97101%20rev2.0.pdf

Cypress Semiconductor
Qualification Report
QTP# 97101 VERSION 2.0
July, 2003
64K x 16 Static RAM
CY7C1021
CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:
Ed Russell
Reliability Director
(408) 432–7069
Rene Rodgers
Reliability Engineering
(408) 943-2732
Cypress Semiconductor
64K x 16 Static RAM
Device:CY7C1021
Package: 44-pin, 400-mil SOJ
QTP# 97101, V. 2.0
Page 2 of 6
July, 2003
PRODUCT DESCRIPTION (for qualification)
Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
Marketing Part #:
CY7C1021
Package:
44 pins, 400 mil SOJ
Device Description:
64K x 16 Static RAM
Cypress Division:
Cypress Semiconductor Corporation - MPD Division
Overall Die (or Mask) REV Level (pre-requisite for qualification):
What ID markings on Die:
Rev. B
7C1021A
TECHNOLOGY/FAB PROCESS DESCRIPTION - R3
Number of Metal Layers:
2
Metal Composition:
Passivation Type and Materials:
7,000A TEOS + 6,000A Si2N4
Free Phosphorus contents in top glass layer(%):
Die Coating(s), if used:
Metal 1: 500A TiW, 6000A Al/0.5%Cu 1200A TiW
Metal 2: 500A TiW, 9000A Al/0.5%Cu 1200A TiW
0%
None
Number of Transitor in device
6,507,935
Number of Gate in device
6,565,448
Generic Process Technology/Design Rule (µ-drawn):
Gate Oxide Material/Thickness (MOS):
Name/Location of Die Fab (prime) Facility:
Die Fab Line ID/Wafer Process ID:
CMOS, Single Poly, 2 Local Interconnect, Double Metal /0.5 µm
SiO2 / 145Å
Cypress Semiconductor - Bloomington, MN
Fab4/R3
Cypress Semiconductor
64K x 16 Static RAM
Device:CY7C1021
Package: 44-pin, 400-mil SOJ
QTP# 97101, V. 2.0
Page 3 of 6
July, 2003
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, or Name:
44-pin, 400 mil SOJ
Mold Compound Name/Manufacturer:
Lead Frame material:
Nito-MP8000
A194 FH
Lead Finish, composition:
Solder Plated, 85%Sn, 15%Pb
Die Attach Area Plating:
Silver Spot
Die Attach Method:
Paste
Die Attach Material:
Ablestik 8361A
Wire Bond Method:
Thermosonic
Wire Material/Size:
Gold / 1.0 mil
JESD22-A112 Moisture Sensitivity Level
Level 3
Assembly Line ID and Process ID:
ASE, Taiwan (TAIWN-G)
Note: Please contact a Cypress Representative for other packages availability.
Cypress Semiconductor
64K x 16 Static RAM
Device:CY7C1021
Package: 44-pin, 400-mil SOJ
QTP# 97101, V. 2.0
Page 4 of 6
July, 2003
RELIABILITY TESTS PERFORMED
Stress/Test
Test Condition
(Temp/Bias)
Result
P/F
High Temperature Operating Life
Latent Failure Rate
Dynamic Operating Condition, Vcc = 5.75V, 150°C
P
Read and Record Life Test
Dynamic Operating Condition, Vcc = 5.75V, 150°C
P
High Temperature Steady State Life
Static Operating Condition, Vcc = 5.75V, 150°C
P
High Accelerated Saturation Test (HAST)
140°C, 85%RH, 5.5V
Precondition:
JESD22 Moisture Sensitivity Level 3
(192 Hrs, 30C/60% RH)
P
Temperature Cycle
MIL-STD-883C, Method 1010, Condition C, -65°C to 150°C
Precondition:
JESD22 Moisture Sensitivity Level 3
(192 Hrs, 30C/60% RH)
P
Electrostatic Discharge
Human Body Model (ESD-HBM)
1800V
MIL-STD-883, Method 3015.7
P
Electrostatic Discharge
Charge Device Model (ESD-CDM)
500V
Cypress Spec. 25-00020
P
Latchup Sensitivity
12V
In accordance with JEDEC 17. Cypress Spec. 01-00081
P
7.1V
Cypress Spec. 01-00081
P
Dynamic Latchup sensitivity
Cypress Semiconductor
64K x 16 Static RAM
Device:CY7C1021
Package: 44-pin, 400-mil SOJ
QTP# 97101, V. 2.0
Page 5 of 6
July, 2003
RELIABILITY FAILURE RATE SUMMARY
Stress/Test
High Temperature Operating Life
Early Failure Rate2
High Temperature Operating Life1,3
Long Term Failure Rate
Device Tested/
Device Hours
#
Fails
Activation
Energy
Thermal
AF
Failure Rate
N/A
N/A
N/A
N/A
N/A
59,000 DHRs
0
0.7
170
** FIT
1
Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C.
