209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package PACKAGE MATERIAL DECLARATION DATASHEET Cypress Package Code Package Weight – Site 1 BW B1: 1,121.2720 mg B2: 1,059.4297 mg Body Size (mil/mm) Package Weight – Site 2 14x22x1.76 mm 1,184.6771 mg SUMMARY The 209-FBGA Pb-Free package is compliant to RoHS. Cypress Ordering Part Numbers containing an “X” (e.g. CY7C1328G-133AXI, CY2308SXC-1HT) meet the Directive 2002/95/EC (RoHS) requirement. ASSEMBLY Site 1: Advanced Semiconductor Engineering Taiwan (ASET) Package Qualification Report #s 123301 I. DECLARATION OF PACKAGED UNITS A. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BW209ASET As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 1 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package B1. MATERIAL COMPOSITION (Note 3) 209 Side By Side Stacked (5) Die FBGA Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Mold Compound Encapsulation Die Attach-1 Die Attach-2 Die Attach-3 Adhesive Adhesive Adhesive Bisphenol Triazol Copper (Cu) Nickel (Ni) Gold (Au) Silica Epoxy resin Phenol resin Carbon Black Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Modified epoxy resin Epoxy resin Daspsone CAS Number 60676-86-0 Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary Proprietary Proprietary 80-08-0 49.8212 45.2920 % Weight of substance per homogenous material 11.0000% 10.0000% 44,433 40,393 % Weight of substanc e per package 4.4433% 4.0393% 36.2336 8.0000% 32,315 3.2315% 67.9380 79.2610 165.0893 6.7938 2.4911 310.4864 19.0376 15.5762 1.0384 15.0000% 17.5000% 36.4500% 1.5000% 0.5500% 89.7000% 5.5000% 4.5000% 0.3000% 60,590 70,688 147,234 6,059 2,222 276,905 16,979 13,892 926 6.0590% 7.0688% 14.7234% 0.6059% 0.2222% 27.6905% 1.6979% 1.3892% 0.0926% 0.6569 65.5000% 586 0.0586% 0.1504 0.0752 15.0000% 7.5000% 134 67 0.0134% 0.0067% 0.0301 3.0000% 27 0.0027% 0.0301 3.0000% 27 0.0027% 0.0301 3.0000% 27 0.0027% 0.0301 3.0000% 27 0.0027% 1.4133 65.5000% 1,260 0.1260% 0.3236 0.1618 15.0000% 7.5000% 289 144 0.0289% 0.0144% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 1.4133 65.5000% 1,260 0.1260% 0.3236 0.1618 15.0000% 7.5000% 289 144 0.0289% 0.0144% Weight by mg PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 2 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package Die Attach-4 Die Attach-5 Gold Wire Die-1 Spacer Die-2 Die-3 Spacer Die-4 Die-5 Solder Ball Adhesive Adhesive Interconne ct Circuit Dummy Spacer Circuit Dummy Spacer Circuit External Plating Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Au Ion Impurities Silicon 67762-90-7 Proprietary Proprietary Proprietary Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary 7440-57-5 Trade Secret 7440-21-3 Silicon Silicon 7440-21-3 7440-21-3 Silicon Silicon Tin (Sn) Silver (Ag) Copper (Cu) 7440-21-3 7440-21-3 7440-31-5 7440-22-4 7440-50-8 Package Weight (mg): 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 1.1047 65.5000% 985 0.0985% 0.2530 0.1265 15.0000% 7.5000% 226 113 0.0226% 0.0113% 0.0506 3.0000% 45 0.0045% 0.0506 3.0000% 45 0.0045% 0.0506 3.0000% 45 0.0045% 0.0506 3.0000% 45 0.0045% 1.4133 65.5000% 1,260 0.1260% 0.3236 0.1618 15.0000% 7.5000% 289 144 0.0289% 0.0144% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 3.0000% 58 0.0058% 0.0647 18.0414 0.0018 9.4975 3.0000% 99.9900% 0.0100% 100.0000% 58 16,090 2 8,470 0.0058% 1.6090% 0.0002% 0.8470% 19.2811 100.0000% 17,196 1.7196% 21.2700 100.0000% 18,970 1.8970% 15.2896 100.0000% 13,636 1.3636% 21.2700 199.0220 8.3360 1.0420 100.0000% 95.5000% 4.0000% 0.5000% 18,970 177,497 7,434 929 1.8970% 17.7497% 0.7434% 0.0929% Total: 100.0000 1121.2720 Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 3 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package B2. MATERIAL COMPOSITION (Note 3) 209 Side By Side Stacked (2) Die FBGA Material Purpose of Use Substance Composition SiO2 Acrylic Epoxy Substrate Base Material Mold Compound Encapsulation Die Attach-1 Die Attach-2 Adhesive Adhesive Gold Wire Interconnect Die-1 