28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

28L – TSOP I (Reverse Option)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
ZY
228.6300 mg
B1: 300.0002 mg
B2: 261.8521 mg
Body Size (mil/mm)
Package Weight – Site 2
8x13.4 mm
229.6700 mg
SUMMARY
The 28L-TSOP I (Reverse Option) Pb-Free package is qualified at two assembly sites. Packages from
different assembly sites are likely to have different materials composition. However, Cypress guarantees
that as long as products are being ordered with a Cypress Part Number containing an “X” (e.g.
CY7C1328G-133AXI, CY2308SXC-1HT) they meet the requirement of RoHS.
ASSEMBLY Site 1: Cypress Manufacturing Limited (CML)
Package Qualification Report # 021903 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZY28-CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 1 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose of
Use
Leadframe
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
Epoxy resin
Phenol resin
Brominated
epoxy resin
Antimony
trioxide
Silica
Others
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
107.4800
1.3800
0.3500
4.6100
0.1930
0.0035
0.0035
0.5000
0.0600
% Weight of
Substance per
Homogeneous
Material
94.4298%
1.2124%
0.3075%
4.0503%
96.5200%
1.7400%
1.7400%
80.6452%
9.6774%
Trade Secret
0.0300
4.8387%
131
0.0131%
Trade Secret
Trade Secret
Trade Secret
0.0100
0.0100
0.0100
1.6129%
1.6129%
1.6129%
44
44
44
0.0044%
0.0044%
0.0044%
7440-21-3
7440-57-5
129915-35-1
26834-02-6
Trade Secret
8.7800
0.9600
5.2100
5.2100
1.0400
100.0000%
100.0000%
4.9976%
4.9976%
0.9976%
38,403
4,199
22,788
22,788
4,549
3.8403%
0.4199%
2.2788%
2.2788%
0.4549%
1309-64-4
0.5200
0.4988%
2,274
0.2274%
91.2300
1.0400
87.5108%
0.9976%
399,029
4,549
39.9029%
0.4549%
CAS Number
7631-86-9
Trade Secret
Package Weight (mg):
Weight by
mg
228.6300
PPM
470,105
6,036
1,531
20,164
844
15
15
2,187
262
47.0105%
0.6036%
0.1531%
2.0164%
0.0844%
0.0015%
0.0015%
0.2187%
0.0262%
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
% Weight of
Substance
per Package
Page 2 of 11
100.0000
28L – TSOP I (Reverse Option)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Desiccant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 3 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
ASSEMBLY Site 2: Orient Semiconductor Electronics Taiwan (OSET)
Package Qualification Report # 033104 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZY28OSET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 4 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Purpose of
Use
Material
Lead frame
Base Material
Lead Finish
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Ni
Mg
Si
C
Fe
Sn
Epoxy Resin
Metal
Ag
Si
Au
Epoxy resin
Phenol resin
Aromatic
Phosphate
Carbon Black
Silica
28.5400
0.3500
1.3900
0.0100
39.3100
2.1300
0.0500
0.0200
0.2900
2.1300
0.4800
6.9700
6.2000
2.0100
% Weight of
Substance per
Homogeneous
Material
41.0057%
0.5029%
1.9971%
0.0144%
56.4799%
100.0000%
13.8889%
5.5556%
80.5556%
100.0000%
100.0000%
4.4976%
4.0008%
1.2970%
124,265
1,524
6,052
44
171,159
9,274
218
87
1,263
9,274
2,090
30,348
26,995
8,752
12.4265%
0.1524%
0.6052%
0.0044%
17.1159%
0.9274%
0.0218%
0.0087%
0.1263%
0.9274%
0.2090%
3.0348%
2.6995%
0.8752%
0.3100
139.4800
0.2000%
90.0045%
1,350
607,306
0.1350%
60.7306%
Weight by
mg
CAS Number
7440-02-0
7439-95-4
7440-21-3
7440-44-0
