Cypress Semiconductor Qualification Report QTP# 94047/95196/95481/96223 VERSION 1.0 September, 1999 HOTLink Transmitter - Fab2 CY7B923 CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408)432-7069 Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 2 of 7 October, 1997 PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied: Marketing Part #: CYB923 Package: Plastic Lead Chip Carrier/Leadless Chip Carrier Device Description: HOTlink Transmitter Cypress Division: Cypress Semiconductor Corporation - DCD Division Overall Die (or Mask) REV Level (pre-requisite for qualification): Die Size (stepping): 126 mils x 131 mils Rev. A What ID markings on Die: 7B923A TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 2 Metal Composition: Passivation Type and Materials: 3,000A TEOS + 15,000A Oxynitride Free Phosphorus contents in top glass layer(%): Die Coating(s), if used: Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: 3% N/A Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Metal 1: Ti/TiW/Al Metal 2: Ti/Al BiCMOS, Single Poly, Double Metal /0.8 µm SiO2 / 195A° Cypress Semiconductor - Round Rock, TX Fab2/SM13 Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 3 of 7 October, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 28-pins Plastic Lead Chip Carrier (JC) Mold Compound Name/Manufacturer: Sumitomo EME-6000H Lead Frame material: Copper Olin 151 Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die Attach Area Plating: Silver Spot Die Attach Method: Paste Die Attach Material: Ablestik 84-1LMI Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil JESD22-A112 Moisture Sensitivity Level Level 1 Assembly Line ID and Process ID: Anam, Korea HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 28-pin Square Leadless Chip Carrier (LC/LM) Alloy 42 Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Seal Material: Glass Die Attach Method: Paste Die Attach Material: Silver Glass Wire Bond Method: Ultrasonic Wire Material/Size: Aluminum / 1.25 mil Name/Location of Assembly (prime) facility: Cypress Bangkok, Thailand Assembly Line ID and Process ID: ALPHA-X/49-15047 Note: Please contact a Cypress Representative for other packages availability. Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 4 of 7 October, 1997 RELIABILITY TESTS PERFORMED Stress/Test Test Condition (Temp/Bias) Result P/F High Temperature Operating Life Early Failure Rate Dynamic Operating Condition, Vcc = 5.75V, 150°C P High Temperature Operating Life Latent Failure Rate Dynamic Operating Condition, Vcc =5.75V, 150°C P Group C, subgroup 1 Life Test Dynamic Operating Condition, Vcc = 5.75V, 150°C P Read and Record Life Test Dynamic Operating Condition, Vcc = 5.75V, 150°C P High Temperature Steady State Life Static Operating Condition, Vcc = 5.75V, 150°C P High Accelerated Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level 1 P (168 Hrs , 85°C /85%RH) Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 1 P (168 Hrs , 85°C /85%RH) Temperature Cycle - Hermetic Device MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Electrostatic Discharge Human Body Model (ESD-HBM) MIL-STD-883, Method 3015.7 Electrostatic Discharge Charge Device Model (ESD-CDM) Cypress Spec. 25-00020 Latchup Sensitivity In accordance with JEDEC 17. Cypress Spec. 01-00081 P 4,400V (QTP 95481) 2,000V (QTP 95481) P 11V (QTP 95481) Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 5 of 7 October, 1997 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Devive Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 2,081 Devices 0 N/A N/A 0 PPM High Temperature Operating Life1,2 Long Term Failure Rate 119,500 DHRs 1 1.0 170 100 FIT 1 2 3 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 6 of 7 October, 1997 RELIABILITY TEST DATA QTP#: 940471/951962/954813/962234 EVAL # DEVICE ASSY-LOC ASSYLOT# FABLOT# DURATION S/S REJ FAIL MODE ====== ============== ======== ============== ======== ======== === === ================================ STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 5.75V) 94047 94047 CY7B923-LM CY7B923-LM ALPHA-X ALPHA-X 219409342 219409342 2419097 2419097 48 48 99 408 0 0 95196 CY7B923-JC KOREA-A 349504850 2450975 48 1067 0 94047 CY7B923-JC KOREA-A 49404074 2406969 48 507 0 ---------------------------------------------------------------------------------------------------------------STRESS: GROUP C, SUBGROUP 1, LIFE TEST (150C, 5.75V) 94047 CY7B923-LMB ALPHA-X 219407764 2406969 184 50 0 ---------------------------------------------------------------------------------------------------------------STRESS: HI-ACCEL SATURATION TEST (140C, 85%RH, 5.5V), PRECONDITION 24 HRS PCT 95481 CY7B923-JC KOREA-A 349525476/7 2542409 128 50 0 ---------------------------------------------------------------------------------------------------------------STRESS: HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 168 HRS 85C/85%RH 96223 CY7B923-JC KOREA-A 349601976 2549388 128 50 0 96223 CY7B923-JC KOREA-A 349606225 2611204 128 50 0 96223 CY7B923-JC KOREA-A 349607225 2611204 128 42 0 ---------------------------------------------------------------------------------------------------------------STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 5.75V) 94047 CY7B923-LM ALPHA-X 219409342 2419097 168 80 0 94047 CY7B923-JC KOREA-A 49404074 2406969 168 78 0 ---------------------------------------------------------------------------------------------------------------STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V) 94047 94047 CY7B923-LM CY7B923-LM ALPHA-X ALPHA-X 219409342 219409342 2419097 2419097 80 500 120 120 0 0 94047 94047 CY7B923-JC CY7B923-JC KOREA-A KOREA-A 49404074 49404074 2406969 2406969 80 500 120 119 1 1 IONIC CONTAMINATION 0 ---------------------------------------------------------------------------------------------------------------STRESS: PRESSURE COOKER TEST (121C, 100%RH) 94047 CY7B923-JC KOREA-A 49404074 2406969 168 48 0 ---------------------------------------------------------------------------------------------------------------STRESS: READ & RECORD LIFE TEST (150C, 5.75V) 94047 94047 94047 CY7B923-JC CY7B923-JC CY7B923-JC KOREA-A KOREA-A KOREA-A 49404074 49404074 49404074 2406969 2406969 2406969 48 80 500 10 10 10 0 0 0 ---------------------------------------------------------------------------------------------------------------- 1 2 3 4 QTP 94047, CY7B923, SM13 Technology fabricated in FAB 2. QTP 95196, CY7B923, SM13 Technology, FAB 2, Burn-in Elimination. QTP 95481, CY7B923 FAB 2, Single Logic Gate fixed and Layout changed. QTP 96223, CY7B923 FAB 2, Moisture Sensitivity Level upgraded to Level 1. (Dry bake and dry pack elimination). Cypress Semiconductor, Inc. HOTlink Transmitter Device: CY7B923 Package: JC/LM QTP# 94047/95196/95481/96223, V. 1.0 Page 7 of 7 October, 1997 RELIABILITY TEST DATA QTP#: 94047/95196/95481/96223 EVAL # DEVICE ASSY-LOC ASSYLOT# FABLOT# ====== ============== ======== ============== ======== STRESS: TC COND. C, -65 TO 150C, HERMETIC DEVICES 94047 94047 CY7B923-LM CY7B923-LM ALPHA-X ALPHA-X 219409342 219409342 2419097 2419097 DURATION ======== S/S === 100 1000 REJ FAIL MODE === ================================ 50 50 0 0 ---------------------------------------------------------------------------------------------------------------STRESS: TEMP CYCLE, COND. C, -65 TO 150C, PRECONDITION 48 HRS PCT 95481 CY7B923AT-JC KOREA-A 349525476/7 2542409 300 50 0 ---------------------------------------------------------------------------------------------------------------STRESS: TC COND. C, -65 TO 150C, PRECOND. 168 HRS 85C/85%RH 96223 CY7B923-JC KOREA-A 349601845/6/7 2549388 300 78 0 96223 CY7B923-JC KOREA-A 349607225 2611204 300 50 0 96223 CY7B923-JC KOREA-A 349525476/7 2542409 300 50 0 ----------------------------------------------------------------------------------------------------------------