Circuit Bisphenol Triazol Copper (Cu) Nickel (Ni) Gold (Au) Silica Epoxy resin Phenol resin Carbon Black Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Modified epoxy resin Epoxy resin Daspsone Treated fumed silica Substituted silane Elastomeric polymer Epoxy resin Au Ion Impurities Silicon 60676-86-0 Trade Secret 29690-82-2, 68541-56-0, 25068-38-6 49.8212 45.2920 % Weight of substance per homogenous material 11.0000% 10.0000% 36.2336 8.0000% 34,201 3.4201% 13676-54-5 25722-66-1 7440-50-8 7440-02-0 7440-57-5 60676-86-0 Trade Secret Trade Secret 1333-86-4 67.9380 79.2610 165.0893 6.7938 2.4911 310.4864 19.0376 15.5762 1.0384 15.0000% 17.5000% 36.4500% 1.5000% 0.5500% 89.7000% 5.5000% 4.5000% 0.3000% 64,127 74,815 155,828 6,413 2,351 293,069 17,970 14,702 980 6.4127% 7.4815% 15.5828% 0.6413% 0.2351% 29.3069% 1.7970% 1.4702% 0.0980% 0.6569 65.5000% 620 0.0620% 0.1504 0.0752 15.0000% 7.5000% 142 71 0.0142% 0.0071% 0.0301 3.0000% 28 0.0028% 0.0301 3.0000% 28 0.0028% 0.0301 3.0000% 28 0.0028% 0.0301 3.0000% 28 0.0028% 1.4133 65.5000% 1,334 0.1334% 0.3236 0.1618 15.0000% 7.5000% 305 153 0.0305% 0.0153% 0.0647 3.0000% 61 0.0061% 0.0647 3.0000% 61 0.0061% 0.0647 3.0000% 61 0.0061% 0.0647 18.0414 0.0018 9.4975 3.0000% 99.9900% 0.0100% 100.0000% 61 17,029 2 8,965 0.0061% 1.7029% 0.0002% 0.8965% CAS Number Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary Proprietary Proprietary 80-08-0 67762-90-7 Proprietary Proprietary Proprietary 7440-57-5 Trade Secret 7440-21-3 Weight by mg 47,026 42,751 % Weight of substance per package 4.7026% 4.2751% PPM Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 4 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package Die-2 Circuit Solder Ball External Plating Silicon Tin (Sn) Silver (Ag) Copper (Cu) 21.2700 199.0220 8.3360 1.0420 7440-21-3 7440-31-5 7440-22-4 7440-50-8 Package Weight (mg): 100.0000% 95.5000% 4.0000% 0.5000% 20,077 187,858 7,868 984 2.0077% 18.7858% 0.7868% 0.0984% Total: 100.0000% 1059.4297 II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 Cadmium PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Cr VI PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 --------- <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 ----------- Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 5 of 9 Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package ASSEMBLY Site 2: Amkor Technology Gwangjiu Korea (K4) Package Qualification Report #s 102505 I. DECLARATION OF PACKAGED UNITS II. BANNED SUBSTANCES Materials from Level A of the EIA/JIG/JGPSSI/EICTA Material Composition Declaration Guide and EU RoHS. Listed in the table below are materials that are neither contained nor intentionally added to this product. Substances / Compounds Cadmium and Cadmium Compounds Hexavalent Chromium and its Compounds Lead and Lead Compounds Mercury and Mercury Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) Asbestos Azo colorants Ozone Depleting Substances Polychlorinated Biphenyls (PCBs) Polychlorinated Napthalenes Radioactive Substances Shortchain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Formaldehyde Weight by mg PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 < 5.0 0 0 0 0 0 0 0 0 0 0 Analysis Report (Note 2) CoA-BW209Amkor Gwangjiu (K4) As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS As per MSDS Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 6 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package B. MATERIAL COMPOSITION (Note 3) Purpose of Use Substance Composition 60676-86-0 Proprietary 416.3040 18.8160 Encapsulatio n Silica, vitreous Material-Other Epoxy resins Material-Other Phenolic resins Carbon black Metal Hydroxide Crystalline Silica % weight of substance per Homogeno us material 88.5000% 4.0000% Proprietary 14.1120 3.0000% 11,912 1.1912% 1333-86-4 Proprietary 14808-60-7 2.3520 14.1120 4.7040 0.5000% 3.0000% 1.0000% 1,985 11,912 3,971 0.1985% 1.1912% 0.3971% Organic resin 105391-33-1 1156-51-0 9003-36-5 73.2875 27.5000% 61,863 