56-BGA 5X5MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET.pdf

56 – BGA ( 5 x 5 mm )
Pb-Free Package
PACKAGE MATERIAL DECLARATION DATASHEET
Cypress Package Code
Package Weight – Site 1
Package Weight – Site 3
BZ
B1: 52.9920 mg
B2: 51.9780 mg
B1: 42.9499 mg
B2: 41.7903 mg
Body Size (mil/mm)
Package Weight – Site 2
5.0 x 5.0 mm
64.8099 mg
SUMMARY
The 56- BGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X”
(e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement.
ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET)
Package Qualification Report #s 050202, 120301, 120612 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU
RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this
product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
PPM
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis
Report
(Note 2)
CoA-BZ56ASET
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 1 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Silica Oxide
60676-86-0
1.2704
% weight of
substance
per
Homogenou
s
material
10.9900
Acrylic
29690-82-2
1.1595
10.0300
21,880
2.1880
Epoxy
68541-56-0
0.9294
8.0400
17,539
1.7539
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Ag
Cu
Silica Fused
Diester
Epoxy Resin
Functionalized
Esters
Polymeric Resin
Si
Au
Silica Fused
Epoxy Resin
Phenolic Resin
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7726-95-6
7440-31-5
7440-22-4
7440-50-8
60676860
Trade Secret
Trade Secret
Trade Secret
1.7305
2.0195
4.2102
0.1699
0.0601
0.0104
5.6100
0.2301
0.0299
4.1804
2.1296
0.4197
0.7699
14.9700
17.4700
36.4200
1.4700
0.5200
0.0900
95.5700
3.9200
0.5100
54.0800
27.5500
5.4300
9.9600
32,656
38,110
79,449
3,207
1,134
196
105,864
4,342
565
78,887
40,187
7,921
14,529
3.2656
3.8110
7.9449
0.3207
0.1134
0.0196
10.5864
0.4342
0.0565
7.8887
4.0187
0.7921
1.4529
Trade Secret
7440-21-3
7440-57-5
60676860
Trade Secret
Trade Secret
0.2304
4.7200
1.9000
18.8705
1.1708
1.1708
2.9800
100.0000
100.0000
88.9700
5.5200
5.5200
4,347
89,070
35,854
356,101
22,094
22,094
0.4347
8.9070
3.5854
35.6101
2.2094
2.2094
Purpose of
Use
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Package Weight (mg):
Weight
by mg
52.9920
PPM
% weight of
substance
per
package
23,974
2.3974
% Total:
100.0000
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 2 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper-Palladium wire material
Material
1.2704
% weight of
substance per
Homogenous
material
10.9900%
24,441
% weight of
substance
per
package
2.4441%
29690-82-2
1.1595
10.0300%
22,308
2.2308%
Epoxy
68541-56-0
0.9294
8.0400%
17,881
1.7881%
Bisphenol
Triazol
Cu
Ni
Au
Br
Sn
Ag
Cu
Silica Fused
Bismaleimide
monomer
Epoxy Resin
Acrylate monomer
Acrylic Resin
Si
Cu
Pd
Silica Fused
Epoxy Resin
Carbon black
Phenolic Resin
13676-54-5
25722-66-1
7440-50-8
7440-02-0
7440-57-5
7726-95-6
7440-31-5
7440-22-4
7440-50-8
60676860
1.7305
2.0195
4.2102
0.1699
0.0601
0.0104
5.6100
0.2301
0.0299
4.1804
14.9700%
17.4700%
36.4200%
1.4700%
0.5200%
0.0900%
95.5700%
3.9200%
0.5100%
54.0800%
33,293
38,853
81,000
3,269
1,156
200
107,930
4,427
575
80,426
3.3293%
3.8853%
8.1000%
0.3269%
0.1156%
0.0200%
10.7930%
0.4427%
0.0575%
8.0426%
Trade Secret
2.1296
27.5500%
40,971
4.0971%
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676860
Trade Secret
1333-86-4
Trade Secret
0.4197
0.7699
0.2304
4.7200
0.8643
0.0217
18.8703
0.9209
0.0758
1.3451
5.4300%
9.9600%
2.9800%
100.0000%
97.5543%
2.4457%
88.9600%
4.3414%
