Cypress Semiconductor Automotive Package Qualification Report QTP# 090405 VERSION 1.0 May 2009 Automotive 56-Lead QFN NiPdAu, MSL3, 260C Reflow Amkor-Korea (L) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 2 of 7 May 2009 PACKAGE QUALIFICATION HISTORY Qual Report 090405 Description of Qualification Purpose Qualify Automotive Package 56 QFN PSoC Radon device CY8C24894-24LFXA, EME G700 Mold Compound, Ablestik 8290 epoxy, NiPdAu, MSL3/260C, Amkor (L) Date Comp May 09 Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 3 of 7 May 2009 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: Mold Compound Alpha Emission Rate: LY56 56-Lead QFN Hitachi EME-G700 V-O per UL94 N/A Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: Ni-Pd-Au Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Ablestik Die Attach Material: 8290 Die Attach Method: Epoxy Bond Diagram Designation: 001-50786 Wire Bond Method: Thermosonic Wire Material/Size: Au, 1.0mil Thermal Resistance Theta JA °C/W: 23°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001−16573 Name/Location of Assembly (prime) facility: Amkor-Korea (L) MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 4 of 7 May 2009 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Accelerated Saturation Test (HAST) Test Condition (Temp/Bias) AEC-Q100-008 and JESD22-A108 Dynamic Operating Condition, Vcc Max = 5.5V, 125°C JESD22-A110, 130C, 5.25V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 Result P/F P P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C Temperature Cycle Pressure Cooker JESD22-A104, -65°C to 150°C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 P P 192 Hrs, 30C/60%RH+3IR-Reflow, 260°C+0, -5°C Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/750V P NVM Endurance /Data Retention AEC-Q100-005, 150 C, non-biased P (Plastic ) NVM Endurance / High Temperature Operating Life AEC-Q100-005 and JESD22-A108, 125C P Acoustic Microscopy JEDEC JSTD-020, Cypress Spec. 25-00104 P Wire Ball Shear AEC-Q100-001, Cypress Spec 24-00018 P Wire Bond Pull Mil-Std 883, Method 2011, Cypress Spec 24-00002 P Electrical Distribution AEC-Q100-009 P Final Visual Inspection Cypress Spec 12-00292 P Lead Integrity JESD22-B105 P Physical Dimensions JESD22-B100/108, Cypress Spec. 25-00031 P Post Temp Cycle Wire Bond Pull Mil-Std 883, Method 2011 P Solderability JESD22-B102, Cypress Spec. 25-00018 P Static Latchup AEC-Q100-004, 125C, 5.4V, ± 200mA, 6.5V, ± 240mA Cypress Spec. 01-00081 P Constructional Analysis Cypress Spec 25-20035 P Dye Penetrant Test Cypress Spec 25-00046 P P Dynamic Operating Condition, Vcc = 5.5V Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 5 of 7 May 2009 Reliability Test Data QTP #: Device 090405 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA COMP 22 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA COMP 22 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA COMP 22 0 4846168 610904365 L-KOREA COMP 30 0 4846168 610904365 L-KOREA COMP 30 0 610902809 L-KOREA COMP 5 0 610902809 L-KOREA 1008 80 0 STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR CY8C24894 (8A24894AC) STRESS: BOND PULL CY8C24894 (8A24894AC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C24894 (8C24894AC) 4837095 STRESS: DATA RETENTION, 150C non-biased CY8C24894 (8C24894AC) 4837095 STRESS: DYE PENETRANT TEST CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA COMP 15 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA COMP 15 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA COMP 15 0 STRESS: ELECTRICAL DISTRIBUTION CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA COMP 30 0 CY8C24894 (8A24894AC) 4846833 610904364 L-KOREA COMP 30 0 CY8C24894 (8A24894AC) 4844525 610905172 L-KOREA COMP 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 5.5V, Vcc Max CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA 48 3496 0 CY8C24894 (8A24894AC) 4846833 610904364 L-KOREA 48 3515 0 CY8C24894 (8A24894AC) 4844525 610905172 L-KOREA 48 3495 0 4837095 610902809 L-KOREA 1000 85 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 L-KOREA COMP 3 0 STRESS: ENDURANCE CY8C24894 (8C24894AC) STRESS: ESD-CHARGE DEVICE MODEL, 200V CY8C24894 (8A24894AC) 4846168 610904365 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C24894 (8A24894AC) 4846168 610904365 STRESS: ESD-CHARGE DEVICE MODEL, 750V CY8C24894 (8A24894AC) 4846168 610904365 Failure Mechanism Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 6 of 7 May 2009 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 090405 Assy Loc Duration Samp Rej STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 500V CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA COMP 3 0 COMP 3 0 COMP 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1,000V CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 1,500V CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B, 2,000V 4846168 610904365 L-KOREA COMP 3 0 CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA COMP 549 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA COMP 374 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA COMP 294 0 COMP 6 0 CY8C24894 (8A24894AC) STRESS: FINAL VISUAL STRESS: STATIC LATCH-UP TESTING, 125C, 5.4V, +/200mA CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA STRESS: STATIC LATCH-UP TESTING, 125C, 6.5V, +/240mA CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA COMP 6 0 STRESS: PHYSICAL DIMENSIONS CY8C24894 (8A24894AC) 4846168 610904365 L-KOREA COMP 10 0 CY8C24894 (8A24894AC) 4846833 610904364 L-KOREA COMP 10 0 CY8C24894 (8A24894AC) 4844525 610905172 L-KOREA COMP 10 0 L-KOREA COMP 5 0 STRESS: POST TEMP CYCLE WIRE BOND PULL CY8C24894 (8C24894AC) 4837095 610902809 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA 96 80 0 CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA 168 80 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA 96 80 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA 168 80 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA 96 80 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA 168 80 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.25V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA 96 77 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA 96 77 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA 96 77 0 Failure Mechanism Cypress Semiconductor Automotive 56-Lead QFN, NiPdAu, MSL3, 260C Reflow Assembly: Amkor-Korea (L) 090405 V.1.0 Page 7 of 7 May 2009 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # 090405 Assy Loc Duration Samp Rej Failure Mechanism STRESS: SOLDERABILITY CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA COMP 15 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA COMP 15 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA COMP 15 0 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C24894 (8C24894AC) 4837095 610902809 L-KOREA 500 85 0 CY8C24894 (8C24894AC) 4840277 610905452 L-KOREA 500 85 0 CY8C24894 (8C24894AC) 4837096 610902440 L-KOREA 500 85 0