6.1863% Inorganic filler Glass fiber 21645-51-2 65997-17-3 73.2875 119.9250 27.5000% 45.0000% 61,863 101,230 6.1863% 10.1230% Copper Arsenic 7440-50-8 7440-38-2 144.0424 0.0576 99.9600% 0.0400% 121,588 49 12.1588% 0.0049% Organic resin Proprietary 12.3500 65.0000% 10,425 1.0425% Inorganic filler Proprietary 6.6500 35.0000% 5,613 0.5613% Nickel Plating Nickel 7440-02-0 10.4000 100.0000% 8,779 0.8779% Gold Plating Gold 7440-57-5 1.1000 100.0000% 929 0.0929% DIE1 Circuit Silicon 7440-21-3 18.7327 100.0000% 15,812 1.5812% DIE2 Circuit Silicon 7440-21-3 8.1325 100.0000% 6,865 0.6865% Novolac Epoxy resin Phenol resin Amorphous Silica Acrylic Copolymer Novolac Epoxy resin Phenol resin Amorphous Silica Acrylic Copolymer Au Pd Proprietary 0.1531 13.0000% 129 0.0129% Proprietary 68611-44-9 Proprietary 0.1531 0.0471 0.8246 13.0000% 4.0000% 70.0000% 129 40 696 0.0129% 0.0040% 0.0696% Proprietary 0.0694 13.0000% 59 0.0059% Proprietary 68611-44-9 Proprietary 0.0694 0.0214 0.3738 13.0000% 4.0000% 70.0000% 59 18 316 0.0059% 0.0018% 0.0316% 7440-57-5 7440-05-3 35.8380 0.3620 99.0000% 1.0000% 30,251 306 3.0251% 0.0306% Sn Ag Cu 7440-31-5 7440-22-4 7440-50-8 199.0220 8.3360 1.0420 95.5000% 4.0000% 0.5000% 167,997 7,037 880 16.7997% 0.7037% 0.0880% % Total: 100.0000 Material Mold Compound Core Substrate Copper foil Solder mask Die Attach-1 Adhesive Die Attach-2 Adhesive Gold Wire Interconnect Solder Ball External Plating CAS Number Package Weight (mg): Weight by mg 1,184.6771 % weight of substance per package PPM 351,407 15,883 35.1407% 1.5883% Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 7 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package II. DECLARATION OF PACKAGING / INDIRECT MATERIALS Type Tape & Reel Tray Others Material Cover tape Carrier tape Plastic Reel Tray Shielding bag Moisture Barrier bag Protective Band Shipping and Inner Box Lead PPM Cadmium PPM Cr VI PPM Mercury PPM < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 10.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 4.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 2.0 < 5.0 PBB PPM PBDE PPM <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 --------- <5.0 <5.0 <5.0 --------<5.0 <5.0 <5.0 ----------- Analysis Report (Note2) CoA-COVT-R CoA-CART-R CoA-PLRL-R CoA-TRAY-R CoA-SBAG –R CoA-MBBG-R CoA-PROB-R CoA-ABOX-R Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 8 of 9 209 Side by Side – FBGA (14 x 22 x 1.76 mm) Pb-Free Package Document History Page Document Title: 209 SIDE BY SIDE - FBGA (14 X 22 X 1.76 MM) PB-FREE PACKAGE MATERIAL DATASHEET Document Number: 001-84444 Rev. ** *A ECN No. Orig. of Change 3799021 CMG 4014206 CMG *B *C *D 4066975 YUM 4211948 CMG 5161356 CMG Description of Change New Release Changed document title from “209 Side by Side Stacked Die – FBGA (14x22x1.76mm) Pb-Free Package” to “209 Side by Side – FBGA (14x22x1.76mm) Pb-Free Package”. Splitted Package Weight – Site 1 into 2, B1 for 209 Side by Side Stacked Die FBGA and B2 for 209 Side by Side Non-Stacked Die FBGA. Added Material Composition for B2: 209 Side by Side NonStacked Die FBGA Added full name for Assembly site. Changed Assembly code to assembly site name. Added Assembly Site 2 – Amkor Technology Korea Removed “Distribution: WEB” and “Posting: None” Note 1: Qualification reports are available at www.cypress.com. Access them by doing a Search on the Report #. Note 2: Report available from Cypress Sales Offices or Distributors. Note 3: Materials/substances not declared in Section I-A and I-B of this document are considered “non-existent in the product”. In order to report exactly 100% material composition, some numbers were rounded to the nearest 0.01 percent. Cypress Semiconductor material information are calculated using MSDS, Material Analysis Reports and Cypress Assembly sites information Note 4: Actual testing performed on package family basis. Engineering calculations were applied to derive individual package data. Document No. 001-84444 Rev. *D Page 9 of 9