24 - BGA (6X8MM) with 5x5 Ball Matrix PB-FREE Package Material Declaration Datasheet.pdf

24- BGA (6 x 8 mm) with 5x5 Ball Matrix
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FAB
B1: 88.9905 mg
Package Weight – Site 3
Body Size (mil/mm)
Package Weight – Site 2
6 X 8 mm
Package Weight – Site 4
SUMMARY
The 24-BGA package is compliant to RoHS. Cypress (Legacy Spansion Part) ordering part numbers
containing an “H” (e.g. S25FL164K0XBHI020) meet the Directive of 2002/95/ EC (Rohs) requirement.
***
ASSEMBLY Site 1: Cypress Bangkok (SB)
Package Qualification Report # 153705, #153701 (Note 1)
I.
DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
Material analysis
report
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 002-03789 Rev *A
Page 1 of 4
24- BGA (6 x 8 mm) with 5x5 Ball Matrix
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Using Copper-Palladium wire material
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight by
mg
% weight of
substance per
Homogenous
material
PPM
% weight of
substance
per
package
Copper
Gold
Nickel
Epoxy resin
Aluminum
Hydroxide
SiO2 Glass Cloth
Tin
Silver
Copper
Silica
Organic filler
Acrylic resin
Diluent
Elastomer
Organic peroxide
Silicon
Copper
Palladium
Silica (fused)
Carbon Black
Epoxy resin
Phosphoric
organic catalyst
7440-50-8
7440-57-5
7440-02-0
9003-36-5
7.3114
0.0472
0.7262
7.6727
22.6393%
0.1463%
2.2488%
23.7582%
82,159
531
8,161
86,219
8.2159%
0.0531%
0.8161%
8.6219%
21645-51-2
5.5841
17.2908%
62,749
6.2749%
65997-17-3
7440-31-5
7440-22-4
7440-50-8
Trade secret
Trade secret
Trade secret
Trade secret
Trade secret
Trade secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
1333-86-4
Trade secret
10.9533
3.8341
0.1192
0.0199
0.0085
0.0424
0.0954
0.0530
0.0106
0.0021
3.9942
0.0278
0.0005
41.2149
0.1212
6.7156
33.9166%
96.5000%
3.0000%
0.5000%
4.0000%
20.0000%
45.0000%
25.0000%
5.0000%
1.0000%
100.0000%
98.3000%
1.7000%
85.0000%
0.2500%
13.8500%
123,084
43,084
1,339
223
95
476
1,072
595
119
24
44,884
312
5
463,138
1,362
75,464
12.3084%
4.3084%
0.1339%
0.0223%
0.0095%
0.0476%
0.1072%
0.0595%
0.0119%
0.0024%
4.4884%
0.0312%
0.0005%
46.3138%
0.1362%
7.5464%
Trade secret
0.1455
0.3000%
1,635
0.1635%
Metal Oxides
Trade secret
0.2909
0.6000%
3,269
0.3269%
Package Weight (mg):
88.9905
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 002-03789 Rev *A
Page 2 of 4
24- BGA (6 x 8 mm) with 5x5 Ball Matrix
Pb-Free Package
II.
Type
Tape & Reel
Tray
Others
DECLARATION OF PACKAGING INDIRECT MATERIALS
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture Barrier bag
Shielding bag
Protective Band
Shipping and inner/ pizza
box
Desiccant
Lead
PPM
Cadmium
PPM
Cr VI
PPM
Mercury
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
PBB
PPM
PBDE
PPM
Analysis
Report
(Note2)
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG-R
CoA-SBAG-R
CoA-PROB-R
CoA-ABOX-R
< 5.0
< 5.0
< 5.0
CoA-DESS-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 002-03789 Rev *A
Page 3 of 4
24- BGA (6 x 8 mm) with 5x5 Ball matrix
Pb-Free Package
Document History Page
Document Title: 24 - BGA (6X8MM) with 5x5 Ball Matrix PB-FREE PACKAGE MATERIAL DECLARATION
DATASHEET
Document Number:
002-03789
Rev.
**
*A
ECN No. Orig. of
Change
4939253 CHAL
4989529 CHAL
SLLO
Description of Change
New document
Add QTP#153701 - QSPI in FAB024
Removed Distribution and Posting from the document
history page.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 002-03789 Rev *A
Page 4 of 4
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