0.3572%
6.3414%
8,075
14,812
4,433
90,808
16,628
417
363,044
17,717
1,458
25,878
0.8075%
1.4812%
0.4433%
9.0808%
1.6628%
0.0417%
36.3044%
1.7717%
0.1458%
2.5878%
% Total:
100.0000
Purpose of
Use
Substrate
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
CAS Number
Weight
by mg
Silica Oxide
60676-86-0
Acrylic
Package Weight (mg):
51.9780
PPM
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 3 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 4 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
ASSEMBLY Site 2: PT UNISEM Batam
Package Qualification Report #s 063803 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BZ56-PT
UNISEM
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 5 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
B. MATERIAL COMPOSITION (Note 3)
Material
Substrate
Purpose of
Use
Base Material
Au, metal & alloy
7440-57-5
0.3986
1.7700
6,150
%
weight
of
substan
ce per
package
0.6150
Ni, metal & alloy
7440-02-0
2.0989
9.3200
32,385
3.2385
Cu, metal & alloy
7440-50-8
3.9455
17.5200
60,878
6.0878
Cured Resin
Phthalocyanine Blue
Organic Pigment
Barium Sulfate
Talc
Silica
Aromatic Carbonyl Compound
Amine Compound
Additive (Trade Secret)
Continuous Filament Fiber
Glass
Copper
Inorganic Filler
Trade Secret
174-14-8
4118-16-5
7727-43-7
14807-96-06
1.7385
0.0225
0.0090
0.0090
0.0045
1.0990
0.0225
0.0113
0.0203
1.3197
7.7200
0.1000
0.0400
0.0400
0.0200
4.8800
0.1000
0.0500
0.0900
5.8600
26,825
347
139
139
69
16,957
347
174
313
20,362
2.6825
0.0347
0.0139
0.0139
0.0069
1.6957
0.0347
0.0174
0.0313
2.0362
6.2673
0.4999
27.8300
2.2200
96,703
7,714
9.6703
0.7714
2.5267
11.2200
38,987
3.8987
2.5267
22.1625
0.2250
0.1125
3.8570
0.2755
0.5510
0.2755
0.5510
3.8000
0.9600
9.0440
0.1904
0.0476
0.0952
0.0952
0.0476
11.2200
98.5000
1.0000
0.5000
70.0000
5.0000
10.0000
5.0000
10.0000
100.0000
100.0000
95.0000
2.0000
0.5000
1.0000
1.0000
0.5000
38,987
341,961
3,472
1,736
59,512
4,251
8,502
4,251
8,502
58,633
14,813
139,546
2,938
734
1,469
1,469
734
3.8987
34.1961
0.3472
0.1736
5.9512
0.4251
0.8502
0.4251
0.8502
5.8633
1.4813
13.9546
0.2938
0.0734
0.1469
0.1469
0.0734
Substance Composition
Bismaleimide / Triazine
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Epoxy Resin
Sn
Ag
Cu
Ag
Epoxy Resin
Diester
Polymeric Resin
Functionalized Ester
Si
Au
Fused Silica
Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
CAS Number
Trade Secret
Trade Secret
Trade Secret
Trade Secret
65997-17-3
7440-50-8
24623-77-6 /
21645-51-2 /
61583-60-6 /
60676-86-0
105391-33-1 /
25722-66-1
9003-36-5
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
Package Weight (mg):
Weight
by mg
% weight of
substance per
Homogenous
material
64.8099
PPM
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 6 of 12
100.000
56 – BGA ( 5 x 5 mm )
Pb-Free Package
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape & Reel
Tray
Others
Material
Lead
PPM
Cover tape
Carrier tape
Plastic Reel
Tray
Shielding bag
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-SBAG –R
CoA-SBAG –M
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 7 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
ASSEMBLY Site 3: Cypress Manufacturing Limited (CML)
Package Qualification Report # 042801, 120610 (Note 1)
I. DECLARATION OF PACKAGED UNITS
A. BANNED SUBSTANCES
Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS.
Listed in the table below are materials that are neither contained nor intentionally added to this product.
