Document No.001-70750 Rev. *C ECN # 4462875 Cypress Semiconductor Package Qualification Report QTP# 102902 VERSION *C August 2014 18/20/24/28-Lead SOIC (300 mils) NiPdAu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-70750 Rev. *C ECN # 4462875 PACKAGE QUALIFICATION HISTORY QUAL REPORT 054502 102902 DESCRIPTION OF QUALIFICATION PURPOSE 28/32-Lead SOJ, 20/24/28 Lead SOIC and 28-Lead SNC packages with 300 mils body size using Kyocera KE-G3000DA (for non-SRAMs), KE-G6000DA (for SRAMs) Mold Compound, NiPdAu Leadframe, @ 260 Solder Reflow, MSL3, CML-R Qualification of Green (Halogen-Free) KE-G3000 for 24L SOIC 300-mil body sizes and below (w/PMC) at CML Autoline Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 DATE COMP. Dec 05 Oct 10 Document No.001-70750 Rev. *C ECN # 4462875 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SZ24 Package Outline, Type, or Name: 24L- SOIC (300 mils) Mold Compound Name/Manufacturer: Kyocera G3000 Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate : N/A Oxygen Rating Index: 70% Lead Frame Material: A194 Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Material: QMI-509 Die Attach Method: Epoxy Bond Diagram Designation 001-44653 Wire Bond Method: Thermosonic Wire Material/Size: Au, 0.9mil Thermal Resistance Theta JA °C/W: 82.62°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-49354/M Name/Location of Assembly (prime) facility: CML-RA ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML, KYEC Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No.001-70750 Rev. *C ECN # 4462875 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Acoustic Microscopy Test Constructional Analysis Dye Penetration Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C Criteria: Meet external and internal characteristics of Cypress package Test to determine the existence and extent of cracks, Criteria: No Package Crack Result P/F P P P Flammability Follow ASTM D2863-77 and UL Standard 94 P High Temp Storage JESD22-A103: 150C, no bias P Pressure Cooker Temperature Cycle JESD22-A102: 121°C, 100%RH, 15 Psig Precondition: JESD22 Moisture Sensitivity Level 3 192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C MIL-STD-883C, Method 1010, Condition C, -65°C to -+ 150°C Precondition: JESD22 Moisture Sensitivity MSL3 P P 192 Hrs 30°C/60%RH + 3IR-Reflow, 260°C+0, -5°C X-ray MIL-STD-883 – 2012 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P Document No.001-70750 Rev. *C ECN # 4462875 Reliability Test Data QTP #: Device 054502 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C188 (7C188BT) 2206290 610548061 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548062 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548063 CML-R COMP 15 0 2206290 610548061 CML-R COMP 3 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: FLAMMABILITY CY7C188 (7C188BT) STRESS: HIGH TEMP STORAGE, 150C no bias CY7C109 (7C109MC) 4520821 610528421 CML-R 500 45 0 CY7C109 (7C109MC) 4520821 610528421 CML-R 1000 45 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY7C188 (7C188BT) 2206290 610548061 CML-R 168 50 0 STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C188 (7C188BT) 2206290 610548061 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548062 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548063 CML-R 300 50 0 CY7C188 (7C188BT) 2206290 610548061 CML-R COMP 15 0 CY7C188 (7C188BT) 2206290 610548062 CML-R COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 7 Document No.001-70750 Rev. *C ECN # 4462875 Reliability Test Data QTP #: Device 102902 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY7C63823-SXC (7C63821A) 4953300 611012867 CML-R COMP 15 0 CY7C63823-SXC 7C63821A) 4953300 611012867M CML-R COMP 15 0 CY7C63823-SXC (7C63821A) 4953300 611012867M1 CML-R COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: CONSTRUCTIONAL ANALYSIS CY7C63823-SXC (7C63821A) 4953300 611012867 CML-R COMP 5 0 CY7C63823-SXC 7C63821A) 4953300 611012867M CML-R COMP 5 0 CY7C63823-SXC (7C63821A) 4953300 611012867M1 CML-R COMP 5 0 CY7C63823-SXC (7C63821A) 4953300 611012867 CML-R COMP 1000 0 CY7C63823-SXC 7C63821A) 4953300 611012867M CML-R COMP 1000 0 CY7C63823-SXC (7C63821A) 4953300 611012867M1 CML-R COMP 1000 0 STRESS: DYE PENETRANT STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C63823-SXC (7C63821A) 4953300 611012867 CML-R 500 79 0 CY7C63823-SXC (7C63821A) 4953300 611012867 CML-R 1000 79 0 CY7C63823-SXC (7C63821A) 4953300 611012867M CML-R 500 80 0 CY7C63823-SXC (7C63821A) 4953300 611012867M CML-R 1000 80 0 CY7C63823-SXC (7C63821A) 4953300 611012867M1 CML-R 500 80 0 CY7C63823-SXC (7C63821A) 4953300 611012867M1 CML-R 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-70750 Rev. *C ECN # 4462875 Document History Page Document Title: Document Number: Rev. ECN No. ** 3307837 3682038 *A QTP102902: 24L SOIC 300 mils Package, KEG3000, MSL3, 260C REFLOW, CML-RA 001-70750 Orig. of Change NSR NSR *B 4079958 *C 4462875 HSTO HSTO Description of Change Initial spec release Added reference Industry standards in reliability tests performed and removed all the reference Cypress specs. Removed version 1.0 in the QTP 102902 in the title page. Sunset Review Updated test location facility based on current qualified test site. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7