Document No.002-10504 Rev. ** ECN # 5072472 Cypress Semiconductor Package Qualification Report QTP# 152203 VERSION** December 2015 16-Ball Wafer Level Chip Scale Package (WLCSP), 1.452x1.559 mm MSL1, 260C Deca Technologies (DT) - Philippines FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos (HSTO) Reliability Engineer Reviewed By: Rene Rodgers (RT) MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.002-10504 Rev. ** ECN # 5072472 PACKAGE QUALIFICATION HISTORY QTP Number DESCRIPTION OF QUALIFICATION PURPOSE Date 112201 Qualify WLCSP assembly in Deca Technologies (DT) Philippines for Wafer Processing and Die Finishing Steps using SAC 405 Solder Finish, at MSL1, 260C Oct 2011 152203 Qualify 16-Ball WLCSP (1.452x1.559mm) Package with 50x56um scribe street (prior RDL) at Deca Technologies (DT) using SAC405 Solder Finish at MSL1, 260C Aug 2015 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Document No.002-10504 Rev. ** ECN # 5072472 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FN81B,FN60B 81-Ball Wafer Level Chip Scale Package (WLCSP) (3.9 x 3.9 x 0.55mm) 99-Ball Wafer Level Chip Scale Package (WLCSP) (5.19 x 5.94 x 0.6 mm) 16-Ball Wafer Level Chip Scale Package (WLCSP) (1.452x1.559mm) Die Backside Preparation Method: Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 001-69859, 001-88811 Thermal Resistance Theta JA °C/W: 24°C/W , 16.55°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: DT-Philippines MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Note: Please contact a Cypress Representative for other packages availability Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No.002-10504 Rev. ** ECN # 5072472 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Electrostatic Discharge Charge Device Model (ESD-CDM) 500 / 1000 / 1250 JESD22-C101 P Electrostatic Discharge Human Body Model (ESD-HBM) 1,100V/2,200V/3,300V JEDEC EIA/JESD22-A114 P External Visual MIL-PRF-38535, MIL-STD-883, METHOD 2009 P Final Visual JESD22-B101 P Functional Board Level Reliability Test (FBLRT) Temperature Cycle, -40°C to 85°C P High Accelerated Saturation Test (HAST) – No Bias Highly Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 130C, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 1 (168 Hrs.,85°C, 85%RH, 260°C Reflow) JEDEC STD 22-A110: 130C, 85%RH, 1.98V Precondition: JESD22 Moisture Sensitivity Level 1 (168 Hrs.,85°C, 85%RH, 260°C Reflow) P P High Temperature Storage 150°C, no bias P Internal Visual MIL-STD-883-2014 P Soft Error Test Vcc nom, room temperature, JESD89 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker Test JESD22-A102:121°C /100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level 1 (168 Hrs.,85°C, 85%RH, 260°C Reflow) P Solder Ball/Bump Shear JESD22-B117 P Temperature Cycle MIL-STD-883, Method 1010, Condition B, -55°C to 125°C Precondition: JESD22 Moisture Sensitivity MSL 1 (168 Hrs.,85°C, 85%RH, 260°C Reflow) P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 Document No.002-10504 Rev. ** ECN # 5072472 Reliability Test Data QTP #: Device Fab Lot # 112201 Assy Lot # Assy Loc Duration Samp Rej 402454503 DT-PHIL COMP 5 0 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL COMP 1558 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL COMP 1621 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL COMP 1356 0 404682925 DT-PHIL COMP 1 wafer 0 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL COMP 5 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL COMP 5 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL COMP 5 0 Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS CYWB0226ABSX (7C071011C) 4024545 STRESS: EXTERNAL VISUAL STRESS: ELECTRICAL CHARACTERIZATION CYWB0226ABSX (7C071011C) 4046829 STRESS: INTERNAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 1.98V, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 96 67 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL 96 72 0 STRESS: HIGH TEMPERATURE STORAGE, 150C CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 500 79 0 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 1000 77 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 96 77 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL 96 76 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL 96 78 0 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL COMP 30 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL COMP 30 