Substances / Compounds
Cadmium and Cadmium Compounds
Hexavalent Chromium and its Compounds
Lead and Lead Compounds
Mercury and Mercury Compounds
Polybrominated Biphenyls (PBB)
Polybrominated Diphenylethers (PBDE)
Asbestos
Azo colorants
Ozone Depleting Substances
Polychlorinated Biphenyls (PCBs)
Polychlorinated Napthalenes
Radioactive Substances
Shortchain Chlorinated Paraffins
Tributyl Tin (TBT) and Triphenyl Tin (TPT)
Tributyl Tin Oxide (TBTO)
Formaldehyde
Weight by
mg
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PPM
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
< 5.0
0
0
0
0
0
0
0
0
0
0
Analysis Report
(Note 2)
CoA-BZ56-CML
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
As per MSDS
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 8 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
B1. MATERIAL COMPOSITION (Note 3)
Using Gold wire material
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External Plating
Die Attach
Adhesive
Die
Wire
Circuit
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cured Resin
Glass Fabrics
Copper Foil
Diethylene Glycol
Monoethyl
Acetate
Acetophenone
Crystalline
Silica Crystalline
Solvent Naptha
Sn
Ag
Cu
Silver
Bismaleimide
Resin
Synthetic Resin
Additive
Silicon
Gold
Silica
Epoxy resin
Phenol Resin
Carbon Black
Pigment
CAS Number
Trade Secret
Trade Secret
7440-50-8
3.2060
2.5190
3.4350
% weight of
substance per
Homogenous
material
28.0000
22.0000
30.0000
0.5725
Weight
by mg
PPM
% weight of
substance per
package
74,646
58,650
79,977
7.4646
5.8650
7.9977
5.0000
13,329
1.3329
0.5725
0.5725
0.5725
0.2808
0.0029
0.0014
0.3210
5.0000
5.0000
5.0000
98.5000
1.0000
0.5000
75.0000
13,329
13,329
13,329
6,538
68
33
7,474
1.3329
1.3329
1.3329
0.6538
0.0068
0.0033
0.7474
0.0749
0.0214
0.0107
21.4000
2.1728
6.3483
0.4689
0.3607
17.5000
5.0000
2.5000
100.0000
100.0000
88.0000
6.5000
5.0000
1,744
498
249
498,255
50,589
147,807
10,917
8,398
0.1744
0.0498
0.0249
49.8255
5.0589
14.7807
1.0917
0.8398
0.0361
0.5000
841
0.0841
Trade Secret
Trade Secret
14808-60-7
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-57-5
60676-86-0
93705-66-9
106466-55-1
1333-86-4
Package Weight (mg):
42.9499
% Total:
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 9 of 12
100.0000
56 – BGA ( 5 x 5 mm )
Pb-Free Package
B2. MATERIAL COMPOSITION (Note 3)
Using Copper-Palladium wire material
Material
Substrate
Purpose of
Use
Base Material
Solder Ball
External
Plating
Die Attach
Adhesive
Die
Circuit
Wire
Interconnect
Mold
Compound
Encapsulation
Substance
Composition
Cured Resin
Glass Fabrics
Copper Foil
Diethylene Glycol
Monoethyl Acetate
Acetophenone
Crystalline
Silica Crystalline
Solvent Naptha
Sn
Ag
Cu
Silver
Bismaleimide Resin
Synthetic Resin
Additive
Silicon
Cu
Pd
Silica
Epoxy resin
Phenol Resin
Melamine Cyanurate
Carbon Black Pigment
Trade Secret
Trade Secret
7440-50-8
3.2060
2.5190
3.4350
% weight of
substance per
Homogenous
material
28.0000%
22.0000%
30.0000%
Trade Secret
0.5725
Trade Secret
14808-60-7
Trade Secret
7440-31-5
7440-22-4
7440-50-8
7440-22-4
Trade Secret
Trade Secret
Trade Secret
7440-21-3
7440-50-8
7440-05-3
60676-86-0
Trade Secret
Trade Secret
Trade Secret
1333-86-4
CAS Number
Weight
by mg
Package Weight (mg):
% weight of
substance per
package
PPM
76,716
60,277
82,196
7.6716%
6.0277%
8.2196%
5.0000%
13,699
1.3699%
0.5725
5.0000%
13,699
1.3699%
0.5725
0.5725
0.2808
0.0029
0.0014
0.3210
0.0749
0.0214
0.0107
21.4000
1.0030
0.0102
6.2040
0.4689
0.2164
0.2886
0.0361
5.0000%
5.0000%
98.5000%
1.0000%
0.5000%
75.0000%
17.5000%
5.0000%
2.5000%
100.0000%
98.9948%
1.0052%
86.0000%
6.5000%
3.0000%
