Cypress Semiconductor Qualification Report QTP# 94046/96501 VERSION 1.0 October, 1999 HOTLink Receiver - Fab2 CY7B933 CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408)432-7069 Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 2 of 7 October, 1997 PRODUCT DESCRIPTION Qualification Purpose: To qualify CY7B933 product, SM13 technology, Fab2 with 6 layer mask changed to improve moisture level and customer application (QTP 96501). The device was previously qualified in Fab2, SM13 technology by QTP 94046 Marketing Part #: CYB933 Package: 28-pin Plastic Lead Chip Carrier (PLCC) 28-pin Square Leadless Chip Carrier (LCC) Device Description: HOTlink Receiver Cypress Division: Cypress Semiconductor Corporation - DCD Division Overall Die (or Mask) REV Level (pre-requisite for qualification): Die Size (stepping): 126 mils x 131 mils Rev. A What ID markings on Die: 7B933A TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 2 Metal Composition: Passivation Type and Materials: 3,000A TEOS + 15,000A Oxynitride Free Phosphorus contents in top glass layer(%): Die Coating(s), if used: Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: 3% N/A Generic Process Technology/Design Rule (µ-drawn): Gate Oxide Material/Thickness (MOS): Metal 1: Ti/TiW/Al Metal 2: Ti/Al BiCMOS, Single Poly, Double Metal /0.8 µm SiO2 / 195A° Cypress Semiconductor - Round Rock, TX Fab2/SM13 Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 3 of 7 October, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 28-pins Plastic Lead Chip Carrier (PLCC) Mold Compound Name/Manufacturer: Sumitomo EME-6000H Lead Frame material: Copper Olin 151 Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die Attach Area Plating: Silver Spot Die Attach Method: Paste Die Attach Material: Ablestik 84-1LMI Wire Bond Method: Thermosonic Wire Material/Size: Gold / 1.3 mil JESD22-A112 Moisture Sensitivity Level Level 1 Assembly Line ID and Process ID: Anam, Korea HERMETIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 28-pin Square Leadless Chip Carrier (LCC) Alloy 42 Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Seal Material: Glass Die Attach Method: Paste Die Attach Material: Silver Glass Wire Bond Method: Ultrasonic Wire Material/Size: Aluminum / 1.25 mil Name/Location of Assembly (prime) facility: Cypress Bangkok, Thailand Assembly Line ID and Process ID: ALPHA-X/49-15047 Note: Please contact a Cypress Representative for other packages availability. Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 4 of 7 October, 1997 RELIABILITY TESTS PERFORMED Stress/Test Test Condition (Temp/Bias) Result P/F High Temperature Operating Life Early Failure Rate Dynamic Operating Condition, Vcc = 5.75V, 150°C P High Temperature Operating Life Latent Failure Rate Dynamic Operating Condition, Vcc =5.75V, 150°C P Group C, subgroup 1 Life Test Dynamic Operating Condition, Vcc = 5.75V, 150°C P Read and Record Life Test Dynamic Operating Condition, Vcc = 5.75V, 150°C P High Temperature Steady State Life Static Operating Condition, Vcc = 5.75V, 150°C P High Accelerated Saturation Test (HAST) 140°C, 85%RH, 5.5V Precondition: JESD22 Moisture Sensitivity Level 1 P (168 Hrs , 85°C /85%RH) Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level 1 P (168 Hrs , 85°C /85%RH) Temperature Cycle - Hermetic Device MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C Electrostatic Discharge Human Body Model (ESD-HBM) MIL-STD-883, Method 3015.7 Electrostatic Discharge Charge Device Model (ESD-CDM) Cypress Spec. 25-00020 Latchup Sensitivity In accordance with JEDEC 17. Cypress Spec. 01-00081 P 4,400V 2,000V P 11.5V ± 200mA Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 5 of 7 October, 1997 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Devive Hours # Fails Activation Energy Thermal AF3 Failure Rate High Temperature Operating Life Early Failure Rate 1,552 Devices 0 N/A N/A 0 PPM High Temperature Operating Life1,2 Long Term Failure Rate 179,500 DHRs 0 1.0 170 30 FIT 1 2 3 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate. Thermal Acceleration Factor is calculated from the Arrhenius equation E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 6 of 7 October, 1997 RELIABILITY TEST