Package Chemistry Substances Analysis Table LSE 064 (Pb-free solder balls) 13 x 11 mm 312 mg 260°C 3 BKK Product is RoHS Compliant Package Type: Dimension: Weight of Unit Package: Temperature rating: MSL: Assembly Location: Description Silicon Die Bond wire Die Attach Substrate Mold compound Solder ball Chemicals Present CAS Number unit weight(mg) #1 Silicon 7440-21-3 67.5645 subtotal 67 5645 67.5645 #1 Gold 7440-57-5 1.1628 subtotal 1.1628 #1 Epoxy resin Trade Secret 4.9774 #2 Polytetrafluoroethylene 9002-84-0 1.7464 #3 Silica (fused) 60676-86-0 0.4061 subtotal 7.1300 #1 Brominated Epoxy Resins Trade Secret 4.3377 #2 Copper 7440-50-8 15.6957 #3 Gold 7440-57-5 0.0683 #4 Nickel 7440-02-0 0.3723 #5 Epoxy resin Trade Secret 21.1924 #6 Silica 14808-60-7 3.6703 #7 SiO2 Glass Cloth 65997-17-3 16.0160 subtotal 61.3527 #1 Silica (fused) 60676-86-0 103.1462 #2 Carbon Black 1333-86-4 0.3034 #3 Epoxy resin Trade Secret 16.8068 #4 Phosphoric organic catalyst Trade Secret 0.3640 #5 Metal Oxides Trade Secret 0 7281 0.7281 subtotal 121.3485 #1 Tin 7440-31-5 51.5084 #2 Silver 7440-22-4 1.6013 #3 Copper 7440-50-8 0.2669 subtotal 53.3765 TOTAL PACKAGE 311.9350 unit weight/package (%) 21.6598 21 6598 21.6598 0.3728 0.3728 1.5957 0.5599 0.1302 2.2857 1.3906 5.0317 0.0219 0.1193 6.7939 1.1766 5.1344 19.6684 33.0666 0.0973 5.3879 0.1167 0 2334 0.2334 38.9019 16.5125 0.5133 0.0856 17.1114 100.0000 Amount (ppm) 216,598 216 598 216,598 3,728 3,728 15,957 5,599 1,302 22,857 13,906 50,317 219 1,193 67,939 11,766 51,344 196,684 330,666 973 53,879 1,167 2 334 2,334 389,019 165,125 5,133 856 171,114 1,000,000 Disclaimer: In general, four decimal values are shown. However, some varience remains from package to package. The mass values presented are thought g , , p g p g p g to be accurate to within 20 percent. The report does not include materials not intentionally added to our products (impurities), or material concentrations less than 1 ppm. Document No. 002-12946 Rev. ** Page 1 of 2 CYPRESS Company Confidential Document History Page Document Title: Material Declaration Datasheet (MDDS) - FBGA064 (LSE064) - BKK - Au Wire Document Number: 002-12946 Rev. ** ECN No. Orig. of Description of Change Change 5268387 AAC Initial Release. Document No. 002-12946 Rev. ** Page 2 of 2