4.0000%
0.5000%
13,699
13,699
6,719
69
34
7,681
1,792
512
256
512,081
24,001
244
148,456
11,222
5,179
6,906
863
1.3699%
1.3699%
0.6719%
0.0069%
0.0034%
0.7681%
0.1792%
0.0512%
0.0256%
51.2081%
2.4001%
0.0244%
14.8456%
1.1222%
0.5179%
0.6906%
0.0863%
41.7903
% Total:
100.0000
II. DECLARATION OF PACKAGING / INDIRECT MATERIALS
Type
Tape &
Reel
Tray
Others
Material
Cover tape
Carrier tape
Plastic Reel
Tray
Moisture
Barrier Bag
Lead
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cadmiu
m
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
Cr VI
PPM
Mercury
PPM
< 2.0
< 2.0
< 5.0
< 2.0
<2.0
< 2.0
< 2.0
< 10.0
< 2.0
<2.0
PBB
PPM
PBDE
PPM
< 50.00
< 50.00
<50.0
< 0.0005
<5.0
< 45.00
< 45.00
<45.0
< 0.0005
<5.0
Analysis Report
(Note2)
CoA-COVT-R
CoA-CART-R
CoA-PLRL-R
CoA-TRAY-R
CoA-MBBG –R
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 10 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
Document History Page
Document Title:
Document Number:
Rev.
56-BGA 5X5MM PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
001-04908
**
*A
ECN No. Orig. of
Change
398232
GFJ
472024
MRB
*B
680400
*C
2617585 MAHA
*D
DCON
2833303 MAHA
*E
3375131 HLR
*F
3607118 UDR
*G
3884168 HLR
VFR
Description of Change
New document
Changed Package Qualification Report # 033105 to 050202 in
reference to spec # 49-10001 Rev. AO
Changed Cypress Logo.
Added PMDD for site 2 (AIT) with SnAgCu ball finish
Changed/added the following for assembly site 1:
Changed CAS number of Au.
Added CAS number of Br.
Changed CAS number of Ag.
Changed Polymetric to Polymeric.
Revised PPM format.
Added % weight of substance per homogeneous material.
Updated and added Lead, Cr+VI, PBB and PBDE on the
Declaration of Packaging/Indirect Materials table.
Replaced CML (obsolete bookset) with WEB in distribution
Deleted the % signs from the CAS numbers of Barium Sulfate,
Talc, Copper, and Fused Silica on the substrate and mold
compound of assembly site 2. Corrected the CAS number of Ag
on the solder ball of assembly site 2.Recalculated the PPM and %
weight of substance per package of assembly site 2.
Added Assembly Site 3 – CML.
Removed material name of Substrate for Assembly Site 2.
Updated the material composition table to reflect 4 decimal places
on values.
Changed Assembly Site 3 from R to RA.
Added B2 for Site 1 – ASEKH (G) Copper wire qualification.
Reference QTP # 120301 and 120612.
Added B2 for Site 3 – Autoline (CML-RA) Copper wire
qualification. Reference QTP # 120610.
Added CAS Number of Copper Foil and Silica Crystalline on
Assembly Site 3.
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 11 of 12
56 – BGA ( 5 x 5 mm )
Pb-Free Package
Rev.
*H
ECN No. Orig. of
Change
4032205 YUM
*I
4090119 YUM
*J
5142476 HLR
DCON
Description of Change
Added assembly site name in the Assembly heading in site 1, 2
and 3.
Changed assembly code to assembly site name in site 1, 2 and 3.
Removed entire tube row in the indirect materials section.
Corrected total package weight in Site 1: B1 from “52.9921 mg” to
“52.9920” and assembly site 2 from “64.8100 mg to “64.8099”.
Changed the substances with “------------- “to “Trade Secret.
Removed “Distribution: WEB” and “Posting: None” from history page
Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #.
Note 2: Report available from Cypress Sales Offices or Distributors.
Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report
exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are
calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information
Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data
Document No. 001-04908 Rev. *J
Page 12 of 12