Cypress Semiconductor Package Qualification Report QTP# 084701 VERSION 1.0 April 2009 24-Lead QFN (4 x 4 x 0.6mm) NiPdAu, MSL3, 260°C Reflow Carsem-Malaysia CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Rene Rodgers Reliability Engineer, MTS (408) 943-2732 Mira Ben-Tzur Quality Engineering Director (408) 943-2675 Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 2 of 8 April 2009 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 081801 Qualify 24-Lead QFN (4x4x0.6mm) NiPdAu, MSL3, 260C Reflow, using QMI-519 Epoxy and EME-G770H Mold Compound assembled at Carsem , Malaysia Apr 08 084701 Qualify Carsem-M for Large Die QFN24 4x4x0.6mm using Krypton S8 Technology (Active Circuit Under Pad, 50um scribe line width and 4um thick aluminum bond pad) using QMI-519 D/A, EME-G770H Mold Compound and NiPdAu Lead Finish @ MSL3 260C Reflow Mar 09 Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Mold Compound Flammability Rating: LQ24 24-lead Quad Flat No Lead (QFN) EME-G770H Sumitomo V-0 UL-94 Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI-519 Die Attach Method: Epoxy Bond Diagram Designation: 001-42700 Wire Bond Method: Thermosonic Wire Material/Size: Au/1.0mil Thermal Resistance Theta JA °C/W : 20.15 Package Cross Section Yes/No: N/A Assembly Process Flow: 001-11286 Name/Location of Assembly (prime) facility: Carsem, Malaysia (CA) MSL Level: 3 Reflow Profile: 260C Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R 084701 V. 1.0 Page 3 of 8 April 2009 Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 4 of 8 April 2009 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Electrostatic Discharge Charge Device Model (ESD-CDM) 500V Cypress Spec. 25-00020 Electrostatic Discharge Human Body Model (ESD-HBM) 2,200V MIL-STD-883, Method 3015 Result P/F P P JESD22, Method A114-E High Accelerated Saturation Test (HAST) 130°C, 5.25V, 85%RH Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs, 30°C/60%RH + 3IR-Reflow, 260°C+0, -5°C High Temp Storage 150C, no bias P Pressure Cooker 121°C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity MSL 3 P 192 Hrs, 30°C /60%RH + 3IR-Reflow, 260°C+0, -5°C Temperature Cycle MIL-STD-883C, Method 1010, Condition C, -65°C to -+ 150°C Precondition: JESD22 Moisture Sensitivity MSL3 192 Hrs 30°C/60%RH + 3IR-Reflow, 260°C+0, -5°C P Acoustic Microscopy Cypress Spec 25-00104 P Ball Shear Cypress Spec 12-00292 P Bond Pull Cypress Spec 12-00292 P Constructional Analysis Cypress Spec 25-20035 P Die Shear Cypress Spec 12-00292 P Dye Penetrant Test Cypress Spec 25-00046 P Final Visual Inspection Cypress Spec 12-00292 P Internal Visual Cypress Spec 12-00292 P Physical Dimension Cypress Spec 25-00031 P Resistance to Solvents Cypress Spec 25-00016 P Solderability Cypress Spec 25-00018 P Thermal Shock Cypress Spec 25-00014 P X-Ray MIL-STD-883-2012 P Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 5 of 8 April 2009 Reliability Test Data Device QTP #: 081801 Assy Lot # Assy Loc Duration Samp Fab Lot # Rej STRESS: ACOUSTIC CY8C20334 (8C20334AC) 4708780 610766941 CARSEM COMP 20 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM COMP 20 0 CY8C20334 (8C20334AC) 4708780 610766943 CARSEM COMP 20 0 4708780 610766941 CARSEM COMP 10 0 4708780 610766941 CARSEM COMP 10 0 4708780 610766941 CARSEM COMP 5 0 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM COMP 10 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM COMP 10 0 STRESS: BALL SHEAR CY8C20334 (8C20334AC) STRESS: BOND PULL CY8C20334 (8C20334AC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C20334 (8C20334AC) STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST CY8C20334 (8C20334AC) 4708780 610766941 CARSEM COMP 15 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM COMP 15 0 CY8C20334 (8C20334AC) 4708780 610766943 CARSEM COMP 15 0 CARSEM COMP 9 0 STRESS: ESD-CHARGE DEVICE MODEL, 500V CY8C21434 (8C214345AK) 5649020 610722728 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 2,200V CY8C21434 (8C214345AK) 5649020 610722728 CARSEM COMP 8 0 4708780 610766941 CARSEM COMP 45 0 