34L WLCSP (2.495X2.44X0.55 MM) - PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

34L – WLCSP
(2.495X2.44X0.55 MM)
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
FN
6.5573 mg
Body Size (mm)
2.495x2.44x0.55 mm
SUMMARY
The 35ball-WLCSP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an
“X” (e.g. CY8C21434A-24LKXI) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Deca Technologies Inc. Philippines (Decatech)
Package Qualification Report # 150602 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
SUBSTANCES / COMPOUNDS
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-FN34Decatech
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-97487 Rev. *B
Page 1 of 4
34L – WLCSP
(2.495X2.44X0.55 MM)
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Purpose
Substance
Composition
Polybenzoxazole1
Dielectric
Trade Secret
Polybenzoxazole2
Dielectric
Trade Secret
CAS
Number
Seed Layer
Ti
Trade
Secret
Trade
Secret
7440-32-6
RDL Seed Layer
Seed Layer
W
7440-33-7
Seed Layer
Cu
7440-50-8
Copper
Interconnect
Cu
7440-50-8
Seed Layer
Ti
7440-32-6
Seed Layer
W
7440-33-7
Seed Layer
Cu
7440-50-8
UBM
Cu
7440-50-8
Interconnect
Sn
7440-31-5
Interconnect
Ag
7440-22-4
Weight
by mg
7016
0.7016
100.0000
5964
45
404
692
13839
22
195
335
15075
302223
12659
1582
606025
0.5964
0.0045
0.0404
0.0692
1.3839
0.0022
0.0195
0.0335
1.5075
30.2223
1.2659
0.1582
60.6025
100.0000
33924
% Total:
3.3924
100.0000
Interconnect
Cu
7440-50-8
Circuit
Si
7440-21-3
Top Surface
Laminate
Mark Surface
Trade Secret
Trade
Secret
0.2223
Package Weight (mg):
% weight of
substance
per package
100.0000
Die
Solder Ball
PPM
0.0496
0.0391
0.0003
0.0026
0.0045
0.0907
0.0001
0.0013
0.0022
0.0988
1.9807
0.0830
0.0104
3.9717
Under Bump
Metallization
% weight of
substance per
Homogenous
material
6.5573
3.9334
35.4008
60.6658
100.0000
0.1390
1.2509
2.1437
96.4664
95.5000
4.0000
0.5000
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-97487 Rev. *B
Page 2 of 4
34L – WLCSP
(2.495X2.44X0.55 MM)
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Others
Material
Cover tape
Carrier tape
Plastic Reel
Shielding bag
Lead
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 2.0
< 2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
< 2.0
PBB
PPM
PBDE
PPM
Analysis
Report
(Note2)
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
<5.0
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-SBAG-R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-97487 Rev. *B
Page 3 of 4
34L – WLCSP
(2.495X2.44X0.55 MM)
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
ECN No.
**
*A
4757267
5285407
34L WLCSP (2.495X2.44X0.55 MM) - PB-FREE PACKAGE MATERIAL
DECLARATION DATASHEET
001-97487
Orig. of
Change
JSO
HLR
MEL
*B
5288603
YUM
Description of Change
New Release
Changed Cypress Logo.
Changed the substances with “------------- “ to “Trade
Secret".
Removed distribution and posting from the document
history page.
Change the body size from 3.23x2.10x0.55 mm to
2.495x2.44x0.55 mm.
Change the “Proprietary” to “Trade Secret” in B under
column Substance Composition.
Added value on section II for the “PBB and PBDE”
column from “-“ to “<5.0”.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product” or a natural
impurity. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor
PMDD’s are calculated using MSDS, Material Analysis Reports and Cypress Assembly site information.
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data.
Document No. 001-97487 Rev. *B
Page 4 of 4
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