073905:172-BALL FBGA (STACKED DIE) (15 X 15MM) SNAGCU, MSL3, 260C REFLOW ASE-TAIWAN (G)

Document No.001-62081 Rev. *A
ECN # 4040635
Cypress Semiconductor
Package Qualification Report
QTP# 073905
June 2013
172-Ball FBGA (Stacked Die)
(15 x 15mm)
SnAgCu, MSL3, 260C Reflow
ASE-Taiwan (G)
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Mira Ben-Tzur
Reliability Director
(408) 943-2675
Rene Rodgers
Reliability Engineer, MTS
(408) 943–2732
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 7
Document No.001-62081 Rev. *A
ECN # 4040635
PACKAGE QUALIFICATION HISTORY
Qual
Report
073905
Description of Qualification Purpose
172-Ball FBGA (Stacked Die) (15 x 15mm), SnAgCu, MSL3, 260C Reflow assembled at ASETaiwan (G)
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 7
Date
Comp
Jun 10
Document No.001-62081 Rev. *A
ECN # 4040635
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
BB172
Package Outline, Type, or Name:
172-Ball FBGA Stacked Die
Mold Compound Name/Manufacturer:
KE-G-2270/Kyocera
Mold Compound Flammability Rating:
UL-94
Mold Compound Alpha Emission Rate :
N/A
Oxygen Rating Index:
N/A
Substrate Material:
ASEM
Lead Finish, Composition / Thickness:
SnAgCu
Die Backside Preparation Method/Metallization:
Backgrinding
Die Separation Method:
Saw
Die Attach Supplier:
Die Attach Method:
Ablestik/QMI
Die Attach 1: Ablestik 2025D
Die Attach 2: QMI536
Epoxy
Bond Diagram Designation:
001-16784
Wire Bond Method:
Thermosonic
Wire Material/Size:
1.0 mil
Thermal Resistance Theta JA °C/W:
N/A
Package Cross Section Yes/No:
Yes
Assembly Process Flow:
49-41999
Name/Location of Assembly (prime) facility:
ASE-Taiwan (G)
MSL Level
3
Reflow Profile
260C
Die Attach Material:
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
CML-R, KYEC-Taiwan, G-Taiwan
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 7
Document No.001-62081 Rev. *A
ECN # 4040635
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy
J-STD-020
P
Ball Shear
JESD22-B116A, Cpk : 1.33, Ppk : 1.66
P
Final Visual
JESD22-B101B
P
Internal Visual
MIL-STD-883-2014
P
High Accelerated Saturation Test
(HAST)
Pressure Cooker
130C, 85%RH, 3.6V
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C
P
130C, 85%RH, 3.63V
Precondition: JESD22 Moisture Sensitivity MSL5
72 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C
121°C, 100%RH
Precondition: JESD22 Moisture Sensitivity MSL3
P
192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C
Solderability
JESD22-B116A
P
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65C to 150C
Precondition: JESD22 Moisture Sensitivity MSL3
192 Hrs., 30C/60%RH+3IR-Reflow, 260C+0, -5C
P
Company Confidential
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Page 4 of 7
Document No.001-62081 Rev. *A
ECN # 4040635
Reliability Test Data
QTP #: 073905
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: ACOUSTIC, MSL3
CY7C0853AV (7C08533BC)
4625447
610722410
TAIWAN-G
COMP
15
0
CY7C0853AV (7C08533BC)
4627264
610724033
TAIWAN-G
COMP
15
0
CY7C0853AV (7C08533BC)
4629088
610724229
TAIWAN-G
COMP
15
0
CY7C0853AV (7C08533AC)
4616921
610816418
TAIWAN-G
COMP
140
0
CY7C0853AV (7C08533AC)
4616921
610816416
TAIWAN-G
COMP
155
0
STRESS: FINAL VISUAL
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.6V), PRE COND 192 HR 30C/60%RH, MSL3
CY7C1474V33 (7C1474AC)
4423980
610466039
TAIWAN-G
128
48
0
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 3.63V), PRE COND HR 30C/60%RH, MSL5
CY62177DV30L (7C62172DC)
4504324
610518429
TAIWAN-G
CY7C0853AV (7C08533AC)
4616921
610816418
TAIWAN-G
CY7C0853AV (7C08533AC)
4616921
610816416
TAIWAN-G
128
45
0
COMP
5
0
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST, 121C, 100%RH, PRE COND 192 HR 30C/60%RH, MSL3
CY7C0853AV (7C08533BC)
4625447
610722410
TAIWAN-G
168
80
0
STRESS: SOLDER BALL SHEAR
CY7C0853AV (7C08533AC)
4616921
610816418
TAIWAN-G
COMP
5
0
CY7C0853AV (7C08533AC)
4616921
610816416
TAIWAN-G
COMP
5
0
CY7C0853AV (7C08533BC)
4625447
610722410
TAIWAN-G
COMP
3
0
CY7C0853AV (7C08533BC)
4627264
610724033
TAIWAN-G
COMP
3
0
STRESS: SOLDERABILITY
STRESS: TC COND. C -65C TO 150C, PRE COND192 HRS 30C/60%RH, MSL3
CY7C0853AV (7C08533BC)
4625447
610722410
TAIWAN-G
500
80
0
CY7C0853AV (7C08533BC)
4625447
610722410
TAIWAN-G
1000
80
0
CY7C0853AV (7C08533BC)
4627264
610724033
TAIWAN-G
500
79
0
CY7C0853AV (7C08533BC)
4627264
610724033
TAIWAN-G
1000
79
0
CY7C0853AV (7C08533BC)
4629088
610724229
TAIWAN-G
500
80
0
CY7C0853AV (7C08533BC)
4629088
610724229
TAIWAN-G
1000
80
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 7
Document No.001-62081 Rev. *A
ECN # 4040635
Reliability Test Data
QTP #: 073905
Device
Fab Lot #
Assy Lot #
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: CROSS SECTION
CY7C0853AV (7C08533AC)
4616921
610816418
TAIWAN-G
COMP
5
0
CY7C0853AV (7C08533AC)
4616921
610816416
TAIWAN-G
COMP
5
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 7
Document No.001-62081 Rev. *A
ECN # 4040635
History Page
Document Title:
073905: 172-BALL FBGA (STACKED DIE) (15 X 15MM) SNAGCU, MSL3, 260C
REFLOW ASE-TAIWAN (G)
Document Number:
001-62081
Rev. ECN
No.
**
2943601
*A
4040635
Orig. of
Change
HGA
NSR
Description of Change
Initial spec release
Removed VERSION 1.0 in the title page.
Updated Cypress Technical Contact For Qualification Data.
Added KYEC-Taiwan and G-Taiwan in test site.
Removed wetting balance since it was not part of tests requirements
for BGA package.
Corrected HAST data.
Removed reference Cypress Specs and retain the reference industry
standards in Reliability Tests performed table.
Distribution: WEB
Posting:
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 7
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