STRESS: FINAL VISUAL CY8C20334 (8C20334AC) STRESS: HIGH TEMP STORAGE CY8C21434 (8C214345AK) 5649020 610722728 CARSEM 500 77 0 CY8C21434 (8C214345AK) 5649020 610722728 CARSEM 1000 77 0 STRESS: HI-ACCEL SATURATION TEST, (130C, 5.25V), 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM 128 77 0 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM COMP 5 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM COMP 5 0 STRESS: INTERNAL VISUAL Failure Mechanism Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 6 of 8 April 2009 Reliability Test Data QTP #: 081801 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej STRESS: PHYSICAL DIMENSIONS CY8C20334 (8C20334AC) 4708780 610766941 CARSEM COMP 30 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM 168 79 0 CY8C21434 (8C214345AK) 5649020 610722728 CARSEM COMP 3 0 CY8C21434 (8C214345AK) 5649020 610722737 CARSEM COMP 3 0 CY8C21434 (8C214345AK) 5649020 610726704 CARSEM COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM 500 80 0 CY8C20334 (8C20334AC) 4708780 610766941 CARSEM 1000 80 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM 500 80 0 CY8C20334 (8C20334AC) 4708780 610766942 CARSEM 1000 80 0 CY8C20334 (8C20334AC) 4708780 610766943 CARSEM 500 80 0 CY8C20334 (8C20334AC) 4708780 610766943 CARSEM 1000 80 0 CY8C21434 (8C21434AC) 4713533 610754433 CARSEM 200 80 0 CY8C21434 (8C21434AC) 4713533 610754433 CARSEM 1000 80 0 610766941 CARSEM COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY CY8C20334 (8C20334AC) 4708780 Failure Mechanism Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 7 of 8 April 2009 Reliability Test Data Device Fab Lot # QTP #: 084701 Assy Lot # Assy Loc Duration Samp Rej STRESS: ACOUSTIC CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM COMP 15 0 CY8C20366 (8C20366AC) 4835945 610848788 CARSEM COMP 15 0 CY8C20346 (8C20346AC) 4835945 610848781 CARSEM COMP 15 0 CY8C20366 (8C20366AC) 4815537 610838230 CARSEM COMP 10 0 CY8C20346 (8C20346AC) 4815537 610838231 CARSEM COMP 10 0 CY8C20366 (8C20366AC) 4815537 610838230 CARSEM COMP 10 0 CY8C20346 (8C20346AC) 4815537 610838231 CARSEM COMP 10 0 4836589 610854560 CARSEM COMP 5 0 4835945 610848785 CARSEM COMP 1 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8CTMG200 (8C20366AC) STRESS: CROSS SECTION CY8CTST200 (8C20366AC) STRESS: DYE PENETRANT TEST CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM COMP 15 0 CY8C20366 (8C20366AC) 4835945 610848788 CARSEM COMP 15 0 CY8C20346 (8C20346AC) 4835945 610848781 CARSEM COMP 15 0 STRESS: HI-ACCEL SATURATION TEST, (130C, 5.25V), 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 128 77 0 STRESS: HIGH TEMP STORAGE CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 500 77 0 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 1000 76 0 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM COMP 5 0 CY8C20366 (8C20366AC) 4835945 610848788 CARSEM COMP 5 0 CY8C20346 (8C20346AC) 4835945 610848781 CARSEM COMP 5 0 STRESS: INTERNAL VISUAL STRESS: PRESSURE COOKER TEST (121C, 100%RH), PRE COND 192HRS 30C/60%RH, MSL3 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 168 77 0 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 288 76 0 Failure Mechanism Cypress Semiconductor 24-Lead, QFN (4 x 4 x 0.6 mm) MSL3, 260C Reflow Assembly: Carsem-Malaysia 084701 V. 1.0 Page 8 of 8 April 2009 Reliability Test Data Device Fab Lot # QTP #: 084701 Assy Lot # Assy Loc Duration Samp Rej STRESS: TC COND. -65C TO 150 C, PRECONDITION 192 HRS 30C/60%RH, MSL3 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 500 77 0 CY8CTST200 (8C20366AC) 4835945 610848785 CARSEM 1000 77 0 CY8C20366 (8C20366AC) 4835945 610848788 CARSEM 500 77 0 CY8C20366 (8C20366AC) 4835945 610848788 CARSEM 1000 77 0 CY8C20346 (8C20346AC) 4835945 610848781 CARSEM 500 76 0 CY8C20346 (8C20346AC) 4835945 610848781 CARSEM 1000 76 0 4835945 610848785 CARSEM 200 77 0 CY8C20366 (8C20366AC) 4815537 610838230 CARSEM COMP 15 0 CY8C20346 (8C20346AC) 4815537 610838231 CARSEM COMP 15 0 STRESS: THERMAL SHOCK CY8CTST200 (8C20366AC) STRESS: X-RAY Failure Mechanism