64L-TQFP 10 x 10 mm Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 AY 338.9487 mg Body Size (mil/mm) Package Weight – Site 2 10 x 10 mm N/A SUMMARY The 64L- TQFP Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report # 034101 (See Note 1) I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-AY64ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04268 Rev.*I Page 1 of 5 64L-TQFP 10 x 10 mm Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Material Leadframe Purpose of Use Base Material Lead Finish External Plating Die Attach Adhesive Die Wire Mold Compound Circuit Interconnect Encapsulation Substance Composition CAS Number Weight by mg % Weight of Substance per Homogeneous Material % Weight of Substance per Package PPM Cu 7440-50-8 85.2223 91.4500% 251,431 25.1431% Ni 7440-02-0 2.6373 2.8300% 7,781 0.7781% Si 7440-21-3 0.5778 0.6200% 1,705 0.1705% Mg Ag Sn Ag Epoxy Resin Copper GammaButyrolactone Aromatichydrocarbons Si Au Epoxy Resin Phenol Resin SiO2 Aromatic Phosphate Others 7439-95-4 7440-22-4 7440-31-5 7440-22-4 Trade Secret 7440-50-8 96-48-0 0.1398 4.6129 13.8300 1.7600 0.4700 0.0299 0.0299 0.1500% 4.9500% 100.0000% 75.8600% 20.2600% 1.2900% 1.2900% 412 13,609 40,803 5,192 1,387 88 88 0.0412% 1.3609% 4.0803% 0.5192% 0.1387% 0.0088% 0.0088% Trade Secret 0.0299 1.2900% 88 0.0088% 7440-21-3 7440-57-5 85954-11-6 26834-02-6 60676-86-0 139189-30-3 15.4200 2.8100 10.5700 8.4349 187.0890 3.1921 100.0000% 100.0000% 5.0000% 3.9900% 88.5000% 1.5100% 45,494 8,290 31,185 24,885 551,969 9,418 4.5494% 0.8290% 3.1185% 2.4885% 55.1969% 0.9418% Trade Secret 2.0929 0.9900% 6,175 0.6175% % Total: 100.0000 Package Weight (mg): 338.9487 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04268 Rev.*I Page 2 of 5 64L-TQFP 10 x 10 mm Pb-Free Package II. DECLARATION OF PACKAGING INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Dessicant Bubble Pack Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 PBB PPM <5.0 <5.0 <5.0 --------<5.0 PBDE PPM <5.0 <5.0 <5.0 --------<5.0 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-MBBG-R < 2.0 < 2.0 < 2.0 < 2.0 <5.0 <5.0 CoA-PROB-R < 10.0 < 4.0 < 4.0 < 5.0 --------- ----------- CoA-ABOX-R < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 1.0 < 2.0 < 3.0 < 100.0 < 3.0 < 90.0 CoA-DESS-R CoA-BUBP-R CoA-TRAY-R CoA-SBAG –R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04268 Rev.*I Page 3 of 5 64L-TQFP 10 x 10 mm Pb-Free Package Document History Page Document Title: Document Number: Rev. 64L-TQFP 10X10mm PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 001-04268 ** *A ECN No. Orig. of Change 390185 GFJ 391439 GFJ *B 2247109 MAHA *C *D *E Dcon 2677622 HLR 2681087 HLR 3591884 HLR *F 4031297 YUM *G *H *I 4364735 HLR 4756622 HLR 5268684 HLR Description of Change New document Changed the material composition (updating the die attach adhesive used) and added CoA references for indirect materials used. 1. Updated Cypress logo. 2. Added “% weight of substance per Homogeneous Material” and “% Weight of Substance per Package” on the Material Composition table. 3. Completed the RoHS Substances namely: Lead, Cadmium, Mercury, Chromium VI, PBB and PBDE on Declaration of Packaging Indirect Materials table. 4. Added Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Replaced CML with WEB in distribution list. Added CAS Number of Silver (Ag). Corrected the package code of TQFP 64 (AZ to AY) Updated Assembly Site 1 to reflect 4 decimal places on values of material composition table. Removed the Tube details on Indirect materials table Added Assembly site name in the Assembly heading. Changed Assembly Code to Assembly Site Name. Changed the total package weight from 338.9490 to 338.9487 Sunset Due – No Change. Changed the substances with “------------- “ and Proprietary to “Trade Secret. Changed Cypress Logo.’ Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04268 Rev.*I Page 4 of 5 64L-TQFP 10 x 10 mm Pb-Free Package Rev. ECN No. Orig. of Change DCON Description of Change Removed Distribution and posting information from Document history page. Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS and Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-04268 Rev.*I Page 5 of 5