package Weight (mg):
65.7172
% Total:
100.0000
Substance
Composition
CAS
Number
Weight by
mg
Copper
Nickel
Silicon
Magnesium
Nickel
Palladium
Gold
Silver
Carbocyclic
Acrylate
Bismaleimaide
Resin
Acrylate ester
Additive
Silicon
Copper
7440-50-8
7440-02-0
7440-21-3
7439-95-4
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Palladium
SiO2
Metal OH
Phenol Resin
Epoxy Resin
Carbon Black
Crytalline
99.9923%
0.0077%
82.7428%
3.1497%
4.2011%
4.2085%
0.6457%
5.0523%
PPM
% weight of
substance per
package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 3 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
ASSEMBLY Site 2: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report # 130902, 134515 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
B. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-LQ40ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 4 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
B1. MATERIAL COMPOSITION (Note 3)
Using Copper Wire
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS
Number
Copper
Iron
Phosphorus
Zinc
Nickel
Palladium
Gold
Epoxy Resin
Phenol Resin
SiO2 Filler
Acrylic Copolymer
Silicon
Copper
Epoxy Resin-A
Epoxy Resin-B
Phenol Resin
Carbon Black
Silica fused
Silica fused
Silica, crystalline *
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-02-0
7440-05-3
7440-57-5
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
Trade secret
Trade secret
Trade secret
1333-86-4
60676-86-0
76361-86-9
14808-60-7
Package Weight (mg):
Weight by
mg
24.1800
0.5828
0.0074
0.0298
0.5820
0.0150
0.0030
0.1248
0.1248
0.0520
0.7384
3.6000
1.6497
0.8520
0.8520
1.4910
0.1136
22.1520
2.8400
0.1136
60.1039
% weight of
substance per
Homogeneous
material
97.5000%
2.3500%
0.0300%
0.1200%
97.0000%
2.5000%
0.5000%
12.0000%
12.0000%
5.0000%
71.0000%
100.0000%
100.0000%
2.9985%
2.9985%
5.2474%
0.3998%
77.9610%
9.9950%
0.3998%
PPM
% weight of
substance per
package
402,304
9,697
124
495
9,683
250
50
2,076
2,076
865
12,285
59,896
27,447
14,175
14,175
24,807
1,890
368,563
47,252
1,890
40.2304%
0.9697%
0.0124%
0.0495%
0.9683%
0.0250%
0.0050%
0.2076%
0.2076%
0.0865%
1.2285%
5.9896%
2.7447%
1.4175%
1.4175%
2.4807%
0.1890%
36.8563%
4.7252%
0.1890%
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 5 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
B2. MATERIAL COMPOSITION (Note 3)
Using CuPd Wire
Material
Purpose of
Use
Substance
Composition
Leadframe
Base Material
Copper
Iron
Phosphorus
Zinc
Lead Finish
External
Plating
Sn
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
CAS
Number
7440-50-8
7439-89-6
7723-14-0
7440-66-6
7440-31-5
Novolak Epoxy
Resin
Phenol Resin
Amorphous Silica
Acrylic Copolymer
Silicon
Copper
Palladium
Epoxy Resin
Phenol Resin
Silica(Amorphous)
A
Silica(Amorphous)
B
Carbon Black
Trade Secret
Trade Secret
68611-44-9
Trade Secret
7440-21-3
7440-50-8
7440-05-3
Trade secret
Trade secret
60676-86-0
76361-86-9
1333-86-4
Package Weight (mg):
24.1800
0.5828
0.0074
0.0298
% weight of
substance per
Homogeneous
material
97.5000%
2.3500%
0.0300%
0.1200%
396,979
9,568
122
489
39.7000%
0.9600%
0.0100%
0.0500%
1.4200
100.0000%
23313
2.3300%
2,049
0.2000%
2,049
854
12,123
59,104
27,084
5
37,301
18,650
0.2000%
0.0900%
1.2100%
5.9100%
2.6950%
0.0050%
3.7300%
1.8700%
370,212
37.0200%
37,301
3.7300%
2,798
0.2800%
% Total:
100.0000
Weight by
mg
0.1248
0.1248
0.0520
0.7384
3.6000
1.6497
0.0003
2.2720
1.1360
22.5496
2.2720
0.1704
PPM
12.0000%
12.0000%
5.0000%
71.0000%
100.0000%
99.9800%
0.0200%
8.0000%
4.0000%
79.4000%
8.0000%
0.6000%
60.9100
% weight of
substance per
package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
PBDE
PPM
<5.0
<5.0
<5.0
<5.0
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In
order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are
calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 6 of 7
40L – QFN 6X6X0.6 mm
(Saw Version) Pb-Free
Document History Page
Document Title:
Document Number:
Rev.
40L - QFN 6X6X0.6 MM (SAW VERSION) PB- FREE PACKAGE MATERIAL DECLARATION
DATASHEET
001-86585
**
*A
ECN No. Orig. of
Change
3929717 AWP
4066975 YUM
*B
4248774 JARG
*C
4370018 AWP
*D
4943171 YUM
DCON
Description of Change
Initial spec release.
Added assembly site name in the assembly heading.
Changed assembly code to assembly site name.
Removed entire Tube row in the Indirect Materials section.
Added material composition for Assembly Site 2 – ASE Taiwan.
Reference QTP 130902.
Added B1 to identify Copper and also added the whole table of B2
for the Copper-Palladium wire reference-QTP#141702 for
Assembly Site 1.
Added material composition for Assembly Site 2 – ASE Taiwan.
Reference QTP 134515.
Removed distribution and posting.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural impurity. In order to
report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor PMDD’s are calculated using
MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-86585 Rev. *D
Page 7 of 7
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