Production burn-in @ 80 Hrs/150°C/6.5V is performed for this device.
3
Chi-squared 60% estimations used to calculate the failure rate.
2
E  1 1  
AF = exp  A  -  
 k  T 2 T1  
where:
EA =The Activation Energy of the defect mechanism.
k = Boltzmann's constant = 8.62x10-5 eV/Kelvin.
T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device
at use conditions.
** Sample size insufficient for accurate FIT Rate calculation.
Cypress Semiconductor
64K x 16 Static RAM
Device:CY7C1021
Package: 44-pin, 400-mil SOJ
QTP# 97101, V. 2.0
Page 6 of 6
July, 2003
RELIABILITY TEST DATA
QTP#: 97101
DEVICE
ASSY-LOC FABLOT#
==================== ======== ========
STRESS:
ESD-CHARGE DEVICE MODEL (500V)
ASSYLOT#
==============
DURATION
========
S/S
====
REJ
===
FAIL MODE
================================
CY7C1021-VC
TAIWN-G
4711049
619703241
COMP
3
0
--------------------------------------------------------------------------------------------------------------STRESS:
ESD-HUMAN BODY CIRCUIT PER MIL STD 883, METHOD 3015 (1800V)
CY7C1021-VC
TAIWN-G
4711049
619703241
COMP
3
0
CY7C1021-VC
TAIWN-G
4711049
619703241
COMP
3
0
--------------------------------------------------------------------------------------------------------------STRESS:
HI-ACCEL SATURATION TEST (140C, 5.5V), PRECOND. 192 HRS 30C/60%RH
CY7C1021-VC
TAIWN-G
4711049
619703241
128
48
1
1 LIFTING BOND
CY7C1021-VC
TAIWN-G
4711049
619703241L1
128
48
0
--------------------------------------------------------------------------------------------------------------STRESS:
HIGH TEMP STEADY STATE LIFE TEST (150C, 5.75V)
CY7C1021-VC
CY7C1021-VC
TAIWN-G
TAIWN-G
4711049
4711049
619703241
619703241
76
168
75
75
0
0
CY7C1021-VC
TAIWN-G
4711049
619703241
80
76
0
CY7C1021-VC
TAIWN-G
4711049
619703241
168
76
0
--------------------------------------------------------------------------------------------------------------STRESS:
HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 5.75V)
CY7C1021-VC
TAIWN-G
4711049
619703241
80
118
0
CY7C1021-VC
TAIWN-G
4711049
619703241
500
118
0
--------------------------------------------------------------------------------------------------------------STRESS:
READ & RECORD LIFE TEST (150C, 5.75V)
CY7C1021-VC
TAIWN-G
4711049
619703241
500
10
0
--------------------------------------------------------------------------------------------------------------STRESS:
TC COND. C, -65 TO 150C, PRECOND. 192 HRS 30C/60%RH
CY7C1021-VC
TAIWN-G
4711049
619703241
300
48
0
CY7C1021-VC
TAIWN-G
4711049
619703241
1000
48
0
---------------------------------------------------------------------------------------------------------------