Document No.001-76019 Rev. *A ECN # 4674343 Cypress Semiconductor Automotive Package Qualification Report QTP# 073205 VERSION*A March, 2015 48 Balls FBGA (1.2mm Thickness) & 48 Balls FBGA (6 x 8 x 1mm) SnAgCu, MSL3, 260°C Reflow ASE-Taiwan FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Richard Oshiro (RGO) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-76019 Rev. *A ECN # 4674343 PACKAGE QUALIFICATION HISTORY QTP Number 073205 Description of Qualification Purpose Automotive 48 FBGA(1.2mm Thickness) SnAgCu, MSL3, 260C Reflow using CY7C1041CV33-20BAXI device with NSM Fix assembled at ASE, Taiwan Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 7 Date Comp Oct 07 Document No.001-76019 Rev. *A ECN # 4674343 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BK48 Package Outline, Type, or Name: 48 Fine Ball Grid Array (FBGA) Mold Compound Name/Manufacturer: KE-G2270/KYOCERA Mold Compound Flammability Rating: V-0 UL-94 Oxygen Rating Index: N/A Substrate Material: BT Resin Lead Finish, Composition / Thickness: Die Backside Preparation Method/Metallization: Die Separation Method: N/A Die Attach Supplier: Ablestik Die Attach Material: 2025D Die Attach Method: Epoxy Wire Bond Method: Thermosonic Wire Material/Size: Au/ 1.0mil Thermal Resistance Theta JA °C/W: 9.12 Package Cross Section Yes/No: N/A Assembly Process Flow: 49-41040 Name/Location of Assembly (prime) facility: ASE-Taiwan MSL Level 3 Reflow Profile 260C Backgrind Saw ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 7 Document No.001-76019 Rev. *A ECN # 4674343 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) High Temp Storage Life Test Test Condition (Temp/Bias) JESD22-A110, 130°C, 85%RH ,3.65V Precondition: JESD22-A113 Moisture Sensitivity MSL (192 Hrs., 30°C, 60% RH, 260°C Reflow) Result P/F P JESD22-A103, 150°C JESD22-A104, -65°C to +150°C Precondition: JESD22-A113 Moisture Sensitivity MSL (192 Hrs., 30°C, 60% RH, 260°C Reflow) P Post Temperature Cycle Wire Bond Pull Mil-Std 883, Method 2011 P Pressure Cooker Test JESD22-A102,121°C, 100%RH, 15 PSIG Precondition: JESD22-A113 Moisture Sensitivity MSL (192 Hrs., 30°C, 60% RH, 260°C Reflow) P Wire Bond Shear AEC Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30°C, 60% RH, 260°C Reflow) P Solder Ball Shear AEC Q100-010 P External Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009 P Physical Dimension JESD22B100 and B108 P X-Ray MIL-STD-883 - 2012 P Temperature Cycle Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 7 P Document No.001-76019 Rev. *A ECN # 4674343 Reliability Test Data QTP #: 073205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN COMP 15 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN COMP 15 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN COMP 15 0 CY7C1041CV33 (7C1341RC) 4529531 610540434 ASE-TAIWAN COMP 15 0 4529531 610539901 ASE-TAIWAN COMP 30 0 4529531 610539901 ASE-TAIWAN COMP 30 0 CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN COMP 356 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN COMP 319 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN COMP 170 0 CY7C1041CV33 (7C1341RC) 4529531 610540434 ASE-TAIWAN COMP 50 0 STRESS: BALL SHEAR CY7C1041CV33 (7C1341RC) STRESS: BOND PULL CY7C1041CV33 (7C1341RC) STRESS: EXTERNAL VISUAL STRESS: HI-ACCEL SATURATION TEST, (130C, 3.65V), 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN 96 83 0 610539901 ASE-TAIWAN 1000 50 0 STRESS: HIGH TEMP STORAGE CY7C1041CV33 (7C1341RC) 4529531 STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN 500 83 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN 300 55 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN 500 54 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN 300 60 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN 500 60 0 CY7C1041CV33 (7C1341RC) 4529531 610540434 ASE-TAIWAN 500 15 0 STRESS: PHYSICAL DIMENSIONS CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN COMP 10 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN COMP 10 0 CY7C1041CV33 (7C1341RC) 4529531 610540434 ASE-TAIWAN COMP 10 0 COMP 5 0 STRESS: POST 500 TEMPERATURE CYCLE WIRE BOND PULL CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-76019 Rev. *A ECN # 4674343 Reliability Test Data QTP #: 073205 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN 96 45 0 CY7C1041CV33 (7C1341RC) 4636615 610738761 ASE-TAIWAN 168 45 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN 96 50 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN 168 50 0 STRESS: SOLDER BALL SHEAR CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN COMP 10 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN COMP 10 0 CY7C1041CV33 (7C1341RC) 4529531 610540434 ASE-TAIWAN COMP 10 0 CY7C1041CV33 (7C1341RC) 4529531 610539901 ASE-TAIWAN COMP 15 0 CY7C1041CV33 (7C1341RC) 4529531 610540575 ASE-TAIWAN COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-76019 Rev. *A ECN # 4674343 History Page Document Title: QTP 073205: 48 BALLS FBGA (1.2MM THICKNESS) & 48 BALLS FBGA (6 X 8 X 1MM), SNAGCU, MSL3, 260C REFLOW ASE-TAIWAN Document Number: 001-76019 Rev. ECN Orig. of No. Change ** 3521093 NSR *A 4674343 JYF Description of Change Initial spec release, initial qual report Rev 1.0 was released in memo HGA-192. Added 48 Balls FBGA (6 x 8 x 1mm) in the title page as covered in memo ILZ-413. Sunset review: Updated QTP title page and Reliability Tests Performed table (X-Ray, External, Acoustic, PCT, TCT, HAST) for template alignment. Deleted obsolete spec#10-06790 in Major Package Information table. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7