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL COMP 30 0 STRESS: PHYSICAL DIMENSION Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.002-10504 Rev. ** ECN # 5072472 Reliability Test Data QTP #: Device Fab Lot # 112201 Assy Lot # Assy Loc Duration Samp Rej CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL COMP 30 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL COMP 30 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL COMP 30 0 Failure Mechanism STRESS: SOLDER BALL/BUMP SHEAR STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 500 78 0 CYWB0226ABSX (7C071011C) 4024545 402454503 DT-PHIL 1000 78 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL 500 78 0 CYWB0226ABSX (7C071011C) 4024545 402454505 DT-PHIL 1000 78 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL 500 79 0 CYWB0226ABSX (7C071011C) 4024545 402454507 DT-PHIL 1000 79 0 402454503 DT-PHIL 200 80 0 STRESS: THERMAL SHOCK CYWB0226ABSX (7C071011C) 4024545 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.002-10504 Rev. ** ECN # 5072472 Reliability Test Data QTP #: Device Fab Lot # 152203 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: CONSTRUCTIONAL ANALYSIS CY8CMBR3255 (8F44302AC) 4443673-01 4443673-01 DT-Phils COMP 5 0 CY8CMBR3255 (8F44302AC) 4443673-02 4443673-02 DT-Phils COMP 5 0 CY8CMBR3255 (8F44302AC) 4443673-03 4443673-03 DT-Phils COMP 5 0 4443606 DT-Phils COMP 10 0 STRESS: ELECTRICAL CHAR CY8CMBR3255 (8F44302AC) 4443606 STRESS: ESD-CHARGE DEVICE MODEL CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 500 8 0 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 1000 3 0 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 1250 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 1100 3 0 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 2200 8 0 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 3300 3 0 CY8CMBR3255 (8F44302AC) 4443606-7 4443606-7 DT-Phils COMP 12253 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils COMP 12324 0 CY8CMBR3255 (8F44302AC) 4443606-11 4443606-11 DT-Phils COMP 12281 0 STRESS: EXTERNAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 1.98V, PRE COND 168 HR 85C/85%RH, MSL1 CY8CMBR3255 (8F44302AC) 4443606-7 4443606-7 DT-Phils 96 77 0 CY8CMBR3255 (8F44302AC) 4443606-7 4443606-7 DT-Phils COMP 5 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils COMP 5 0 CY8CMBR3255 (8F44302AC) 4443606-11 4443606-11 DT-Phils COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 168 HR 85C/85%RH, MSL1 CY8CMBR3255 (8F44302AC) 4443606-7 4443606-7 DT-Phils COMP 96 0 CY8CMBR3255 (8F44302AC) 4443606-7 4443606-7 DT-Phils COMP 168 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils COMP 96 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils COMP 168 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.002-10504 Rev. ** ECN # 5072472 Reliability Test Data QTP #: Device Fab Lot # 152203 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils COMP 30 0 CY8CMBR3255 (8F44302AC) 4443673-02 4443673-02 DT-Phils COMP 30 0 CY8CMBR3255 (8F44302AC) 4443673-03 4443673-03 DT-Phils COMP 30 0 4443606 DT-Phils COMP 38 0 STRESS: SOLDER BALL SHEAR CY8CMBR3255 (8F44302AC) 4443606 STRESS: TC COND. B -55C TO 125C, PRE COND 168 HRS 85C/85%RH, MSL1 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 500 77 0 CY8CMBR3255 (8F44302AC) 4443606 4443606 DT-Phils 1000 77 0 CY8CMBR3255 (8F44302AC) 4443673-01 4443673-01 DT-Phils 500 79 0 CY8CMBR3255 (8F44302AC) 4443673-01 4443673-01 DT-Phils 1000 77 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils 500 77 0 CY8CMBR3255 (8F44302AC) 4443606-8 4443606-8 DT-Phils 1000 77 0 CY8CMBR3255 (8F44302AC) 4443673-02 4443673-02 DT-Phils 500 80 0 CY8CMBR3255 (8F44302AC) 4443673-02 4443673-02 DT-Phils 1000 79 0 CY8CMBR3255 (8F44302AC) 4443606-11 4443606-11 DT-Phils 500 77 0 CY8CMBR3255 (8F44302AC) 4443606-11 4443606-11 DT-Phils 1000 77 0 CY8CMBR3255 (8F44302AC) 4443673-03 4443673-03 DT-Phils 500 79 0 CY8CMBR3255 (8F44302AC) 4443673-03 4443673-03 DT-Phils 1000 79 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.002-10504 Rev. ** ECN # 5072472 Document History Page Document Title: Document Number: Rev. ECN No. ** 5072472 QTP#152203: 16-Ball Wafer Level Chip Scale Package (WLCSP), 1.452x1.559 mm MSL1, 260C Deca Technologies (DT) - Philippines 002-10504 Orig. of Change HSTO Description of Change Initial spec release. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9