101601:30-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (2.204 X 2.32MM) MSL1, 260C AMKOR-TAIWAN (AU)

Document No.001-63175 Rev. *C
ECN # 4475040
Cypress Semiconductor
Package Qualification Report
QTP# 101601 VERSION *C
August 2014
30-Ball Wafer Level Chip Scale Package
(WLCSP)
(2.204 x 2.32mm)
MSL1, 260C
Amkor-Taiwan (AU)
FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT
[email protected] or via a CYLINK CRM CASE
Prepared By:
Honesto Sintos
Reliability Engineer
Reviewed By:
Rene Rodgers
Reliability Manager
Approved By:
Richard Oshiro
Reliability Director
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 1 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
PACKAGE QUALIFICATION HISTORY
QUAL
REPORT
081902
101601
DESCRIPTION OF QUALIFICATION PURPOSE
Qualify 8C20002CC Quark 30-ball WLCSP (Wafer Level Chip Scale Package) Package
Technology in Amkor Taiwan (T5/T3)
Qualify Amkor Taiwan T5 (AU) for KRYPTON (8F20746A) using WLCSP30 (2.204 x
2.32mm) fabricated at CMI using the S4AD-BUMP process
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 2 of 10
DATE
COMP.
Jun 09
Jul 10
Document No.001-63175 Rev. *C
ECN # 4475040
MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION
Package Designation:
Package Outline, Type, or Name:
FN30B
30-Ball Wafer Level Chip Scale Package (WLCSP)
Die Separation Method:
Saw
Solder Ball/Bump Material:
SnAg
Bond Diagram Designation
001-59000
Bonding Method:
Redistribution Layer (RDL)
Redistribution Material:
Polyimide and Copper
Assembly Process Flow:
001-15621
Name/Location of Assembly (prime) facility:
Amkor-Taiwan (AU)
ELECTRICAL TEST / FINISH DESCRIPTION
Test Location:
KYEC, Amkor Taiwan
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 3 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
Acoustic Microscopy Test
J-STD-020
P
Constructional Analysis
Criteria: Meet external and internal characteristics of Cypress
package
P
Data Retention
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
Electrostatic Discharge
Human Body Model (ESD-HBM)
150C ± 5C No Bias, JESD22-A117 and JESD22-A103
Test to determine the existence and extent of cracks, Criteria: No
Package Crack
500V
JESD22-C101
2,200V
JESD22, Method A114
External Visual
MIL-PRF-38535, MILSTD- 883, METHOD 2009
P
Endurance Test
P
High Temperature Operating Life
Latent Failure Rate
MIL-STD-883, Method 883-1033
JEDEC STD 22-A110: 130°C, 5.25V, 85%RH
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH +3IR-Reflow, 260°C+0, -5°C
Dynamic Operating Condition, Vcc Max=5.5V, 125°C
JESD22-A108
Dynamic Operating Condition, Vcc Max=5.5V, 125 C
JESD22-A108
Internal Visual
MIL-STD-883-2014
P
Lead Integrity
JESD22-B105, MIL STD 883
P
Physical Dimension
MIL-STD-1835, JESD22-B100
P
Dye Penetration
Highly Accelerated Saturation
Test
(HAST)
High Temperature Operating Life
Early Failure Rate
Pressure Cooker
Static Latch-up
Temperature Cycle
Thermal Shock
JESD22-A102: 121°C, 100%RH, 15 Psig
Precondition: JESD22 Moisture Sensitivity Level 3
192 Hrs 30°C/60%RH+3IR-Reflow, 260°C+0, -5°C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs 85°C/85%RH+3IR-Reflow, 260°C+0, -5°C
125C, ± 200Ma, ± 140mA
JESD78B
MIL-STD-883C, Method 1010, Condition B, -55°C to 125°C
Precondition: JESD22 Moisture Sensitivity Level 1
168 Hrs, 85C/85%RH + 3x Reflow, 260°C+0, -5°C
MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and
JESD22-A106B, Condition C, -55 C to 125C
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 4 of 10
P
P
P
P
P
P
P
P
P
P
Document No.001-63175 Rev. *C
ECN # 4475040
Reliability Test Data
QTP #:
Device
081902
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
18
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
COMP
15
0
4801582
4801582-02
AU-TAIWAN
COMP
15
0
4801582
4801582-02
AU-TAIWAN
COMP
5
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
500
77
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
1024
76
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
1048
1
0
Failure Mechanism
STRESS: ACOUSTIC, MSL1
STRESS: ACOUSTIC, MSL3
CY8C20634 (8C20634CC)
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C20634 (8C20634CC)
STRESS: DATA RETENTION
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
COMP
9
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
9
0
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
COMP
8
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
8
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
COMP
15
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
15
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
COMP
15
0
STRESS: EXTERNAL VISUAL
STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 168 HR, 85C/85%RH, MSL1
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
128
77
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
128
77
0
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE- EARLY FAILURE RATE (125C, 5.5V, Vcc Max)
CY8C20334 (8C20334)
4801582
4801582-02
AU-TAIWAN
96
499
0
CY8C20334 (8C20334)
4814901
4814901
AU-TAIWAN
96
500
0
CY8C20334 (8C20334)
4815206
4815206
AU-TAIWAN
96
498
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 5 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
Reliability Test Data
QTP #:
Device
Fab Lot#
Assy Lot #
081902
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: HIGH TEMP DYNAMIC OPERATING LIFE- LATENT FAILURE RATE (125C, 5.5V, Vcc Max)
CY8C20334 (8C20334)
4801582
4801582-02
AU-TAIWAN
168
180
0
CY8C20334 (8C20334)