DATA QTP # 940461/965012 EVAL # ====== STRESS: TIME DEVICE ASSY-LOC ASSYLOT# FABLOT# POINT S/S Rej Fail Mode ============== ======== ============== ======== ===== === === =================================== HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 5.75V) 94046 CY7B933-LMB ALPHA-X 219405731 2405878 48 499 0 94046 CY7B933-JC KOREA-A 49307176 2342542 48 546 0 94046 CY7B933-JC KOREA-A 49404029 2405878 48 507 0 ---------------------------------------------------------------------------------------------------------------STRESS: GROUP C LIFE TEST, MIL-STD-883, METHOD 1005.4 (150C, 5.75V) 94046 CY7B933-LMB KOREA-A 219401302 2342542 184 80 0 ---------------------------------------------------------------------------------------------------------------STRESS: HI-ACCEL SATURATION TEST (140C, 85%RH, 5.75V), PRECONDITION 48 HRS. PCT 94046 CY7B933-JC KOREA-A 49404029 2405878 128 48 0 94046 CY7B933-JC KOREA-A 49307176 2342542 128 48 0 94046 CY7B933-JC KOREA-A 49404075 2405878 128 47 0 ---------------------------------------------------------------------------------------------------------------STRESS: HI-ACCEL SATURATION TEST (140C/85%RH/5.5V), PRECOND. 168 HRS 85C/85%RH 96501 CY7B933-JC KOREA-A 349614957 2642132 128 51 0 ---------------------------------------------------------------------------------------------------------------STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 5.75V) 94046 CY7B933-LMB ALPHA-X 219405731 2405878 168 78 0 94046 CY7B933-JC KOREA-A 49307176 2342542 168 78 0 94046 CY7B933-JC KOREA-A 49404029 2405878 168 78 0 ---------------------------------------------------------------------------------------------------------------STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V) 94046 94046 CY7B933-LMB CY7B933-LMB ALPHA-X ALPHA-X 219405731 219405731 2405878 2405878 80 500 120 119 0 0 94046 94046 CY7B933-JC CY7B933-JC KOREA-A KOREA-A 49307176 49307176 2342542 2342542 80 500 120 120 0 0 94046 94046 CY7B933-JC CY7B933-JC KOREA-A KOREA-A 49404029 49404029 2405878 2405878 80 500 120 120 0 0 ---------------------------------------------------------------------------------------------------------------STRESS: PRESSURE COOKER TEST (121C, 100%RH) 94046 CY7B933-JC KOREA-A 49307176 2342542 168 48 0 94046 CY7B933-JC KOREA-A 49404075 2405878 168 47 0 ---------------------------------------------------------------------------------------------------------------STRESS: READ & RECORD LIFE TEST (150C, 5.75V) 94046 94046 94046 CY7B933-JC CY7B933-JC CY7B933-JC KOREA-A KOREA-A KOREA-A 49307176 49307176 49307176 2342542 2342542 2342542 48 80 500 10 10 10 0 0 0 ---------------------------------------------------------------------------------------------------------------- 1 2 QTP 94046, CY7B933, SM13 technology, Fab 2 qualification. QTP 96501, CY7B933, SM13 technology, Fab 2 with mask changed to improve moisture level and customer application. Cypress Semiconductor, Inc. HOTlink Receiver Device: CY7B933 Package: PLCC QTP# 94046/96501, V. 1.0 Page 7 of 7 October, 1997 RELIABILITY TEST DATA QTP # 94046/96501 EVAL # ====== STRESS: DEVICE ASSY-LOC ASSYLOT# FABLOT# ============== ======== ============== ======== TC COND. C, -65 TO 150C, PRECONDITION 48 HRS PCT POINT ===== S/S === Rej Fail Mode === =================================== 94046 94046 CY7B933-JC CY7B933-JC KOREA-A KOREA-A 10591 10591 2405878 2405878 300 1000 49 48 0 0 94046 CY7B933-JC KOREA-A 10592 2342542 300 49 0 1 EOS ---------------------------------------------------------------------------------------------------------------STRESS: TC COND. C, -65 TO 150C, HERMETIC DEVICES 94046 CY7B933-LMB KOREA-A 219401302 2342542 100 47 0 94046 CY7B933-LMB KOREA-A 219401302 2342542 1000 46 0 ---------------------------------------------------------------------------------------------------------------STRESS: TC COND. C, -65 TO 150C, PRECOND. 168 HRS 85C/85%RH (MSL 1) 96501 96501 CY7B933-JC CY7B933-JC KOREA-A KOREA-A 349614957 349614957 2642132 2642132 300 1000 50 50 0 0 96501 96501 CY7B933-JC CY7B933-JC KOREA-A KOREA-A 349614958 349614958 2642132 2642132 300 1000 50 50 0 0 ----------------------------------------------------------------------------------------------------------------