Document No.002-12533 Rev. ** ECN # 5226437 Cypress Semiconductor Package Qualification Report QTP# 153009 VERSION ** April 2016 120L TQFP (14x14x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow Amkor-Philippines (M) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.002-12533 Rev. ** ECN # 5226437 PACKAGE QUALIFICATION HISTORY QTP Number 153009 Description of Qualification Purpose Qualification of 120L TQFP (14x14x1.4mm) Package using 1.2mil CuPd wire, G631 mold compound, AP4200 die attach material, CuAg leadframe and Pure Sn leadfinish at MSL3, 260C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 9 Date Apr 2016 Document No.002-12533 Rev. ** ECN # 5226437 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ0AE Package Outline, Type, or Name: 120L TQFP (14x14x1.4mm) Mold Compound Name/Manufacturer: G631HQ / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% >28% typical value Lead Frame Designation: Full Metal Pad Lead Frame Material: CuAg (C194) Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Evertech Enterprise Die Attach Material: AP4200 Bond Diagram Designation 001-91280 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 1.2 mil Thermal Resistance Theta JA C/W: 31°C/W Package Cross Section Yes/No: No Assembly Process Flow: 49-24999 Name/Location of Assembly (prime) facility: Amkor-Philippines (M) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 9 Document No.002-12533 Rev. ** ECN # 5226437 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Latent Failure Rate (LFR) Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, 150°C, 2.3V, 500 Hours JESD22-A-108-B JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P P Constructional Analysis Criteria: Meet external and internal characteristics of package P High Temp Storage JESD22-A103: 150 C, no bias P X-Ray MIL-STD-883 – 2012 P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101B P Bond Pull MIL-STD-883 – Method 2011 P Ball Shear JESD22-B116A P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110, 130 C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) No Package Crack Dye Penetrant Test P P Electrostatic Discharge Charge Device Model (ESD-CDM) Physical Dimension 500V, JESD22-C101 MIL-STD-1835, JESD22-B100 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Pull MIL-STD-883 – Method 2011 P Solderability J-STD-002, JESD22-B102 P Die Shear MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 9 P Document No.002-12533 Rev. ** ECN # 5226437 Reliability Test Data QTP #: 153009 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 150 0 AZ120 4430901 611438709 AMKOR-M COMP 5 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M COMP 15 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY7C0832AV (7C08323CC) STRESS: DIE SHEAR STRESS: DYE PENETRANT STRESS: ESD-CHARGE DEVICE MODEL CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 500 9 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 1000 3 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 1250 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.002-12533 Rev. ** ECN # 5226437 Reliability Test Data QTP #: 153009 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 274 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 142 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 146 0 STRESS: HIGH ACCELERATED SATURATION TEST 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3) CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 96 29 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M 96 30 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M 96 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 500 80 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M 500 80 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M 500 80 0 STRESS: HIGH TEMPERATURE STORAGE CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 1000 80 0 STRESS: INTERNAL VISUAL CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 150 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 150 0 STRESS: PRESSURE COOKER TEST CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M 168 78 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M 168 79 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.002-12533 Rev. ** ECN # 5226437 Reliability Test Data QTP #: 153009 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSIONS CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 30 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 30 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 30 0 96 5 0 STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 96 5 0 4430901 611438709 AMKOR-M COMP 1 0 4430901 611438709 AMKOR-M COMP 1 0 4450242 611512169 AMKOR-M 168 5 0 4450242 611512169 AMKOR-M 168 5 0 STRESS: POST MSL BALL SHEAR TEST CY7C0832AV (7C08323CC) AZ120 STRESS: POST MSL BOND PULL CY7C0832AV (7C08323CC) AZ120 STRESS: POST PCT BALL SHEAR CY7C0832AV (7C08323CC) AZ120 STRESS: POST PCT BOND PULL CY7C0832AV (7C08323CC) AZ120 STRESS: POST TCT BALL SHEAR CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 500 5 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 1000 5 0 STRESS: POST TCT BOND PULL CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 500 5 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 1000 5 0 STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 AMKOR-M 1000 5 0 STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.002-12533 Rev. ** ECN # 5226437 Reliability Test Data QTP #: 153009 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: SOLDERABILITY CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M COMP 3 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M COMP 3 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M COMP 3 0 STRESS: TEMPERATURE CYCLE CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 500 82 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438709 AMKOR-M 1000 72 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M 500 83 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438708 AMKOR-M 1000 83 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M 500 85 0 CY7C0832AV (7C08323CC) AZ120 4430901 611438707 AMKOR-M 1000 85 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512169 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512160 AMKOR-M COMP 15 0 CY7C0832AV (7C08323CC) AZ120 4450242 611512161 AMKOR-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.002-12533 Rev. ** ECN # 5226437 Document History Page Document Title: QTP#153009: 120L TQFP (14x14x1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow AmkorPhilippines (M) Document Number: 002-12533 Rev. ECN Orig. of No. Change ** 5226437 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9