4801582
4801582-02
AU-TAIWAN
1000
180
0
CY8C20334 (8C20334)
4814901
4814901
AU-TAIWAN
168
178
0
CY8C20334 (8C20334)
4814901
4814901
AU-TAIWAN
1000
176
0
CY8C20334 (8C20334)
4815206
4815206
AU-TAIWAN
168
178
0
CY8C20334 (8C20334)
4815206
4815206
AU-TAIWAN
1000
178
0
4801582
4801582-02
AU-TAIWAN
168
69
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
COMP
5
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
5
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
COMP
5
0
4801582
4801582-02
AU-TAIWAN
COMP
5
0
STRESS: ENDURANCE
CY8C20634 (8C20634CC)
STRESS: INTERNAL VISUAL
STRESS: LEAD INTEGRITY
CY8C20634 (8C20634CC)
STRESS: PHYSICAL DIMENSION
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
COMP
30
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
COMP
30
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
COMP
30
0
STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HRS, 30C/60%RH, MSL3)
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
168
77
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
288
75
0
CY8C20634 (8C20634AC)
4814901
610851331
AU-TAIWAN
168
75
0
AU-TAIWAN
COMP
6
0
STRESS: STATIC LATCH-UP TESTING (125C, 7.88V, ±200mA)
CY8C20634 (8C20634CC)
4801582
4801582-02
STRESS: TC COND. C, -65°C to 150C, PRE COND 192 HRS, 30C/60%RH, MSL3
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
500
77
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
1000
77
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 6 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
Reliability Test Data
QTP #:
Device
Fab Lot#
Assy Lot #
081902
Assy Loc
Duration
Samp
Rej
Failure Mechanism
STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MS1
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
500
78
0
CY8C20634 (8C20634CC)
4814901
610851331
AU-TAIWAN
1000
76
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
500
83
0
CY8C20634 (8C20634CC)
4815206
610851329
AU-TAIWAN
1000
83
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
200
78
0
CY8C20634 (8C20634CC)
4801582
4801582-02
AU-TAIWAN
1000
77
0
STRESS: THERMAL SHOCK
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 7 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
Reliability Test Data
QTP #:
Device
101601
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
COMP
5
0
Failure Mechanism
STRESS: BALL SHEAR
STRESS: CONSTRUCTIONAL ANALYSIS
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
COMP
5
0
AU-TAIWAN
COMP
9
0
AU-TAIWAN
COMP
8
0
STRESS: ESD-CHARGE DEVICE MODEL (500V)
CY8C20766A (8C20766A)
4005399
STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2200V
CY8C20766A (8C20766A)
4005399
STRESS: EXTERNAL VISUAL
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
COMP
461
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
COMP
461
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
COMP
461
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
COMP
461
0
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
COMP
5
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
COMP
5
0
STRESS: INTERNAL VISUAL
STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192 HRS, 30C/60%RH, MSL3)
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
96
75
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
168
73
0
AU-TAIWAN
COMP
6
0
STRESS: STATIC LATCH-UP TESTING (125C, 8.25V, ±140mA)
CY8C20766A (8C20766A)
4005399
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 8 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
Reliability Test Data
QTP #:
Device
101601
Fab Lot#
Assy Lot #
Assy Loc
Duration
Samp
Rej
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
COMP
30
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
COMP
30
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
COMP
30
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
COMP
30
0
Failure Mechanism
STRESS: SEM ANALYSIS
STRESS: TC COND. B –55C TO 125C, PRE COND 168 HRS, 85C/85%RH, MS1
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
500
83
0
CY8C20766A (8F20746A)
4005399
WAFER 3
AU-TAIWAN
1000
77
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
500
82
0
CY8C20766A (8F20746A)
4005399
WAFER 4
AU-TAIWAN
1000
78
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
500
79
0
CY8C20766A (8F20746A)
4005399
WAFER 1
AU-TAIWAN
1000
79
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
500
67
0
CY8C20766A (8F20746A)
4005399
WAFER 2
AU-TAIWAN
1000
66
0
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 9 of 10
Document No.001-63175 Rev. *C
ECN # 4475040
History Page
Document Title:
101601: 30-BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) (2.204 X 2.32MM) MSL1,
260C AMKOR-TAIWAN (AU)
001-63175
Document Number:
Rev. ECN
No.
**
2991725
*A
3704112
*B
Orig. of
Change
HGA
NSR
4092686 HSTO
*C
4475040 HSTO
Distribution: WEB
Posting:
Description of Change
Initial spec release
1)Removed VERSION in the title page- The revision is added next to
the document # at every page 9top right corner).
2)Changed the Contact Reliability Engineer
3)Removed the reference Cypress Specs on the Reliability tests
performed and replaced with reference Industry standards.
Sunset Review
Updated test location facility based on current qualified test site
Align qualification report based on the new template in the front page
None
Company Confidential
A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision.
Page 10 of 10
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