7439-89-6
7440-31-5
Trade Secret
Trade Secret
7440-22-4
7440-21-3
7440-57-5
129915-35-1
26834-02-6
Trade Secret
1333-86-4
7631-86-9
Package Weight (mg):
229.6700
% Weight of
Substance
per Package
PPM
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Desiccant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 5 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
ASSEMBLY Site 3: Jiangsu Changjiang Electronics Technology (JCET)
Package Qualification Report # 104815 /104816, 141303 (See Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-ZY28- JCET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 6 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
B1.USING GOLD WIRE
Material
Purpose of
Use
Lead frame
Base Material
Lead Finish
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cu
Si
Mg
Ni
Ni
Pd
Au
Ag
Proprietary
bismaleimide
Proprietary
polymer
Methacrylate
Acrylate ester
Organic
peroxide
Si
Au
SiO2
Phenol Resin
Epoxy Resin
CAS Number
7440-50-8
7440-21-3
7439-95-4
7440-02-0
7440-02-0
7440-05-3
7440-57-5
7440-22-4
Trade Secret
62.1975
0.4203
0.0970
1.9396
1.2989
0.0234
0.0235
0.1862
% weight of
substance per
Homogeneous
96.2000%
0.6500%
0.1500%
3.0000%
96.5204%
1.7370%
1.7427%
80.0000%
0.0210
9.0000%
Weight by
mg
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
Package Weight (mg):
PPM
207,325
1,401
323
6,465
4,330
78
78
621
70
%Weight of
Substance
per package
20.7325%
0.1401%
0.0323%
0.6465%
0.4330%
0.0078%
0.0078%
0.0621%
0.0070%
39
0.0116
0.0047
0.0047
5.0000%
2.0000%
2.0000%
0.0047
3.2592
1.3285
203.9696
11.4590
13.7508
2.0000%
100.0000%
100.0000%
89.0000%
5.0000%
6.0000%
300.0002
0.0039%
0.0016%
0.0016%
16
16
16
0.0016%
1.0864%
0.4428%
67.9899%
3.8197%
4.5836%
10,864
4,428
679,899
38,197
45,836
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 7 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
B2.USING COPPER PALLADIUM WIRE
Material
Leadframe
Lead Finish
Purpose of
Use
Base Material
External Plating
Substance Composition
2.2000%
0.4500%
0.1500%
7440-22-4
7440-50-8
80.6650
Tin
7440-31-5
Silver
7440-22-4
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
Trade
Secret
7440-21-3
7440-50-8
7440-05-3
Trade
Secret
Trade
Secret
Trade
Secret
60676-86-0
1333-86-4
150.7900
0.5100
Package Weight (mg):
261.8521
7440-02-0
7440-21-3
7439-95-4
Silver
Copper
Proprietary Polymer
Adhesive
Methacrylate
Acrylate Ester
Organic Peroxide
Die
Circuit
Wire
Interconnect
Silicon
Copper
Palladium
Epoxy Resin A
Mold
Compound
Encapsulation
Weight by
mg
1.8700
0.3825
0.1275
1.9550
Nickel
Silicon
Magnesium
Proprietary Bismaleimide
Die Attach
CAS
Number
% weight of
substance
per
Homogeneo
us
Epoxy Resin B
Phenol Resin
Silica(Amorphous)
Carbon Black
PPM
%% Weight
of Substance
per package
2.3000%
7,141
1,461
487
7,466
0.7141%
0.1461%
0.0487%
0.7466%
94.9000%
308,056
30.8056%
2.1300
100.0000%
8,134
0.8134%
0.1862
80.0000%
711
0.0711%
80
0.0080%
44
0.0044%
18
0.0018%
18
0.0018%
18
0.0018%
12,447
4,615
82
1.2447%
0.4615%
0.0082%
19,477
1.9477%
19,477
1.9477%
32,461
3.2461%
575,859
1,948
57.5859%
0.1948%
% Total:
100.0000
0.0210
0.0116
0.0047
0.0047
0.0047
3.2592
1.2085
0.0215
5.1000
5.1000
8.5000
9.0000%
5.0000%
2.0000%
2.0000%
2.0000%
100.0000%
98.2500%
1.7500%
3.0000%
3.0000%
5.0000%
88.7000%
0.3000%
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 8 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding
bag
Moisture
Barrier bag
Protective
Band
Shipping
and Inner
Box
Desiccant
Bubble
Pack
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cadmium
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
<5.0
<5.0
<5.0
--------<5.0
PBDE
PPM
<5.0
<5.0
<5.0
--------<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-MBBG-R
< 2.0
< 2.0
< 2.0
< 2.0
<5.0
<5.0
CoA-PROB-R
< 10.0
< 4.0
< 4.0
< 5.0
---------
-----------
CoA-ABOX-R
< 10.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 1.0
< 2.0
< 3.0
< 100.0
< 3.0
< 90.0
CoA-DESS-R
CoA-BUBP-R
CoA-TRAY-R
CoA-SBAG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 9 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
Document History Page
Document Title:
28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL
DECLARATION DATASHEET
Document Number:
001-03054
Rev.
**
*A
ECN No. Orig. of
Change
385640
YXP
401165
YXP
*B
2579759 MAHA
*C
DCon
2760409 MAHA
*D
3000688 MAHA
*E
*F
3176689 REYD
3359953 MAHA
Description of Change
New document
Edited Summary section, and added package weight to
reflect assembly site 2.
Added “(PMDD)” on title page.
Added PMDD data for assembly site 2.
Edited Note 3 on footer section.
Added Note 4 on footer section.
1. Updated Cypress logo.
2. Changed CoA-ZT28-R to CoA-ZY28-R.
3. Added percent weight per homogeneous material and
weight of substance per package in the material
composition table for Assembly sites 1 and 2.
4. Changed CoA-SP28-T to CoA-ZY28-T.
5. Updated and added Lead, Cr+VI, PBB and PBDE on
the Declaration of Packaging/Indirect Materials table for
assembly sites 1 and 2.
Replaced CML with WEB in distribution list.
Corrected package weight for assembly site 2.
Recalculated PPM and % Weight of Substance per
Package values for assembly site 2.
Deleted Fe and Zn from the lead frame material
composition of assembly site 1. Recalculated package
weight, % Weight of Substance per Homogeneous
Material, PPM, and % Weight of Substance per Package
values for assembly site 1.
Added Assembly Site 3 – JCET
Corrected the % weight per homogeneous material of the
lead finish of assembly site 1. Expressed the weight, %
Weight of Substance per Homogeneous Material, and %
Weight of Substance per Package in four decimal places
for all assembly sites.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 10 of 11
28L – TSOP I (Reverse Option)
Pb-Free Package
Document History Page
Document Title:
28L - TSOP I REVERSE OPTION PB-FREE PACKAGE MATERIAL
DECLARATION DATASHEET
Document Number:
001-03054
Rev.
*G
ECN
Orig. of
No.
Change
4032244 YUM
*H
4405010 REYD
*I
*J
4517979 HLR
4950972 HLR
DCON
Description of Change
Added assembly site name in the Assembly heading in site
1, 2 and 3.
Changed Assembly Code to Assembly Site Name in site 1,
2 and 3.
Removed Tube row in the Indirect Materials Section.
Added B2 on Package Weight and QTP # 141303 under
Site 3.
Added subsections B1.USING GOLD WIRE and
B2.USING COPPER PALLADIUM WIRE under Assembly
Site 3.
Added CAS Number of Carbon Black on Assembly Site 2.
Changed the substances with “-------------“to “Trade
Secret”.
Removed Distribution and Posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress
Semiconductor PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-03054 Rev. *J
Page 11 of 11
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