Document No.001-70520 Rev. *C ECN # 4450627 Cypress Semiconductor Package Qualification Report QTP# 112107 VERSION*C July, 2014 48 QFN (7X7X1.0 mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-70520 Rev. *C ECN # 4450627 PACKAGE QUALIFICATION HISTORY QTP Number 112107 Description of Qualification Purpose Qualification of 48QFN 7x7x1mm (LT48A, LT48C and LT48D) package dimensions at ASEKH (G) using G631 mold compound and EN-4900 epoxy Date Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-70520 Rev. *C ECN # 4450627 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT48A/ LT48C/LT48D Package Outline, Type, or Name: 48 Quad Flat No-Lead (7x7x1.0mm) Mold Compound Name/Manufacturer: G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69182 / 001-69181 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 28°C/W / 26.5°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 8 Document No.001-70520 Rev. *C ECN # 4450627 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) JEDEC STD 22-A110, 130 C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Result P/F P P P P P Ball Shear (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-70520 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112107 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 15 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 15 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 15 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 10 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 10 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 10 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 10 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 10 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 5 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 5 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 15 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 15 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 15 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 15 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 15 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8CLED16 (8C296662A) 4002605 611120871 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-70520 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112107 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN 128 77 0 STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 5 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 5 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN 168 77 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN 168 80 0 STRESS: PHYSICAL DIMENSION CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 30 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 30 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 30 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 3 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 3 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN 500 80 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN 1000 80 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN 500 77 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN 500 80 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN 1000 80 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN 200 80 0 CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN 1000 80 0 STRESS: THERMAL SHOCK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-70520 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112107 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8CLED16 (8C296662A) 4002605 611120871 G-TAIWAN COMP 15 0 CYWUSB6934 (7B6934B) 4038996 611120872 G-TAIWAN COMP 15 0 CY8C3866LTI (8C386612C) 4107346 611121241 G-TAIWAN COMP 15 0 Failure Mechanism STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-70520 Rev. *C ECN # 4450627 Document History Page Document Title: QTP 112107: 48QFN 7X7X1MM (LT48A, LT48C AND LT48D), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN 001-70520 Document Number: Rev. ECN No. ** 3283659 *A 3657926 Orig. of Change NSR NSR *B 4055318 JYF *C 4450627 JYF Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Added TCT1000 Cycles robustness readpoints. Remove version 1.0 in the QTP# in title page. Sunset Review: Deleted obsolete spec 001-69249 in Major Package Information table; Deleted revisions of ref. Jedec/Military standards in Reliability Tests Performed table. Revision changes from time to time. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8